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Targeting 22nm and beyond copper electroplating

Novellus VP/GM Sesha Varadarajan explains how the company's new Sabre Excel tool uses "state-of-the-art" millisecond control, dynamic current modulation, a low-corrosion electrolyte, and redesigned wafer handling to provide fill and defect density performance for the 22nm technology node.

Semiconductors Featured Articles

High-capacity cryopump for critical semiconductor process applications

Brooks Automation's S.E. Syssoev et. al. summarize development of a new cryopump design for type II gases that prevents wafer contamination by uncontrolled intermittent pressure bursts inside the chamber, and also increases capacity by 50%.

Semiconductors Featured Articles

Making E-beam direct write faster

E-beam direct-write lithography has the potential to enable maskless production for systems-on-chip at leading-edge technology nodes. Advantest and D2S describe their work that yielded a 4× increase in the number of characters available on EBDW stencil masks, a key factor in achieving the throughput increase needed to make maskless SoCs practical.

Semiconductors Featured Articles

COO benefits in manufacturing mobile displays with steppers

Frank Bok Namgun and Philippe Cochet from Azores discuss the various cost-of-ownership merits of steppers vs. scanners in photolithography for flat-panel displays, including capital equipment and mask costs.

Semiconductors Featured Articles

Pressure control for reduced microbubble formation

Microbubbles in leading-edge photoresist materials can distort the exposure pattern and affect yield, sometimes even if proper steps are taken. Entegris' Jennifer Braggin discusses results of a study in which positive pressure applied on the chemistry before the dispense nozzle reduces microbubbles in top anti-reflective coating (TARC).

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Want to get greener? New fab EHS benchmark tool debuts (Nov 20, 2009)

Researchers at the Department of Energy's Lawrence Berkeley National Labs have come up with a tool to gauge a semiconductor facility's energy and water consumption, and compare against similar facilities, to identify areas of improvement -- all toward the pursuit of a "greener" industry.

WSTS sees better chip sales in 2010, 2011 (Nov 20, 2009)

Things have picked up dramatically in the past few months, according to World Semiconductor Trade Statistics (WSTS) organization, which has hiked its outlook for various chip industry segments -- not just in 2010 but 2011 as well.

Good news in chip tool demand -- with a caveat (Nov 20, 2009)

The good news continues to shine in semiconductor equipment demand for suppliers in North America and Japan, according to the latest monthly data from SEMI and the SEAJ, though some softness may warrant some attention heading into the holiday season.

Brewer Science issued polymer, wet-developable patents (Nov 20, 2009)

Brewer Science says its high-transparency, highly conductive coatings utilize a photopolymer and an electrically conductive polymer dispersed in a solvent system. These new compositions, says the company, can be applied to a variety of substrates.

Reports: Hynix creditors seeking alternative sale after Hyosung exit (Nov 19, 2009)

With the pullout of proposed investor Hyosung Corp., creditors of Hynix Semiconductor are still looking to push ahead with a sale, though the clock may be ticking, according to local reports.

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Advance Nanotech Reports Third Quarter 2009 Financial Results (Nov 20, 2009)
Advance Nanotech, Inc. (OTCBB: AVNA) reports financial results this week for the three months ended September 30, 2009.

LDK Solar completes sale of stake in Chinese plant (Nov 20, 2009)
NEW YORK - LDK Solar Co. Ltd., a Chinese maker of parts for solar cells, on Friday said it completed the sale of a 15 percent ownership stake in a polysilicon plant in China for about $219 million.

Sono-Tek Announces Inroads with Major Advanced Energy Customers (Nov 20, 2009)
MILTON, N.Y., Nov. 20 /PRNewswire-FirstCall/ -- Sono-Tek Corporation (OTC Bulletin Board: SOTK) embarked on a strategic growth program last year with the goal of becoming the world leader of ultrasonic coating systems for energy applications, such as fuel cells and solar cells.

Toshiba to set up joint venture in China for chip assembly (Nov 20, 2009)
Nov. 20--TOKYO -- Toshiba Corp. said Friday it will set up a joint venture in China in April and transfer its Chinese subsidiary's semiconductor assembly operation to the venture as a cost-cutting measure.

Research and Markets: Level Sensors - A Worldwide Market Review (Nov 20, 2009)
Research and Markets (http://www.researchandmarkets.com/research/0290d1/level_sensors_a) has announced the addition of the "Level Sensors - A Worldwide Market Review" report to their offering.

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IMEC?s Ludo Deferm provides a look behind some major announcements the consortium made at SEMICON West: laser anneal over spike anneal, EUV mask cleaning, RuTa metallization showing promise for 22nm PVD.; 22nm; anneal; deferm; EUV; IMEC; Lithography; pvd; SEMICON West; Silicon Genesis president & CEO Francois Henley showcases the company's 20µm kerf-free foil, which is particularly well-suited to BiPV applications and capable of being made into solar cells with 20% efficiency.; BIPV; Henley; kerf; photovoltaic; SEMICON West; SiGen; Silicon Genesis; solar; wafer; The main theme at this year's NCCAVS Junction Technology Group meeting will be 22nm junction, which many believe this will be the first node to use msec-only annealing (i.e. diffusionless), according to meeting chair John O. Borland.; 16nm; 22nm; 32nm; anneal; Borland; diffusion; Junction; millisecond; SEMICON West; Ric Borges of Synopsys discusses the application of TCAD simulation to multijunction and CPV solar cells.; borges; photovoltaics; PV; SEMICON West; solar; Synopsys; Jeff Hebb of Ultratech discusses extending laser spike annealing to the 22nm node, previewing a talk at the NCCAVS Junction Technology Group meeting held Thursday, July 16 in San Francisco.; anneal; Junction; SEMICON West; Ultratech; video; Paul Siblerud of Semitool discusses 3D integration challenges and announces the latest news from the EMC-3D Consortium.; 3d; packaging; SEMICON West; Semitool; Sibelrud; Jan Vardaman discusses alternatives to 3D/TSV technologies for cost-sensitive applications, and makes the case for additional work to develop design guidelines and software, and test methodologies for 3D/TSV technologies.; 3d; SEMICON West; Techsearch; through-silicon via; TSV; Vardaman; Soitec's president and CEO, André-Jacques Auberton-Hervé, discusses the three pillars of 3D integration at the wafer level, as well as bonding at room temperature.; 3d; SEMICON West; Soitec; wafer bonding; On a cost/Watt basis, thin-film solar PV is potentially very attractive, notes Linx Consulting's Mark Thirsk. If the technical challenges are solved, he's bullish that thin-film may take over a 30% share of the market.; Intersolar; materials; SEMICON West; solar photovoltaics; thin-film; thirsk; SEMATECH's Bryan Rice gives a positive assessment of EUV and offers hope for getting companies to open their checkbooks for mask inspection infrastructure funding.; electronics; equipment; EUV; Lithography; manufacturing; new technology; SEMATECH; SEMICON West; Bill McClean, president of IC Insights, talks about the rebound of the semiconductor industry in 2009, and his expectations of double digit growth in 2010 and 2011.; B.J. Han, chief technology officer of STATS ChipPAC talks about trends in advanced packaging technology. ; Confab; HAN; packaging; STATS ChipPAC; ElectroIQ brings you informative video content from Solid State Technology, Photovoltaics World, Advanced Packaging, Small Times and Surface Mount Technology.

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