EDITORS' PICKS
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Tablet IC sales to rise 37% in 2013
06/18/2013
New market update shows integrated circuit revenues for tablets hitting $27 billion in 2016. |
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Producing cheaper and more flexible multiple thin crystalline silicon wafers
06/12/2013
A team of researchers has found a way to make the manufacture of crystalline silicon materials fa...
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DRAM market grows up
06/19/2013
Industry’s newfound maturity yields growth amid adversity. |
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Imec shows multiple enhancement options for next-generation finFETs
06/13/2013
Nano-electronics R&D center addresses key challenges of Germanium finFET technology...
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MAGAZINE
BLOGS
NEWS ANALYSIS & FEATURES
TowerJazz to service infrared markets
06/19/2013
Markets predicted by Maxtech International to reach >$5B by 2015. |
Researchers report quantum networking milestone
06/19/2013
Using clouds of ultra-cold atoms and a pair of lasers operating at optical wavelengths, researchers have reached a quantum network milestone: entangling light with an optical atomic cohere...
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SoC design cost analysis: Costs for higher complexity continue to rise
06/19/2013
Everywhere we turn we hear speakers give presentations at conferences and industry events despairing how the rise in silicon design costs is hampering the semiconductor industries growth p...
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Rockchip launches new tablet SoCs on GLOBALFOUNDRIES’ 28nm HKMG process technology
06/18/2013
The combination of Rockchip’s design and GLOBALFOUNDRIES’ 28nm HKMG process technology resulted in a mainstream tablet System-on-Chip (SoC) capable of operating at up to 1.8 GHz performanc...
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Market for hard drives in video surveillance to hit billion-dollar mark by 2017
06/18/2013
Revenue for both internal and external HDDs in video-surveillance applications will rise from $638.7 million this year to $1.0 billion by 2017, a remarkable 57 percent increase. |
Multitest VP to discuss quality in 3D assembly at SEMICON West
06/18/2013
Multitest’s James Quinn will present during the 2013 SEMICON West exhibition and conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. |
Imec presents 4K2K CMOS image sensor together with Panasonic
06/18/2013
The co-developed imager sensor chip targets high speed, high resolution imaging applications such as next generation HDTV. |
Displaybank releases new industry analysis of glass slimming market
06/18/2013
The glass slimming market topped $600 million in value in 2012 and is forecast to continuously grow to surpass $1 billion in 2014, according to a new report released by Displaybank. |
Shipments of NFC-enabled handsets grew 300 percent in 2012
06/17/2013
Global sales of handsets featuring Near Field Communication (NFC) grew 300 percent in 2012 to reach 140 million units, according to a new research report by Berg Insight. |
SEMATECH names William R. Rozich chairman of the board
06/17/2013
Rozich, who previously was a member of the company’s board, succeeds Michael R. Polcari, who served as chairman since November 2009. |
Samsung now mass producing industry’s first PCI-Express solid state drive
06/17/2013
Samsung announced today that it has begun mass producing the industry’s first PCI-Express (PCIe) solid state drive (SSD) for next-generation ultra-slim notebook PCs. |
SEMATECH to address critical supply chain challenges and more at SEMICON West 2013
06/17/2013
Through a series of lectures and workshops, SEMATECH will address R&D challenges and closing key infrastructure technology gaps from July 8–12 at SEMICON West in San Francisco, CA.
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EVG and Dynaloy develop single-wafer cleaning solution
06/17/2013
Single-wafer cleaning solution is suitable for 3D-IC/TSV, advanced packaging, MEMS and compound semiconductor applications. |
TSMC keynoter suggests WLSI at IITC
06/14/2013
In a keynote at the IEEE International Interconnect Technology Conference (IITC), Douglas Yu from TSMC talked about Moore’s Law scaling becoming increasingly difficult. |
VIDEOS
RECOMMENDED TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are interested in statistical analysis of volumes of high-quality diagnosis results...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent years, the ability to control package warpage –i.e. maintain a relative degree ...
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Automated Test Creation for Mixed Signal IP using IJTAG
The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embedded IP, the new IEEE P1687 standard 1 is being defined by a broad coalition of ...
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EVENTS
2013 IEEE 39th Photovoltaic Specialists Conference (PVSC)Tampa, Florida , United States
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The ConFab 2013Las Vegas, Nevada
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2013 Twentieth International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD)Kyoto, Japan , Japan
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WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL process steps. An additional challenge is t...
Sponsored by
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business development director, Lode Lauwers, on why 450mm ...
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FINANCIALS
NEW COMMENTS
STMicroelectronics is first $1 billion MEMS company
NEWLED aims to revolutionize the way the world is lit
$14 trillion opportunity in Internet of Things, predicts Cisco
NEW PRODUCTS
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All-in-one microscope for advanced imaging, recording and measurement
June 7, 2013
Building on its extensive microscope lineup, KEYENCE Corporation has released a new multipurpose microscope. |
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Olympus launches LEXT OLS4100 laser confocal microscope
June 7, 2013
New 3D measuring system offers auto brightness and high-speed stitching. |
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3M announces QDEF; to bring 50% more color to LCD devices
May 21, 2013
3M announced today it is in the final stages of scale-up for its new 3M Quantum Dot Enhancement Film (QDEF). The new film allow...
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FEATURED PRODUCTS
