Electronics Manufacturing Blogs

Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.

Solid State Technology Blog

Read opinions/analysis on the day's news, tradeshow updates, and more. We blog about semiconductor, advanced packaging, displays, MEMS, and LED manufacturing industries.

Entegris tour covers the leading edge of filtration, 450mm, and the importance of collaboration

May 2, 2012 -- Solid State Technology recently visited Entegris’ Billerica, MA, location to discuss the contamination challenges of leading-edge semiconductor fabs, the progress made or not made by the semiconductor industry on 450mm, and Entegris’ new i2M Center for Advanced Material... Read More >>

Solid State Technology Blog

Semiconductor and display fab trends gleaned from AMAT's Analyst Day

Applied Materials Inc. (AMAT) is the leading supplier of semiconductor fabricationfab equipment to the global semiconductor industry. After Applied Materials' (AMAT) Analyst Day this week, Citi, Barclays Capital, and Credit Suisse share their bullet-point takeaways about the semiconductor and rel... Read More >>

Insights From Leading Edge

Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.

IFTLE 102 “3.5D Interposers to someday replace PWBs” - TSMC; GF engaging with 3D customers; Intel predicts Consolidation

3.5D Interposers At the 15th Symposium on Polymers for Microelectronics held last week in Wilmington DE, TSMC’s Doug Yu, Sr. Dir. of front end and back end technology development,  challenged the current nomenclature for interposers and... Read More >>

IFTLE 101 Advanced Packaging at IMAPS MINIPAD part 2

Continuing with our examination of advanced packaging at the 2012 IMAPS MINIPAD.ST Micro reported on stress induced fine pitch copper pillar failures. Compared to solder bump, Cu pillar bumping is known to possess good electrical properties, bette... Read More >>

IFTLE 100 IMAPS MINAPAD Addresses Advanced Packaging in Grenoble

"I've been a big fan of Phil's ever since his first blog in August of 2007. Did you know he was born in Hell's Kitchen in New York City? Congratulations to the world's foremost expert on 3D integration on his 100th blog!" -- Peter Singer, Editor-i... Read More >>

Chipworks

DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.

Intel’s 22-nm Trigate Transistors Exposed

Last week Intel had their Q1 conference call for financial analysts, and revealed that the 22-nm Ivy Bridge parts would make up 25% of their shipment volume in the second quarter of this year.  That means that a good quantity will already will have shipped, and we managed to track some down ... Read More >>

Intel to Present on 22-nm Tri-gate Technology at VLSI Symposium

Just published is the press release and tip-sheet on the 2012 VLSI Symposia on VLSI Technology and Circuits, this year in Hawaii. Listed first in the VLSI Technology highlight papers is Intel’s paper, “A 22nm High-Performance and Low-Power CMOS Technology Featuring Fully Depleted Tri-... Read More >>

Dialog Semi Gets the Girls for Apple

Over the years we have looked at a number of products from Apple, and in their mobile products we have seen a continuous series of design wins for power management chips from Dialog Semiconductor, all custom-made parts since they have not been in their normal product listings.  One of the di... Read More >>

Test Points

Observations and opinions about semiconductor test, and the factors that drive how test plays a strategic role throughout the semiconductor design and production process.

Is Your R&D Lab Prepared for Tomorrow’s Non-Volatile Memories?

From a semiconductor technology perspective, flash memory devices have been around for a very long time; in fact, a Toshiba researcher invented flash memory way back in 1984 and Intel released the first flash chip late in that same decade. Until recently, floating-gate flash memory of one form or... Read More >>

Is Your R&D Lab Prepared for Tomorrow’s Non-Volatile Memory Technologies?

From a semiconductor technology perspective, flash memory devices have been around for a very long time; in fact, a Toshiba researcher invented flash memory way back in 1984 and Intel released the first flash chip late in that same decade. Until recently, floating-gate flash memory of one form or... Read More >>

Want to predict the future of semi technology? More power to you!

Ask someone at work in a leading-edge fab what the semi industry will be all about over the rest of this decade, and the first answer you're likely to get is "more power," as in “more power devices based on wide-bandgap semiconductors." Currently, silicon carbide (SiC) and gallium nitrid... Read More >>

SEMI News and Views

SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, photovoltaic, LED and display industries. Bloggers include Jonathan Davis (President, Semiconductor Business), Maggie Hershey (Sr. Director, Public Policy), Tom Morrow (EVP, Emerging Markets Group), Stan Myers (President, SEMI), and Dan Tracy.

SEMI News and Views

SEMI News and Views

SEMI News and Views

Pete's Posts Blog

Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.

Funding the future: How best to spend limited R&D dollars?

One of the big issues now facing the industry is to how best spend limited funding for research and development, when so much needs to be done. Continued scaling to 20nm and below, a transition to 450mm, 3D integration, device new structures, a bevy of new materials with unknown integration chall... Read More >>

Thirty years ago today

Today marks an interesting milestone for me: 30 years ago, I started work as an editor covering the semiconductor industry. I reported to Don Levinthal, publisher of Semiconductor International, at 222 W. Adams in downtown Chicago. The magazine was produced by Cahners, which had recently acquired... Read More >>

The packaging side of The ConFab

The ConFab has gained a reputation as the place to meet to discuss front-end semiconductor manufacturing issues – and that’s true today more than ever – but there has also been a strong focus on the packaging side of the equation. The ConFab has highlighted specific packaging te... Read More >>


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