Toshiba and Elpida Memory are opening their wallets again to increase capacity as demand rises, and also keep pace with market-leading Samsung, according to a local report.
Intel and Numonyx say they have built a "vertically integrated" 64Mb test chip enabling stacking of multiple layers of phase-change memory (PCM) arrays within a single die, paving the way for devices that can scale well beyond conventional memory with more capacity, lower power consumption, and taking up less space.
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Dual Channel Pulse Testing Simplifies RF Transistor Characterization
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High Precision Ion Beam Milling with Time of Flight Compensation
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Backside Circuit Edit on Full-Thickness Silicon Devices
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