Entegris execs summarize two poster papers from the SPIE Advanced Lithography Conference that covered the company's methods to detect ppt levels of trimethylsilanol (TMS), and evaluating microbridging defects in which 5nm filtration was compared to 3nm filtration levels.
Elpida Memory reportedly is purchasing Spansion's NAND flash memory operations, with the goal to produce modules that package DRAM and flash memory targeting mobile devices such as smart phones, according to multiple reports.
Last week's 6.4-magnitude earthquake in Taiwan caused some emergency evacuations and shutdowns among the island's electronics manufacturing sector, with the biggest impact so far seeming to be in the LCD manufacturing sector.
Based on talks and presentations from the SPIE Advanced Lithography Conference, the future for IC manufacturing is still very much unclear, writes Griff Resor. How close is optical litho to finally reaching its limits? Has the time has come to switch to a replacement technology like EUV, and what still needs to be accomplished?
The biggest chipmaker spenders are taking an extra few crumbs from the capex pie plate in 2010, spending far more than the industry average -- but in the end IC prices will still go up and shortages will happen before the year is through, according to IC Insights.
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Explore products and services for the semiconductor industry in the Solid State Technology Resource Guide.
From the SPIE Advanced Lithography Conference, listen to experts tell SST about their advances in lithography, resists, metrology and design. Tune in to these exclusive podcasts now!
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Dual Channel Pulse Testing Simplifies RF Transistor Characterization
Device engineers and test managers are under tremendous pressure to make sure products get to market quickly and perform reliably. This is especially true of RF ... Sponsored By:
Keithley Instruments
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High Precision Ion Beam Milling with Time of Flight Compensation
Advanced circuit editing (CE) becomes more and more difficult as semiconductor structures shrink. Time of Flight (ToF) compensation noticeably extends the utility ... Sponsored By:
FEI Company
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Backside Circuit Edit on Full-Thickness Silicon Devices
Backside Circuit Edit (CE) techniques, in which a Focused Ion Beam (FIB) operator accesses critical circuitry through the substrate of an IC, are popular with processor ... Sponsored By:
FEI Company
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Recent Developments in TEM Applications for the IC Industry
Scaling ICs to the 45-nanometer node or beyond requires precise measurement of film thickness, interfacial roughness, and chemical distribution. At those nodes, ... Sponsored By:
FEI Company
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A New Method of Wafer-Level Plan-View TEM Sample Preparation by DualBeam
Transmission electron microscopy (TEM) is extremely important for obtaining high-resolution images with high materials contrast. Until now, plan-view TEM samples ... Sponsored By:
FEI Company
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