AMC concerns have changed over time: what were chip makers and exposure tool OEMs concerned about 10 years ago and now, with 248nm, 193nm, and 192 immersion processes? In this video interview, Jürgen M Lobert, Ph.D., Entegris, discusses AMC tools and process protection in micro lithograhy.
Flametec fire-safe materials are formulated to exceed fire compliances for polymers in semiconductor, clean room, and other applications. Flametec is used for a variety of applications including tools, wet benches, cabinetry and furniture.
CHAD Industries developed wafer-handling capabilities for Sapphire wafers used in the LED market.
Christopher Wargo, Entegris, talks contamination control at 22nm and below. Lithography presents a suite of issues for contamination control. While the technology exists to confront new contaminants, commercialization is key.
Lockheed Martin (NYSE: LMT) opened new facilities at its Space Systems Company operations in Newtown, PA. The additions include more clean room space, demonstration areas, antenna range, and more.
(September 1, 2010) -- Military radio communications experts at the U.S. Defense Advanced Research Projects Agency (DARPA) in Arlington, Va., are asking industry to design extremely efficient monolithic signal-recognition integrated circuits (ICs) for next-generation military cognitive radio communications, radar, and electronic warfare.
Intel's lowered 3Q outlook was at least expected, if not overdue, according to analysts and market watchers, who break down the news and what it means for consumer technology markets and equipment/materials suppliers.
Another month, another record -- and more signs that the chip industry might be softening a bit.
Intel plans to purchase Infineon’s Wireless Solutions Business (WLS) in a cash transaction valued at approximately $1.4b. Infineon will subsequently focus on automotive, industry and security technologies. The acquisition expands Intel’s current Wi-Fi and 4G WiMAX offerings to include Infineon’s 3G capabilities and supports Intel’s plans to accelerate LTE.
Is Intel soon to be unseated as the world's top semiconductor maker? The numbers say it could happen in less than four years, according to IC Insights.
|
The Coolest Compounds
Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today’s electronic circuitry. ... Sponsored By:
Master Bond, Inc.,
|
|
Dual Channel Pulse Testing Simplifies RF Transistor Characterization
Device engineers and test managers are under tremendous pressure to make sure products get to market quickly and perform reliably. This is especially true of RF ... Sponsored By:
Keithley Instruments
|
|
3D STEM Tomography Based Failure Analysis of 45 nm CMOS Devices
Shrinking dimensions in new semiconductor process nodes make it harder to isolate and analyze certain classes of defects using the common "slice and view" ... Sponsored By:
FEI Company
|
|
High Precision Ion Beam Milling with Time of Flight Compensation
Advanced circuit editing (CE) becomes more and more difficult as semiconductor structures shrink. Time of Flight (ToF) compensation noticeably extends the utility ... Sponsored By:
FEI Company
|
|
Introducing Pulsing into Reliability Tests for Advanced CMOS Technologies
AC, pulsed stress is a useful addition to the typical stress-measure tests for investigating both semiconductor charge trapping and degradation behaviors. NBTI ... Sponsored By:
Keithley Instruments
|
|
Understanding Low Outgassing Adhesives
Applications that must meet stringent outgassing requirements now have more adhesive options than ever. If you suspect outgassing could potentially pose a problem ... Sponsored By:
Master Bond, Inc.,
|
