EDITORS' PICKS
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One quarter of all notebooks to ship with touchscreens by 2016
05/22/2013
Driven by falling prices and a major initiative from Intel Corp., shipments of touch-enabled mobi...
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Shrinking flat-panel TV market wrings out marginal growth in first quarter
05/21/2013
Bringing an end to a full year of declines, global flat-panel television shipments rose slightly ...
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IDC predicts semiconductor market to experience 3-4% revenue growth in 2013
05/22/2013
IDC expects the semiconductor market to return to growth in 2013 with revenues forecast...
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NSF and SRC to fund research to create failure-resistant systems and circuits
05/21/2013
Leaders of the National Science Foundation (NSF) and the Semiconductor Research Corpora...
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MAGAZINE
BLOGS
NEWS ANALYSIS & FEATURES
Innovation could bring flexible solar cells, transistors, displays
05/22/2013
Researchers have created a new type of transparent electrode that might find uses in solar cells, flexible displays for computers and consumer electronics and future "optoelectronic&q...
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Solid-state lighting expert Bernhard Stapp named to board of Aledia
05/22/2013
Aledia today announced that solid-state lighting (SSL) industry veteran Dr. Bernhard Stapp has joined its board of directors. |
Four-junction solar cell achieves 43.6% efficiency
05/22/2013
Soitec announced the PV industry’s first four-junction solar cell device, which uses two dual-junction sub cells grown on different III-V compound materials, which allows optimal ban...
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Invensas demos new high bandwidth packaging solution for mobile devices at 2013 ECTC
05/22/2013
Invensas Corporation, a subsidiary of Tessera Technologies, Inc., will showcase its latest mobility solution, an ultra-high bandwidth Bond Via Array (BVATM) Package-on-Package (PoP) produc...
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AMOLED displays to have major influence on innovation in the cloud computer era
05/22/2013
During the keynote speech, Kim said that the future of displays will change considerably, with special attention to be given for the virtually infinite number of imaging possibilities in A...
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North American semiconductor equipment industry posts April 2013 book-to-bill ratio of 1.08
05/22/2013
North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to-bill ratio of 1.08. |
Eleven companies move up in Q1’13 top 20 semi supplier ranking
05/21/2013
Qualcomm, TSMC, and SK Hynix each register greater than 20 percent year-over-year growth. |
Mouser Electronics’ president and CEO celebrates 40 years of service
05/21/2013
In 1973, Pong was cutting edge in the world of video games, music came on eight-track tapes, TV viewing was limited to three networks and Glenn Smith was a college kid who went to work par...
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Qualcomm and Samsung pass AMD in MPU ranking
05/21/2013
Slow notebook and desktop PC sales and strong growth in mobile processors for smartphones and tablet PCs continues to lower Intel's marketshare as well. |
Toshiba to start mass production of next generation NAND flash memory
05/21/2013
Toshiba Corporation today announced that the company has developed second generation 19nm process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory ...
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Imec and GLOBALFOUNDRIES collaborate to advance high-density memory technology
05/21/2013
Imec and GLOBALFOUNDRIES announced today that they have expanded joint development efforts to advance STT-MRAM (spin-transfer torque magnetoresistive random access memory) technology. |
First quarter results for graphics chip shipments: Nvidia a clear winner but bad news for Intel
05/20/2013
Jon Peddie Research (JPR) announced estimated graphics chip shipments and suppliers’ market share for 2013 Q1. The news was disappointing for Intel, but encouraging for Nvidia and for AMD ...
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Mentor and Tezzaron optimize Calibre 3DSTACK for 2.5/3D-ICs
05/20/2013
Mentor Graphics Corp. and Tezzaron Semiconductor Corp. today announced they are collaborating to integrate the Mentor Calibre 3DSTACK product into Tezzaron’s 3D-IC offerings. |
Extending optical lithography; outlook for DSA
05/20/2013
This year’s SEMICON West front-end processing TechXPOTs on lithography and transistors below 20nm will provide critical updates on how technologists are coping with the next scaling challe...
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VIDEOS
RECOMMENDED TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are interested in statistical analysis of volumes of high-quality diagnosis results...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent years, the ability to control package warpage –i.e. maintain a relative degree ...
Sponsored by
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Automated Test Creation for Mixed Signal IP using IJTAG
The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embedded IP, the new IEEE P1687 standard 1 is being defined by a broad coalition of ...
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EVENTS
2013 25th International Conference on Indium Phosphate and Related Materials (IPRM)Kobe, Japan , Japan
+81-3-5452-5151
+81-3-5452-5156
May 19, 2013
- May 23, 2013
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2013 14th International Vaccuum Electronics Conference (IVEC)Paris, France , France
+31 71 565 6704
+31 71 565 4596
May 21, 2013
- May 23, 2013
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2013 IEEE EnergytechCleveland, OH , United States
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WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL process steps. An additional challenge is t...
Sponsored by
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business development director, Lode Lauwers, on why 450mm ...
Sponsored by
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FINANCIALS
NEW COMMENTS
STMicroelectronics is first $1 billion MEMS company
NEWLED aims to revolutionize the way the world is lit
$14 trillion opportunity in Internet of Things, predicts Cisco
NEW PRODUCTS
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3M announces QDEF; to bring 50% more color to LCD devices
May 21, 2013
3M announced today it is in the final stages of scale-up for its new 3M Quantum Dot Enhancement Film (QDEF). The new film allow...
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COMSOL Multiphysics 4.3b offers new additions to simulation platform
May 16, 2013
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...
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Spectra-Physics introduces industrial picosecond laser
May 10, 2013
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...
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FEATURED PRODUCTS
