EDITORS' PICKS

	MEMS for mobile electronics: Current and future devices to bring $6B+ by 2016 02/22/2012 Annual revenues generated by micro electro mechanical system (MEMS) devices built into mobile dev...
	Combo chipsets to suffer against new embedded WiFi chipsets 02/21/2012 Processors like Qualcomm’s Snapdragon will make an impact on future chip revenues, reports analys...

	Semiconductor inventory correction occurred, shows Gartner lead time analysis 02/21/2012 Semiconductor vendors had slow Q3 and Q4 revenues, indicating that the anticipated correction to ...
	The ultimate limit of Moore’s Law: The one-atom transistor 02/21/2012 A team of researchers at the University of New South Wales, Purdue University and the University ...

NEWS & FEATURES

ISSCC round-up: 2.5D packaging for IVRs, smallest NAND flash chip, more

02/22/2012 International Solid-State Circuits Conference (ISSCC) is going on now, gathering semiconductor design and device architecture presentations from research firms like imec to chip companies like IBM....

MIT's nanowire growth control method could optimize LEDs, other semiconductors

02/22/2012 MIT researchers used gases to precisely control nanowires' width and composition as they grow, which could yield complex structures optimally designed for particular applications, like LED substrat...

MEMS oscillators occupy 1% of timing market, but lure more makers

02/22/2012 MEMS oscillators represent <1% of the total ($6.3b) timing market, but that hasn't stopped new makers from entering the MEMS oscillator market, with even more on their way, says Semico.

Chip substrate factory begins producing thermal-control substrates in Russia

02/22/2012 MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at ...

Present at ESTC 2012 in Amsterdam

02/21/2012 Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assem...

Apple tips plans for 20MW solar site at NC data farm

02/21/2012 An updated Apple environmental report reveals more details about the company's renewable energy plans for its new 500,000sq.ft. data center in Maiden, North Carolina -- including a surprisingly lar...

IRPS set for April in Anaheim

02/21/2012

The IEEE International Reliability Physics Symposium (IRPS) is set for April 15, 2012 – April 19, 2012, in Anaheim, CA.

CEA-Leti demos optical modulator in silicon with 40Gbit/s capabilities

02/21/2012

CEA-Leti unveiled a 40Gbit/s optical modulator in silicon with a record extinction ratio of 10dB, developed by the HELIOS Project members.

SUSS brings GenISys lithography simulation software onto mask aligners

02/21/2012 SUSS MicroTec will work with GenISys, provider of high-performance software solutions for nano scale fabrication, to combine the SUSS MicroTec mask aligner tools with the GenISys simulation softwar...

Amkor plans IMAPS Device Packaging keynote

02/21/2012 The 2012 IMAPS Device Packaging Conference will take place March 6-8 in Fountain Hills, AZ, with Amkor's Dr. Robert Darveaux presenting "Escalating Challenges in Developing Complex Solutions f...

More News & Features

BLOGS

WEBCASTS

FREE WEBCAST: Lens Tilt in Small Auto-Focus Cameras

This webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors.

FREE WEBCAST: Light and Color Measurement of Today's LED Technology

The seminar is an ideal fit for anyone interested in characterizing and communicating the light and color properties of LED’s accurately.

More Webcasts

WHITE PAPERS

Preventing the Destructive Potential of Partial Discharge on HV Optic Devices

The Partial Discharge phenomenon has been plaguing the electrical and electronic industries for many years, by damaging equipment and increasing production costs. In the case of...

Enabling Thinner Packages through Novel Materials Innovations

According to a new industry report, thinned wafers will comprise the majority of wafers in the device market by 2016. (1) The study indicates that memory and logic chips will ac...

Powering The Solar Revolution

Powering the Solar Revolution Resource CD Agilent powers the solar revolution with industry leading solutions and technical/application knowledge. Order Agilent’s Powering the S...

Measuring: The Key Component For Optimizing Your Solar Simulator

Measurement of a solar simulator is a very important task and should be completed at least every 3 months. Lamps and power outputs of simulators change over time which can lead ...