Brooks Automation's S.E. Syssoev et. al. summarize development of a new cryopump design for type II gases that prevents wafer contamination by uncontrolled intermittent pressure bursts inside the chamber, and also increases capacity by 50%.
Semiconductor, flat-panel display, solar manufacturing, and scientific instrumentation industries have driven recent developments in vacuum pumping technology and are likely to continue to do so. Edwards CTO Stephen Ormrod describes the future of vacuum technology and summarizes the design changes that will likely be needed.
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Dual Channel Pulse Testing Simplifies RF Transistor Characterization
Device engineers and test managers are under tremendous pressure to make sure products get to market quickly and perform reliably. This is especially true of RF ... Sponsored By:
Keithley Instruments
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High Precision Ion Beam Milling with Time of Flight Compensation
Advanced circuit editing (CE) becomes more and more difficult as semiconductor structures shrink. Time of Flight (ToF) compensation noticeably extends the utility ... Sponsored By:
FEI Company
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Backside Circuit Edit on Full-Thickness Silicon Devices
Backside Circuit Edit (CE) techniques, in which a Focused Ion Beam (FIB) operator accesses critical circuitry through the substrate of an IC, are popular with processor ... Sponsored By:
FEI Company
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Recent Developments in TEM Applications for the IC Industry
Scaling ICs to the 45-nanometer node or beyond requires precise measurement of film thickness, interfacial roughness, and chemical distribution. At those nodes, ... Sponsored By:
FEI Company
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A New Method of Wafer-Level Plan-View TEM Sample Preparation by DualBeam
Transmission electron microscopy (TEM) is extremely important for obtaining high-resolution images with high materials contrast. Until now, plan-view TEM samples ... Sponsored By:
FEI Company
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