The companies will offer 3D X-ray imaging as part of a service model which enables customers in the electronics and semiconductor industry to address semiconductor packaging development and failure analysis challenges while evaluating the purchase of their own systems.
As part of the agreement, NanoLab Technologies purchased an Xradia MicroXCT-200, a platform for 3D X-ray imaging.
This new class of X-ray computed tomography scanner features sub-micron pixel resolution and impressive high contrast imaging capabilities for a larger range of sample sizes and shapes. In addition, the Xradia MicroXCT-200 detectors provide superior contrast, even for low absorption materials.
The system comes equipped with multiple magnification detectors for easy zoom-in during imaging. 3D X-ray capabilities eliminate the need for physical cross sectioning and delayering for many applications, which reduces analysis time and prevents method induced artifacts.
"The MicroXCT-200 is the ideal solution for semiconductor package and electronic materials imaging", said John Traub, president of NanoLab Technologies.
"Giving our customers the ability to visualize fine embedded structures in 3D within the intact chip package offers insight that's not possible with typical surface analysis tools like the AFM, SEM or conventional 2D X-ray systems. The Xradia system is a critical addition to our state-of-the-art lab offering -- providing our customers with solutions to their advanced packaging technology challenges such as flip chip packages, BGA, multi-chip packages and wafer level packaging solutions."