Michael A. Fury

Director and senior technology analyst, Techcet Group

Techcet

Michael A. Fury, Ph.D, is senior technology analyst at Techcet Group LLC, P.O. Box 29, Del Mar, CA 92014; e-mail mfury@techcet.com.

Articles by Michael A. Fury

Printed everything: PE/PV show highlights flexible 3D interconnects, biosensors, memory, PV cell hybrids
Northeastern Surface Prep 2010: EUV masks, CMP, solar cell texturing, nano-chopsticks
MRS Day 2: CVD for Cu, low-k etch stop, future FETs, graphene "atom hopping"
MRS Day 3: Nanoimprint litho, 32nm memories, FET/Si/CNT sensors
MRS Day 4: TSVs and CMOS+MEMS, wafer bonding, CNT interfaces, ALD for rare-earth HK, graphene redux
MRS Day 5: Flexible electronics, Ge-Si integration, CNTs, OPV, and PCBs
MRS Spring 2011: Lighting the paths for LED materials
MRS Day 2: The III-V future of CMOS, the return of spin-on low-k
MRS Day 3: Memory, hardmasks, low-k -- nothing's confidential
MRS Day 4: Outside CMOS fabrication, but respecting boundaries
MRS Day 5: Opto, interconnects, organics, Borg?
Talkin' ecosystems, supply chain issues at IHS Summit
Organic Electronics Workshop, Day 3: OLEDs, OTFTs, OPV, and futile resistance
SEMICON West: Roaming the floor, LEDs, CMP pads, kudos to Napoleon
SEMICON West-Day-3: Two eye-catching technologies in CMP slurry, printed electronics
Organic Electronics Workshop: TFTs, FETs, and a seeing microphone
Organic Electronics Workshop, Day 2: Pushing organic PV performance
Day 1: Intersolar wanderings, SEMICON West symposium
Day 2: Intersolar wanderings, SEMICON West symposium
SEMICON West Day 2: CMP views, outlooks for breakfast
CMP for hard-disk drives spotlighted at NCCAVS CMPUG
Chip sales, capex growth slowing, says IC Insights
ISS/SMC 2011: The future for memories, materials, stocks, and CEOs
SMC 2011: Materials projections, and China as an island
SMC 2011: Trends in materials, markets, and the supply chain
ISS 2011: Forecasts and strategies, photonics as a data shovel
ISS 2011: Cleantech, LEDs, capital efficiency, setting 2011 expectations
IITC Day 0: Short course reflects interconnects' maturity
IITC Day 1: 3D/TSV, Cu barrier films, critical collaboration
IITC Day 2: Backend memory, MEMS, 3D/TSV -- and no firearms
IITC Day 3: Sub-30nm SoG gapfill, 22nm airgaps...and enforcing Zafiropoulo's Law
Northeastern Surface Prep 2010: III-V cleaning, CMP revolutions, low-k film adsorption, LED surfaces
MRS Spring 2010 meeting, Day 1: Charge-trapping NVM, organics, graphene, PV
IC Insights forum: Capex, chip sales, China, crystal ball
NCCAVS CMPUG: Trends and technologies for CMP in hard-disk drives
IEDM keynotes: Si's future, power's potential, bioelectronics breakthroughs
IEDM Reflections, Day 1: 2Xnm NAND, 3D integration, graphene FETs, biosensors
IEDM Reflections, Day 2: SRO for 11nm multigate CMOS, memory updates
IEDM Reflections, Day 2: Graphene, RRAM, MEMS, and Jedi circuit designs
IEDM Reflections, Day 3: TSMC's 2Xnm FinFET, and a PV+CMOS "Terminator"
CAMP CMP: CMP's FEOL future, "dark art" defect work, mysterious Cu dendrites
CAMP CMP, Day 2: Porosity on demand, CMP whack-a-mole, end-of-line acronym soup
CAMP CMP, Day 3: CMP fangs, dual-purpose slurry injector, "true CMP" HB-LED wafer polishing; karaoke time!
Printed Electronics 2011: Chips, inks, tissue boxes, and apps in between
SEMICON West, Day 1: CMP, slurries, metrology, thermal, zombies, observations
SEMICON West: Shoes vs. phones, CMP users, updating Art's Law
SEMICON West Day 3: CMP and beyond, YouTube walkthroughs, PV drinking habits
NCCAVS on 3D packaging: Bring on the TSVs
ISS day 2: Cloud computing to drive 450mm, closer collaboration
ISS kicks off with IC industry reality talks
Strategies in Light: Day 1, LED Lighting Report, New Start-ups
LED manufacturing highlights from Strategies in Light Day 2
Lithography, direct-attach LEDs, packaging trends at Strategies in Light Day 3
Samsung, IBM and GlobalFoundries look to the future: A report from the Common Platform Technology Forum
Conference Report: MRS Spring 2012, Day 3
Conference report: MRS Spring 2012, Day 2
Conference Report: MRS Spring 2012, Day 1
Field Report: Sensors in Design 2012
Conference Report: MRS Spring 2012, Day 5
SensorsCon highlights: MEMS in the Internet of Things, networks, and camera pills
SensorsCon highlights

Michael A Fury

Michael A. Fury

Director and senior technology analyst, Techcet Group

Articles by Michael A. Fury