IFTLE 127: Christmas wishes and thin wafer processing
First things first:
In a recent Yole webcast, Eric Mournier took a market look at thin wafer bonding and processing.
Wafer thinning is required in a number of high growth microelectronic areas.
Thin (< 100μm) and even ultra-thin semiconductor wafers (< 40μm) are in demand for:
-- Reduced package thickness
-- Better heat dissipation / thermal management
-- Increased TSV density
This brings up issues since the thinned wafers are more vulnerable to stress and the dies can warp and break.
Yole sees the following wafer thinning roadmap:
By 2017 memory will dominate the thinned wafer application space:
The major players will be the expected memory "Big 3" of Samsung, Hynix, and Micron:
They see greater than 10M wafers going through temporary bonding in 2017, which would be approximately 8% of total thinned wafers. The power and 3DIC markets will drive temporary bonding on carrier.
This will result in a temporary bonder / debonder market of $250M in 2017.
For all the latest in 3DIC and advanced packaging in 2013, stay linked to IFTLE .............
In a recent Yole webcast, Eric Mournier took a market look at thin wafer bonding and processing.
Wafer thinning is required in a number of high growth microelectronic areas.
Thin (< 100μm) and even ultra-thin semiconductor wafers (< 40μm) are in demand for:
-- Reduced package thickness
-- Better heat dissipation / thermal management
-- Increased TSV density
This brings up issues since the thinned wafers are more vulnerable to stress and the dies can warp and break.
Yole sees the following wafer thinning roadmap:
By 2017 memory will dominate the thinned wafer application space:
The major players will be the expected memory "Big 3" of Samsung, Hynix, and Micron:
They see greater than 10M wafers going through temporary bonding in 2017, which would be approximately 8% of total thinned wafers. The power and 3DIC markets will drive temporary bonding on carrier.
This will result in a temporary bonder / debonder market of $250M in 2017.
For all the latest in 3DIC and advanced packaging in 2013, stay linked to IFTLE .............
