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Featured Articles
AMAT Eterna FCVD goes beyond SOD with bottoms up approach to C-free gap-fill: Interview

Applied Materials released Eterna flowable CVD technology. Ajay Bhatnagar explains how it differs from conventional CVD and how it is being applied to new device architectures such as DRAM vertical transistors, NAND vertical bit stacks, and FinFETs.

Featured Articles
Semiconductor inventories: Two analysts, both seem happy

Chip suppliers are reporting rising inventory, but the swelling stockpiles do not represent a cause for concern, with demand on the rise in coming months, says iSuppli. Inventory levels are more appropriately aligned with end-market demand, necessary given the level of under-shipment since 2HCY09, adds Gleacher & Company.

Featured Articles
Ranking the nations on nanotech

Lux Research's David Hwang sizes up the nanotech efforts in the US, Japan, China, and Russia, finding that varying levels of government support, corporate interest, and economic vitality are accelerating and hindering nanotech development and commercialization.

Featured Articles
CIGS solar cell research brings thin-film efficiency above 20%

Researchers from Germany's ZSW have developed a thin-film solar cell with +20% efficiency, bettering their own record. The CIGS photovoltaics produced is expected to reduce solar cell cost and materials bulk.

Featured Articles
Test Points Blog with Linda Rae, Keithley

In "Tier 1 Fabs are Consolidating. How Does that Affect Test?" Rae says that the industry’s consolidation of Tier 1 semiconductor fabs has been well documented. What does this mean for test?

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Featured Videos
Doug Peck, AEIC, discusses industry trends, including the size of SMT components, assembly difficulty, and the effect on rework operations. ; aeic; doug peck; industry trends; Miniaturization; rework; SMTAI; Ritwik Chatterjee, Ph.D., speaking on behalf of the Georgia Tech Packaging Research Center (PRC), defines 1st and 2nd level integration through all-silicon interconnection.; all silicon; Georgia Tech; Package in package; Packaging Research Center; Ritwik Chatterjee; RenewableEnergyWorld.com talked with Pete Singer, Editor-In-Chief of Solid State Technology Magazine at Intersolar North America/SEMICON West in San Francisco, California about the solar PV and semiconductor industry connections.; Intersolar; Pete Singer; renewable energy; RenewableEnergyWorld.com; Semicon; solar energy; Solid State Technology Magazine; David Geiger, Flextronics International, explains how EMS assemblers implement new packages in their processes.; Bare Die; ems; Flextronics; new packages; Pop; SATS/EMS; smt; stacked packages; ElectroIQ brings you informative video content from Solid State Technology, Photovoltaics World, Advanced Packaging, Small Times and Surface Mount Technology.
White Papers

Featured White Papers

New Wafer Backside Coating Innovation Stacks Up Against Film
Consumers continue to drive demand for smaller, thinner and more capable electronicdevices which, then, require integrated packages that can cope with today’s ...
Sponsored By:  Henkel Corporation
µPILR™ Flip Chip for High-Performance Applications
The ever increasing market requirements for high-performance, high speed, and densely packaged devices with shrinking form factors have propelled the use of flip ...
Cooling Thin Consumer Electronic Devices
Today’s modern electronic devices are more dense and capable than ever before. Cooling these devices is important not only for the reliability and stability ...
Delivering Optimized High Performance Computing Through Advanced Interconnects
The most important element in the microelectronics performance, be it low power, electrical performance or reliability, is the interconnect from the chip to the ...
The Coolest Compounds
Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today’s electronic circuitry.  ...
Sponsored By:  Master Bond, Inc.,

Recent White Papers

Understanding Low Outgassing Adhesives
Applications that must meet stringent outgassing requirements now have more adhesive options than ever. If you suspect outgassing could potentially pose a problem ...
Sponsored By:  Master Bond, Inc.,
Pete's Posts
Peter Singer
by Peter Singer

Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.

10 million solar roofs in U.S. bill passes

The Ten Million Solar Roofs Act of 2010 (S. 3460) was was passed by the Energy and Natural Resources Committee by a vote of 13 to 10 on July 21, 2010. It was introduced by Sen. Bernie Sanders, a member of the Senate energy and environment committees and...

ElectroIQ Blog
the editors of ElectroIQ.com
by the editors of ElectroIQ.com

Read opinions/analysis on the day's news, tradeshow updates, and more. We blog about solar, semiconductor, advanced packaging and nanotech manufacturing industries.

WaferNEWS Watch: Spotlight on VSEA; LAVA flows uphill

Barclays' CJ Muse points has a handful of key takeaways from Varian Semi. Equip. Associates' Aug. 19 analyst day, which he says collectively point to the company outpacing the rest of the wafer-fab equipment sector: Still optimistic about 2H10....

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Upcoming Events

COMS- The Commercialization of Micro - Nano Systems Conference
August 29 - September 02
Albuquerque, NM
http://www.mancef.org/COMS

EOS/ESD Symposium
October 3-8 
Sparks (Reno) Nevada
http://esda.org/symposia.html

Global Electronics Manufacturing Expo Brazil 2010
October 5-7
Sao Paulo, Brazil 
http://www.gemexpobrazil.com/gemexpo2010/

SMTA International
October 24-28
Walt Disney World Swan and Dolphin Resort
Orlando, FL
www.smta.org/smtai

electronica
November 9-12, 2010
New Munich Trade Fair Center 
Munich, Germany
www.electronica.de/en

AeroDef Manufacturing Exposition
April 5-7, 2011
Anaheim, CA 
http://aerodef.sme.org/

See All Upcoming Events


Welcome to ElectroIQ.com

ElectroIQ, the portal for electronics manufacturing, is the home for Solid State Technology (semiconductors), Photovoltaics World (photovoltaics), Advanced Packaging (packaging) and Small Times (nanotech/MEMS).


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