January 25, 2012 -- SCHOTT North America Inc. introduced MEMpax borosilicate glass for use in micro electro mechanical systems (MEMS) manufacturing, available in thicknesses from 1.1 to 0.1mm.
MEMpax glass is produced in the same way as the company's AF32 and D 263, then finished with a fire-polished surface, for the needs of MEMS and related ultra-thin borosilicate glass applications. Fire polishing gives the glass a high-quality, pristine surface and can help reduce processing costs.
The new glass shares physical, thermal, and chemical properties with the company's Borofloat 33. The material properties of MEMpax allow anodic bonding with silicon wafers: Under the influence of temperature and pressure, ions diffuse between silicon and glass, which results in a hermetic bond, protecting the silicon wafer elements or connecting various components. The glass boasts a coefficient of thermal expansion (CTE) corresponding to silicon's CTE to avoid warpage in bonding.
The glass is a high-quality insulator with low alkali content. It maintains good dielectric properties up to 450°C.
SCHOTT North America can be found at www.us.schott.com.
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