Military microelectronics experts at the US Defense Advanced Research Projects Agency (DARPA) are launching a leap-ahead technology program to develop advanced, ultralow-power non-volatile logic ICs that retain their data and computational states when power is removed.
A year after calling a new deal with TSMC to make some of its Atom processors "an important step in a long-term strategic technology cooperation", that partnership apparently has floundered -- and it's a good example of the complex battles the top chipmaker is trying to fight, according to one analyst.
The light-emitting diode (LED) market has gone through two cycles of major growth, but an even bigger "third cycle" based on super-efficient lighting looms ahead, reports SST's Bob Haavind from a recent SEMI breakfast at Teradyne near Boston on March 10. And the wide range of problems to be tackled will make it an attractive target for those now in the semiconductor processing markets.
Checks into key chipmakers in Korea and Taiwan suggest current demand for equipment is still on the rise, with planned capex increases imminent and capacities set to increase into 2011, according to one industry analyst.
Showa Denko says it will spend ¥200M for a new JV in China to supply photoresist solvent for domestic manufacturers of semiconductors and LCD panels, expanding its business in Asia outside Japan.
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Explore products and services for the semiconductor industry in the Solid State Technology Resource Guide.
From the SPIE Advanced Lithography Conference, listen to experts tell SST about their advances in lithography, resists, metrology and design. Tune in to these exclusive podcasts now!
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Dual Channel Pulse Testing Simplifies RF Transistor Characterization
Device engineers and test managers are under tremendous pressure to make sure products get to market quickly and perform reliably. This is especially true of RF ... Sponsored By:
Keithley Instruments
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High Precision Ion Beam Milling with Time of Flight Compensation
Advanced circuit editing (CE) becomes more and more difficult as semiconductor structures shrink. Time of Flight (ToF) compensation noticeably extends the utility ... Sponsored By:
FEI Company
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Backside Circuit Edit on Full-Thickness Silicon Devices
Backside Circuit Edit (CE) techniques, in which a Focused Ion Beam (FIB) operator accesses critical circuitry through the substrate of an IC, are popular with processor ... Sponsored By:
FEI Company
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Recent Developments in TEM Applications for the IC Industry
Scaling ICs to the 45-nanometer node or beyond requires precise measurement of film thickness, interfacial roughness, and chemical distribution. At those nodes, ... Sponsored By:
FEI Company
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A New Method of Wafer-Level Plan-View TEM Sample Preparation by DualBeam
Transmission electron microscopy (TEM) is extremely important for obtaining high-resolution images with high materials contrast. Until now, plan-view TEM samples ... Sponsored By:
FEI Company
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