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MEMS 2010 P

  • 12/17/2010 -- IEDM observations: Getting back to the mechanical in MEMS
    Techcet's Michael A. Fury reports in-depth from sessions at IEDM 2010, looking at paper 18.3, "Prospects for MEM Logic Switch Technology," on a reverse trend from electronic switching back to mechanical switching in the form of MEMS devices.
  • 12/17/2010 -- iPhone-4-MEMS-microphone-technology-boon
    Highlighted by their adoption in Apple Inc.’s iPhone 4, microelectromechanical system (MEMS) microphones are set to achieve a more than 50% increase in shipments in 2010 and a fourfold rise by 2014, according to the market research firm iSuppli, now part of IHS Inc. (NYSE: IHS).
  • 12/16/2010 -- Syndiant-expands-into-Hong-Kong
    Syndiant, maker of high-resolution microdisplays for pico projectors, is expanding its global reach to include offices in the Hong Kong Science and Technology Park.
  • 12/16/2010 -- Reduced-gravity-NASA-funded-rHEALTH-microfluidics-sensor-test
    The DNA Medicine Institute (DMI) successfully completed reduced-gravity experiments on its rHEALTH sensor for the 2010 Facilitated Access to the Space Environment for Technology (FAST) program, at NASA in Houston.
  • 12/14/2010 -- Silicon Biosystems forms U.S. subsidiary to commercialize lab-on-chip
    Silicon Biosystems formed a U.S. subsidiary operation, Silicon Biosystems, Inc., to be headquartered in San Diego, CA. The newly formed business will focus on commercial operations and the development of the North American research and clinical diagnostics markets for the company’s DEPArray technology platform.
  • 12/14/2010 -- PCB-Piezotronics-begins-MEMS-production-taps-Plasma-Therm
    PCB Piezotronics expanded their sensor product line to include several MEMS devices using silicon-based technology. Development and production of these sensors used a Plasma-Therm VERSALINE DSE system for several critical deep silicon etching fabrication steps. 
  • 12/13/2010 -- Quantum-computing-focus-of-MEMS-mirrors
    A new laser-beam steering system that aims and focuses bursts of light onto single atoms for use in quantum computers has been demonstrated by collaborating researchers from Duke University and the University of Wisconsin-Madison.
  • 12/09/2010 -- Printed everything: PE/PV show highlights flexible 3D interconnects, biosensors, memory, PV cell hybrids
    Techcet's Michael A. Fury continues his report from IDTechEx's combined Printed Electronics/ PV USA events, with talks about 3D stacked interconnects made from printed inks, printed biosensors for textiles, a disposable explosives-detecting wipe, silicon-organic PV cells, printed rewritable permanent memory devices, and more.
  • 12/09/2010 -- Lab-on-chip system could provide fast detection of single nucleotide variations in DNA: IEDM news
    At IEDM, Panasonic and imec discussed components of their lab-on-chip collaboration: miniaturized pump for on-chip generation of high pressures, a micropillar filter optimized for DNA separation achieving record resolution, and a SNP detector allowing on-chip detection using very small sample volumes.
  • 12/09/2010 -- MEMS-packaging-facility-lands-Canadian-grant
    The MiQro Innovation Collaborative Centre (MICC; Bromont, QC, Canada) will receive a $14.1 million grant as part of the Canadian government's Centres of Excellence for Commercialization and Research (CECR) program. The grant will be used for 200mm MEMS and WLP research.

NEW PRODUCTS

COMSOL Multiphysics 4.3b offers new additions to simulation platform

May 16, 2013 COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...

Spectra-Physics introduces industrial picosecond laser

May 10, 2013 Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...

Multitest announces ecoAmp for high-power applications

May 8, 2013 Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...

EV Group rolls out EVG120 processing system

May 7, 2013 EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...

05/01/2013
Volume 56, Issue 3

Article Archive for Small Times Magazine.

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