X-Fab says it has come up with an embedded nonvolatile memory process that combines the benefits of quickly accessible SRAM with nonvolatile data retention of EEPROM or flash memory, achieving same or better functionality using significantly less chip area.
Crossing Automation says it is riding a wave generated in part by last year's acquisition of Asyst's frontend component technologies, with multiple new design wins and repeat business, says top exec Robert MacKnight.
Entegris execs summarize two poster papers from the SPIE Advanced Lithography Conference that covered the company's methods to detect ppt levels of trimethylsilanol (TMS), and evaluating microbridging defects in which 5nm filtration was compared to 3nm filtration levels.
Elpida Memory reportedly is purchasing Spansion's NAND flash memory operations, with the goal to produce modules that package DRAM and flash memory targeting mobile devices such as smart phones, according to multiple reports.
Last week's 6.4-magnitude earthquake in Taiwan caused some emergency evacuations and shutdowns among the island's electronics manufacturing sector, with the biggest impact so far seeming to be in the LCD manufacturing sector.
 | | |
|
|
|
Explore products and services for the semiconductor industry in the Solid State Technology Resource Guide.
From the SPIE Advanced Lithography Conference, listen to experts tell SST about their advances in lithography, resists, metrology and design. Tune in to these exclusive podcasts now!
|
Dual Channel Pulse Testing Simplifies RF Transistor Characterization
Device engineers and test managers are under tremendous pressure to make sure products get to market quickly and perform reliably. This is especially true of RF ... Sponsored By:
Keithley Instruments
|
|
High Precision Ion Beam Milling with Time of Flight Compensation
Advanced circuit editing (CE) becomes more and more difficult as semiconductor structures shrink. Time of Flight (ToF) compensation noticeably extends the utility ... Sponsored By:
FEI Company
|
|
Backside Circuit Edit on Full-Thickness Silicon Devices
Backside Circuit Edit (CE) techniques, in which a Focused Ion Beam (FIB) operator accesses critical circuitry through the substrate of an IC, are popular with processor ... Sponsored By:
FEI Company
|
|
Recent Developments in TEM Applications for the IC Industry
Scaling ICs to the 45-nanometer node or beyond requires precise measurement of film thickness, interfacial roughness, and chemical distribution. At those nodes, ... Sponsored By:
FEI Company
|
|
A New Method of Wafer-Level Plan-View TEM Sample Preparation by DualBeam
Transmission electron microscopy (TEM) is extremely important for obtaining high-resolution images with high materials contrast. Until now, plan-view TEM samples ... Sponsored By:
FEI Company
|
