Apr. 4, 2007 -- Collaborative R&D center Infotonics, Canandaigua, NY, recently made investments in its MEMS packaging lab: a SUSS MicroTec ABC200 wafer bonding cluster tool and FC150 device bonder. Infotonics aims to drive businesses using its expertise in photonics and microsystems innovation and commercialization. its core competencies include the design, simulation, fabrication, packaging, test and metrology for MEMS and MOEMS devices.
"Infotonics is in a unique position to promote MEMS and MOEMS technology transfer to industry," says Michael Kipp, President, Wafer Bonder Division, SUSS MicroTec. Infotonics boasts corporate partners such as Corning, Eastman Kodak, and Xerox, as well as relationships with over 20 universities and, according to SUSS, has played a central role in groundbreaking work to benefit the biomedical and communications industries.
The new tools will be key for work in MEMS fabrication and packaging, says Dr. Nancy Stoffel of Infotonics' Technology Center. "The ABC200 will allow automated precision alignment, cleaning, bonding and inspection all in one system […and its] modularity allows us to run a variety of bonding processes for both R&D and pilot production." For flip chip processes, the FC150 offers configurations from manual to full automation, providing development and pilot production capabilities on an upgradeable platform.