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Semiconductors Featured Articles
CEA-Leti debuts low-power reconfigurable multicore chip for software-defined radio, cognitive radio

CEA-Leti developed a digital baseband circuit for software-defined-radio and cognitive-radio applications that features <50µs for full reconfiguration and multi-applications support.

Semiconductors Featured Articles
DUV inspection and defect origin analysis for 22nm spacer self-aligned double-patterning

AMAT developed a methodology to systematically trace the sources of SADP patterning defects by scanning the wafers through consecutive process steps, followed by SEM defect review to identify the major defect types at each step.

Semiconductors Featured Articles
Improving etch performance using in situ gas flow monitoring and control

Mukund Venkatesh, et al, Pivotal Systems and Kevin Boyd, IBM, say that semiconductor fabs can improve etch equipment performance through in situ gas flow monitoring and control.

Semiconductors Featured Articles
McPherson intros vacuum UV spectrometer with Pt-coated gratings

McPherson vacuum UV spectrometer Model 234/302 is now available with improved efficiency over a wide wavelength range. New platinum-coated gratings suit use at windowless wavelengths, shorter than 120nm (>10eV).

Semiconductors Featured Articles
SEMICON West meeting shares semi market insights

The "2010 Market & Technology Update" included a keynote from analyst Bill McClean. Wish you could have made it? Here are some of the key points expressed by speaker Bill McClean, as well as a video interview with McClean to summarize.

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    August 17, 2010
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    De Montfort University, Leicester, UK
    September 15, 2010
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    October 03, 2010
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    Semiconductors Videos
    IMEC?s Ludo Deferm provides a look behind some major announcements the consortium made at SEMICON West: laser anneal over spike anneal, EUV mask cleaning, RuTa metallization showing promise for 22nm PVD.; 22nm; anneal; deferm; EUV; IMEC; Lithography; pvd; SEMICON West; Silicon Genesis president & CEO Francois Henley showcases the company's 20µm kerf-free foil, which is particularly well-suited to BiPV applications and capable of being made into solar cells with 20% efficiency.; BIPV; Henley; kerf; photovoltaic; SEMICON West; SiGen; Silicon Genesis; solar; wafer; The main theme at this year's NCCAVS Junction Technology Group meeting will be 22nm junction, which many believe this will be the first node to use msec-only annealing (i.e. diffusionless), according to meeting chair John O. Borland.; 16nm; 22nm; 32nm; anneal; Borland; diffusion; Junction; millisecond; SEMICON West; Ric Borges of Synopsys discusses the application of TCAD simulation to multijunction and CPV solar cells.; borges; photovoltaics; PV; SEMICON West; solar; Synopsys; Jeff Hebb of Ultratech discusses extending laser spike annealing to the 22nm node, previewing a talk at the NCCAVS Junction Technology Group meeting held Thursday, July 16 in San Francisco.; anneal; Junction; SEMICON West; Ultratech; video; Paul Siblerud of Semitool discusses 3D integration challenges and announces the latest news from the EMC-3D Consortium.; 3d; packaging; SEMICON West; Semitool; Sibelrud; Jan Vardaman discusses alternatives to 3D/TSV technologies for cost-sensitive applications, and makes the case for additional work to develop design guidelines and software, and test methodologies for 3D/TSV technologies.; 3d; SEMICON West; Techsearch; through-silicon via; TSV; Vardaman; Soitec's president and CEO, André-Jacques Auberton-Hervé, discusses the three pillars of 3D integration at the wafer level, as well as bonding at room temperature.; 3d; SEMICON West; Soitec; wafer bonding; On a cost/Watt basis, thin-film solar PV is potentially very attractive, notes Linx Consulting's Mark Thirsk. If the technical challenges are solved, he's bullish that thin-film may take over a 30% share of the market.; Intersolar; materials; SEMICON West; solar photovoltaics; thin-film; thirsk; SEMATECH's Bryan Rice gives a positive assessment of EUV and offers hope for getting companies to open their checkbooks for mask inspection infrastructure funding.; electronics; equipment; EUV; Lithography; manufacturing; new technology; SEMATECH; SEMICON West; Bill McClean, president of IC Insights, talks about the rebound of the semiconductor industry in 2009, and his expectations of double digit growth in 2010 and 2011.; B.J. Han, chief technology officer of STATS ChipPAC talks about trends in advanced packaging technology. ; Confab; HAN; packaging; STATS ChipPAC; ElectroIQ brings you informative video content from Solid State Technology, Photovoltaics World, Advanced Packaging, Small Times and Surface Mount Technology.
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    SST Coverage of SEMICON West 2010
    Solid State Technology Coverage of SEMICON West 2010Make sure to check out Solid State Technology's daily coverage of SEMICON West 2010, taking place July 13-15 in San Francisco. We'll have loads of news, video, podcasts and highlights from the show.


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