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Bridging the fabless-foundry gap: Highlighted ConFab presentation
05/18/2012
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China's LED subsidy totals RMB2.2B
05/17/2012
Barclays Capital’s Asia IT analyst Jones Ku shares details of China's State Council’s subsidy pro...
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Lower DRAM prices enable more DRAM per smartphone without higher pricetag
05/18/2012
DRAM’ percentage of the cost of a smartphone is decreasing, even as DRAM usage in smart...
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Reducing mask write-time -- which strategy is best?
05/17/2012
A number of techniques have been developed to control mask write time by reducing shot ...
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ST claims InvenSense infringed on patents
05/18/2012
InvenSense Inc. (NYSE:INVN) says STMicroelectronics (ST, NYSE:STM) filed a complaint in the Northern District of California, alleging that InvenSense infringes 9 of ST’s patents. InvenSen...
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IC packaging substrates heading for $8.67B in 2012
05/18/2012
In 2012, the global IC substrate market will reach a value of USD8.67 billion, according to Research in China’s “Global and Chinese IC Substrate Industry Report, 2011-2012.” As IC operati...
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China’s LED production, consumption plans
05/18/2012
China has designated LEDs as one of the 7th emerging industries to be fostered in the Twelfth Five-year Plan. China is accelerating standardization plans, encouraging local production, an...
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Capex expectations update for TSMC, GLOBALFOUNDRIES, SMIC, UMC, more
05/18/2012
Barclays Capital updates its wafer fab/semiconductor production equipment (WFE/SPE) capital expenditures expectations for TSMC, Samsung, Intel, UMC, GLOBALFOUNDRIES, SMIC, and Huali. |
SEMICON West preview: Conference keynotes and "Extreme Electronics"
05/18/2012
SEMICON West is less than 2 months away, July 10-12 in San Francisco, CA. Plan your attendee schedule now with highlights from the Extreme Electronics “show within a show;” 4 strong keyno...
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JEDEC publishes LPDDR3 standard for low-power memory chips
05/17/2012
JEDEC Solid State Technology Association published the JESD209-3 LPDDR3 Low Power Memory Device Standard, targeting the performance and density demands of new-gen mobile devices. |
China's RMB26.5B household electrical appliances subsidy and LCD panel production
05/17/2012
Barclays Capital’s Jones Ku shares details of China's State Council’s RMB26.5 billion subsidy program for household electrical appliances. The program will be in effect for one...
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Semiconductor companies see increased venture capital funding in April
05/17/2012
In April 2012, venture investment dollars received by semiconductor companies was $194.2 million; a 901.0% increase M/M and 461.3% increase Y/Y, reports the Global Semiconductor Alliance ...
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Silicon Labs offers bare die from 1 wafer and up
05/16/2012
Mixed-signal IC maker Silicon Laboratories Inc. (NASDAQ: SLAB) introduced a microcontroller (MCU) die sales program with a minimum order quantity of 1 wafer. |
Gigaphoton opens Korean subsidiary for DUV, EUV lithography support
05/16/2012
Gigaphoton Inc., lithography light source manufacturer, began operations at its wholly owned subsidiary, Gigaphoton Korea Inc. Gigaphoton points to Korea as “one of the most important reg...
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Microsoft joins Hybrid Memory Cube Consortium
05/16/2012
The Hybrid Memory Cube Consortium (HMCC) is a collaboration developing and implementing an open interface standard for Hybrid Memory Cube semiconductor memory architectures. Microsoft Cor...
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Knowles tops 3B MEMS microphones shipped
05/16/2012
Knowles, micro acoustics and MEMS microphone maker, has shipped over 3 billion SiSonic MEMS microphones from the SiSonic MEMS microphone introduction in 2003. |
3M dual-brightness enhancement film enables PoE LED-backlit LCD
05/16/2012
3M Optical Systems Division enabled what is says is the “first all-in-one zero client capable of being powered by Type 1 power-over-Ethernet (PoE, IEEE 802.3af),” using 3M’s Dual Brightne...
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PVD Solutions for Next Generation MEMS and Sensors
As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with existing toolsets. The deposition and magnet...
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FREE WEBCAST: The Impact of Soldering Materials and Process on cSi Module Reliability
This presentation discuss how materials used in joining cSi solar cells, along with the process used, can have a significant impact on the electrical and mechanical reliability of the assembled mod...
Sponsored by
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Keeping Packages Cool and Reliability High
Ever-increasing functionality and ever-decreasing device footprints have presented semiconductor packaging manufacturers with quite a dilemma: how to manage the dimensional dema...
Sponsored by
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Enabling Thinner Packages through Novel Materials Innovations
According to a new industry report, thinned wafers will comprise the majority of wafers in the device market by 2016. (1) The study indicates that memory and logic chips will ac...
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