(July 27, 2010) -- Stanford University placed an order for two Plasma-Therm deposition systems: a VERSALINE HDPCVD system and a Shuttlelock PECVD system. The tools will be installed at Stanford’s Nanofabrication Facility.
Plasma-Therm’s VERSALINE HDPCVD system, with its high density ICP plasma and temperature-controlled environment, expands research capabilities by providing critical technology to deposit high quality dielectric films at low temperatures. The Shuttlelock PECVD system uses a more traditional configuration of parallel plate electrodes that contributes fundamental and important deposition processes such as controllable low-stress silicon nitride. Together, the systems will be used to assist in the Nanofabrication Facility’s research efforts in areas such as nanoelectronic devices, MEMS/NEMS and photonics.
“Stanford University has long since established itself as a leading R&D facility. The deposition processes from industry proven systems like VERSALINE and Shuttlelock will give researchers at the Nanofabrication Facility the tools necessary to make advances in nanoscience applications,” stated Ed Ostan, Plasma-Therm’s EVP of sales & marketing. “Plasma-Therm’s worldwide presence at nanofabrication facilities with processing equipment that spans decades is a reflection of equipment durability, reliability and technological relevance. Our continuous involvement and collaboration with these advanced laboratories is what stimulates process and equipment development.”
The Stanford Nanofabrication Facility (SNF) serves academic, industrial and governmental researchers across the U.S. in areas ranging from optics, MEMS, biology, and chemistry, to traditional electronics device fabrication and process characterization. The SNF is a 10,000 sq.ft. class 100 cleanroom facility that provides researchers with effective and efficient access to advanced nanofabrication equipment and expertise. The SNF is one of 14 universities that make up the NSF’s National Nanotechnology Infrastructure Network (NNIN). NNIN is committed to providing nanofabrication resources to researchers across the country in both industry and academia. Read more about Stanford's recent electronics manufacturing research in IME, Stanford partner on Si nanowire-based circuits, IITC Day 1: 3D/TSV, Cu barrier films, critical collaboration, IITC Day 0: Short course reflects interconnects' maturity, MRS Day 5: Flexible electronics, Ge-Si integration, CNTs, OPV..., IEDM 2009: Stanford's CNT transistors, Carbon nanotubes turn paper/ink into batteries