June 20, 2012 -- A major high-volume micro electro mechanical systems (MEMS) maker has purchased a FOGALE nanotech T-MAP DUAL 3D 200A metrology tool for its US manufacturing facility. The tool will be equipped with 2 load ports and will be fully automated.
The T-MAP DUAL 3D will perform thickness, total thickness variation (TTV) and stress measurement.
With the microscopy capability, the tool will also perform in-plane registration and out-of-the-plane registration for wafer bonding alignment process control. A new out-of-the-plane overlay metrology enables 0.1µm accuracy.
The tool will also be able to measure critical dimensions (CDs) and the depth of high-aspect-ratio cavities.
FOGALE also recently installed T-MAP DUAL 3D metrology at SPTS, a leader in deep reactive ion etch (DRIE) and plasma etching process tools. SPTS will use the T-MAP DUAL 3D 300M for its application lab in Newport, Wales to perform metrology on through silicon via (TSV) formations.
FOGALE T-MAP DUAL 3D technology was also qualified by a major Korean IDM for back-side wafer processing from temporary wafer bonding to TSV reveal.
FOGALE nanotech provides high-accuracy dimensional metrology tools. FOGALE nanotech provides process control and characterization solutions for MEMS and semiconductor manufacturers and labs around the world. Learn more at www.fogale-semicon.com.
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