Solid State Technology - Semiconductor Manufacturing Industry News covering Semiconductor Manufacturing Equipment, Process, Services
Semiconductors Featured Articles
Controlling AMCs in semiconductor and LCD fabs

Researchers from Taiwan's ITRI, Winbond Electronics, and TPO Displays discuss case scenarios and follow-up procedures for mitigating airborne molecular contaminants (AMC) -- and improving yields -- in semiconductor and TFT-LCD manufacturing environments.

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Semiconductors Featured Articles
Melt LSA at sub-16nm, readying move to FinFETs

Ultratech execs Art Zafiropoulo and Jeff Hebb update SST on the status of laser-spike anneal (LSA) technology: readiness for 32nm, extendibility to 22nm, and evaluation for 16nm and beyond.

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Semiconductors Featured Articles
High-capacity cryopump for critical semiconductor process applications

Brooks Automation's S.E. Syssoev et. al. summarize development of a new cryopump design for type II gases that prevents wafer contamination by uncontrolled intermittent pressure bursts inside the chamber, and also increases capacity by 50%.

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Semiconductors Featured Articles
COO benefits in manufacturing mobile displays with steppers

Frank Bok Namgun and Philippe Cochet from Azores discuss the various cost-of-ownership merits of steppers vs. scanners in photolithography for flat-panel displays, including capital equipment and mask costs.

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Semiconductors Featured Articles
Targeting 22nm and beyond copper electroplating

Novellus VP/GM Sesha Varadarajan explains how the company's new Sabre Excel tool uses "state-of-the-art" millisecond control, dynamic current modulation, a low-corrosion electrolyte, and redesigned wafer handling to provide fill and defect density performance for the 22nm technology node.

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Semiconductors Current Articles
SIA bumps up 2009-2011 forecasts (Nov 5, 2009)

Betting on the continued impetus of an improving global economy, the Semiconductor Industry Association (SIA) has raised its previous outlook for semiconductor sales over the next three years, with a significantly better view on 2009.

Mentor tips plans for unified Si test, yield analysis (Nov 3, 2009)

Mentor Graphics is launching what it calls a comprehensive test and yield analysis platform incorporating homegrown and acquired technologies, to help customers drill down through failure analysis data to better identify defects and fix them, thus saving time and improving yields.

Targeting 22nm and beyond copper electroplating (Nov 2, 2009)

Novellus VP/GM Sesha Varadarajan explains how the company's new Sabre Excel tool uses "state-of-the-art" millisecond control, dynamic current modulation, a low-corrosion electrolyte, and redesigned wafer handling to provide fill and defect density performance for the 22nm technology node.

SIA: Chips a $20B/mo industry again, ahead of forecasts (Nov 2, 2009)

Yet more incoming signs that the chip industry is back on the recovery track: the SIA's latest monthly data shows a big push in September, and the group says chip sales are on pace to beat its midyear forecast.

COO benefits in manufacturing mobile displays with steppers (Nov 2, 2009)

Frank Bok Namgun and Philippe Cochet from Azores discuss the various cost-of-ownership merits of steppers vs. scanners in photolithography for flat-panel displays, including capital equipment and mask costs.

Wire News
OPEL Solar, Inc. Awarded Treasury Payment Under American Recovery & Reinvestment Act (Nov 5, 2009)
OPEL Solar, Inc., a leading global developer and supplier of high concentration photovoltaic ("HCPV") and other solar products, including ground-based and rooftop tracker systems today announced that it had been awarded a $179,000 payment under the U.S. Department of Energy and the U.S. Treasury Department program which will provide up to $3 billion in direct payments to companies that create and place in service renewable energy facilities.
Research and Markets: Nanotech: Making Photovoltaics Possible (Nov 5, 2009)
Research and Markets (http://www.researchandmarkets.com/research/f15026/nanotech_making_p) has announced the addition of the "Nanotech: Making Photovoltaics Possible" report to their offering.
Elpida posts operating profit in July-Sept. for 1st time in 8 qtrs (Nov 5, 2009)
Nov. 5--TOKYO -- Elpida Memory Inc. said Thursday it posted an operating profit in the July-September quarter for the first time in eight quarters on increased demand for semiconductor chips due to a recovery in sales of personal computers.
Tegal Completes ProNova ICP Process Suite Rollout for Silicon DRIE (Nov 5, 2009)
Tegal Corporation, (Nasdaq:TGAL) an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, today announced that its full process portfolio for silicon DRIE applications has been made available for the new ProNova ICP source.
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    Semiconductors Events
    Productronica - 18th International Trade Fair for Electronics Manufacturing
    Messe Munchen, Munich , Germany
    November 09, 2009
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    SEMICON Japan
    Chiba , Japan
    December 02, 2009
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    Semiconductors Videos
    IMEC?s Ludo Deferm provides a look behind some major announcements the consortium made at SEMICON West: laser anneal over spike anneal, EUV mask cleaning, RuTa metallization showing promise for 22nm PVD.; 22nm; anneal; deferm; EUV; IMEC; Lithography; pvd; SEMICON West; Silicon Genesis president & CEO Francois Henley showcases the company's 20µm kerf-free foil, which is particularly well-suited to BiPV applications and capable of being made into solar cells with 20% efficiency.; BIPV; Henley; kerf; photovoltaic; SEMICON West; SiGen; Silicon Genesis; solar; wafer; The main theme at this year's NCCAVS Junction Technology Group meeting will be 22nm junction, which many believe this will be the first node to use msec-only annealing (i.e. diffusionless), according to meeting chair John O. Borland.; 16nm; 22nm; 32nm; anneal; Borland; diffusion; Junction; millisecond; SEMICON West; Ric Borges of Synopsys discusses the application of TCAD simulation to multijunction and CPV solar cells.; borges; photovoltaics; PV; SEMICON West; solar; Synopsys; Jeff Hebb of Ultratech discusses extending laser spike annealing to the 22nm node, previewing a talk at the NCCAVS Junction Technology Group meeting held Thursday, July 16 in San Francisco.; anneal; Junction; SEMICON West; Ultratech; video; Paul Siblerud of Semitool discusses 3D integration challenges and announces the latest news from the EMC-3D Consortium.; 3d; packaging; SEMICON West; Semitool; Sibelrud; Jan Vardaman discusses alternatives to 3D/TSV technologies for cost-sensitive applications, and makes the case for additional work to develop design guidelines and software, and test methodologies for 3D/TSV technologies.; 3d; SEMICON West; Techsearch; through-silicon via; TSV; Vardaman; Soitec's president and CEO, André-Jacques Auberton-Hervé, discusses the three pillars of 3D integration at the wafer level, as well as bonding at room temperature.; 3d; SEMICON West; Soitec; wafer bonding; On a cost/Watt basis, thin-film solar PV is potentially very attractive, notes Linx Consulting's Mark Thirsk. If the technical challenges are solved, he's bullish that thin-film may take over a 30% share of the market.; Intersolar; materials; SEMICON West; solar photovoltaics; thin-film; thirsk; SEMATECH's Bryan Rice gives a positive assessment of EUV and offers hope for getting companies to open their checkbooks for mask inspection infrastructure funding.; electronics; equipment; EUV; Lithography; manufacturing; new technology; SEMATECH; SEMICON West; Bill McClean, president of IC Insights, talks about the rebound of the semiconductor industry in 2009, and his expectations of double digit growth in 2010 and 2011.; B.J. Han, chief technology officer of STATS ChipPAC talks about trends in advanced packaging technology. ; Confab; HAN; packaging; STATS ChipPAC; ElectroIQ brings you informative video content from Solid State Technology, Photovoltaics World, Advanced Packaging, Small Times and Surface Mount Technology.
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    Hosted by RenewableEnergyWorld.com and moderated by Chief Editor of Renewable Energy World Magazine, Jackie Jones, this PV manufacturing-focused webcast will cover ...
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    RF and higher power transistors suffer from self-heating and/or trapping effects. These effects, also called dispersion, result in a non-linear response at higher ...
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    Atomic Layer Deposition (ALD)
    The webcast will focus on issues surrounding Flash (NAND and NOR) technologies that could be addressed by atomic layer deposition (ALD) as the industry transitions ...
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    Semiconductors White Papers

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    Dual Channel Pulse Testing Simplifies RF Transistor Characterization
    Device engineers and test managers are under tremendous pressure to make sure products get to market quickly and perform reliably. This is especially true of RF ...
    Sponsored By:  Keithley Instruments
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    Advanced circuit editing (CE) becomes more and more difficult as semiconductor structures shrink. Time of Flight (ToF) compensation noticeably extends the utility ...
    Sponsored By:  FEI Company
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    Backside Circuit Edit (CE) techniques, in which a Focused Ion Beam (FIB) operator accesses critical circuitry through the substrate of an IC, are popular with processor ...
    Sponsored By:  FEI Company
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