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MEMS 2010 P

  • Wed Dec 29 12:45:20 CST 2010 -- Fraunhofer-adds-SPTS-etch-system-to-MEMS-line
    SPP Process Technology Systems (SPTS), a supplier of advanced capital equipment and process technologies for the global semiconductor industry and related markets, has shipped an APS etch system to Fraunhofer ISIT (FhG-ISIT).
  • Tue Dec 28 12:50:40 CST 2010 -- MEMS packaging conference planned for 2011
    The University of Michigan College of Engineering will present Packaging for MEMS March 31 to April 1, 2011, in Boston, MA. MEMS packaging is a significant part of product cost. This program highlights what to consider in developing application-specific packaging that will meet your goals for product performance, durability, and total cost.
  • Tue Dec 28 12:50:40 CST 2010 -- MEMS packaging conference planned for 2011
    The University of Michigan College of Engineering will present Packaging for MEMS March 31 to April 1, 2011, in Boston, MA. MEMS packaging is a significant part of product cost. This program highlights what to consider in developing application-specific packaging that will meet your goals for product performance, durability, and total cost.
  • Mon Dec 27 13:10:20 CST 2010 -- Knowles-MEMS-microphones-infringe-Analog-Devices-patent
    Analog Devices Inc . (NYSE: ADI) announced that the U.S. International Trade Commission ruled decisively in favor of Analog Devices in its lawsuit against Knowles Electronics. Administrative Law Judge Robert K. Rogers, Jr. concluded that Knowles infringes valid claims from one of ADI's Wafer Anti-Stiction Application (WASA) patents.
  • Wed Dec 22 14:45:30 CST 2010 -- Automotive MEMS market witnessing a record 2010
    iSuppli MEMS analyst Richard Dixon takes a closer look at what's driving the market for MEMS sensors in automotive applications (hint: safety and China), new applications and market shifts, and the long-awaited arrival of consumer-oriented suppliers.
  • Wed Dec 22 14:45:30 CST 2010 -- Automotive MEMS market witnessing a record 2010
    iSuppli MEMS analyst Richard Dixon takes a closer look at what's driving the market for MEMS sensors in automotive applications (hint: safety and China), new applications and market shifts, and the long-awaited arrival of consumer-oriented suppliers.
  • Wed Dec 22 09:05:20 CST 2010 -- Teledyne Technologies acquires DALSA in bid to expand markets
    Teledyne Technologies and DALSA announced that they have entered into a definitive agreement that provides for the acquisition of DALSA by a wholly-owned subsidiary of Teledyne. Teledyne will acquire all of the outstanding common shares of DALSA for CAD $18.25 per share payable in cash.
  • Wed Dec 22 09:05:20 CST 2010 -- Teledyne Technologies acquires DALSA in bid to expand markets
    Teledyne Technologies and DALSA announced that they have entered into a definitive agreement that provides for the acquisition of DALSA by a wholly-owned subsidiary of Teledyne. Teledyne will acquire all of the outstanding common shares of DALSA for CAD $18.25 per share payable in cash.
  • Tue Dec 21 11:45:30 CST 2010 -- Fabless-Multigig-raises-$10m-in-Series-C-Zarlink-leads
    Zarlink Semiconductor has invested US$5 million as part of a US$10 million Series C financing in Multigig, a fabless semiconductor company that provides advanced clock generation and timing products for the wired and wireless communications markets.
  • Tue Dec 21 08:06:00 CST 2010 -- A-STAR-GLOBALFOUNDRIES-collab-on-MEMS-capacitive-sensor-tech
    The Institute of Microelectronics (IME), a research institute of A*STAR in Singapore, and GLOBALFOUNDRIES are joining forces to develop MEMS Capacitive Sensor Platform Technology for power-efficient and highly sensitive motion sensing applications that are relevant to consumer electronics, automotive and aerospace industries.

NEW PRODUCTS

Multitest announces ecoAmp for high-power applications

May 8, 2013 Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...

EV Group rolls out EVG120 processing system

May 7, 2013 EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...

Quartz Imaging introduces automated measurement for semiconductor images

April 30, 2013

It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device.

Axcelis launches Purion XE high energy implanter

April 30, 2013 Axcelis Technologies, Inc. today announced the introduction of the Purion XE next generation single wafer high energy implanter...

05/01/2013
Volume 56, Issue 3

Article Archive for Small Times Magazine.

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