|The KADETT is suited for advanced packaging, micro-optics, and MEMS assembly. (Photo: SUSS MicroTec)|
SUSS says the KADETT semi-automatic device bonder is a flexible and open platform for accurate assembly and bonding on a variety of substrates. The machine promises accurate pick and place functions; a range of bonding processes including in-situ reflow, thermo-compression, thermo-sonic and adhesive bonding are available for forces up to 75N.
A vision systems uses two independent high resolution video microscopes (chip and substrate) with a high resolution (0.1µm) XY alignment stage to achieve accurate alignment. SUSS says the KADETT's flexible architecture enables the integration of many processing modules such as a UV glue curing system and ultrasonic bonding head.