Things have picked up dramatically in the past few months, according to World Semiconductor Trade Statistics (WSTS) organization, which has hiked its outlook for various chip industry segments -- not just in 2010 but 2011 as well.
The good news continues to shine in semiconductor equipment demand for suppliers in North America and Japan, according to the latest monthly data from SEMI and the SEAJ, though some softness may warrant some attention heading into the holiday season.
Brewer Science says its high-transparency, highly conductive coatings utilize a photopolymer and an electrically conductive polymer dispersed in a solvent system. These new compositions, says the company, can be applied to a variety of substrates.
With the pullout of proposed investor Hyosung Corp., creditors of Hynix Semiconductor are still looking to push ahead with a sale, though the clock may be ticking, according to local reports.
E-beam direct write lithography using character projection capability has the potential to enable maskless production for systems-on-chip at leading-edge technology nodes. Advantest and D2S describe their collaborative work that yielded a 4× increase in the number of characters available on EBDW stencil masks, a key factor in achieving the throughput increase needed to make maskless SoCs practical.
 | | |
|
|
|
Explore products and services for the semiconductor industry in the Solid State Technology Resource Guide.
ElectroIQ, the portal for electronics manufacturing, is the new home for Solid State Technology (semiconductors), Photovoltaics World (photovoltaics), Advanced Packaging (packaging), Small Times (nanotech/MEMS) and SMT (surface mount technology). To learn more about ElectroIQ, read the press release.
|
Dual Channel Pulse Testing Simplifies RF Transistor Characterization
Device engineers and test managers are under tremendous pressure to make sure products get to market quickly and perform reliably. This is especially true of RF ... Sponsored By:
Keithley Instruments
|
|
High Precision Ion Beam Milling with Time of Flight Compensation
Advanced circuit editing (CE) becomes more and more difficult as semiconductor structures shrink. Time of Flight (ToF) compensation noticeably extends the utility ... Sponsored By:
FEI Company
|
|
Backside Circuit Edit on Full-Thickness Silicon Devices
Backside Circuit Edit (CE) techniques, in which a Focused Ion Beam (FIB) operator accesses critical circuitry through the substrate of an IC, are popular with processor ... Sponsored By:
FEI Company
|
