Tue Dec 28 12:50:40 CST 2010
-- MEMS packaging conference planned for 2011
The University of Michigan College of Engineering will present Packaging for MEMS March 31 to April 1, 2011, in Boston, MA. MEMS packaging is a significant part of product cost. This program highlights what to consider in developing application-specific packaging that will meet your goals for product performance, durability, and total cost.