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Photovoltaics 2006 P

  • 11/16/2006 -- Rigaku to introduce new X-ray diffraction system for nanomaterials research
    Rigaku Americas of The Woodlands, Texas, announced that it will introduce a new advanced automated X-ray Diffraction system specifically designed and equipped for nanomaterials research: the Rigaku SmartLab NANO-Extreme.
  • 11/06/2006 -- Synova, Sugino to launch Japanese micromachining joint venture
    Synova, the Lausanne, Switzerland, maker of water jet-guided laser technology, announced that it has signed a letter of intent to develop a joint venture with Sugino Machine Ltd. in Japan to bolster its presence and market share in the Japanese micromachining equipment market.
  • 11/06/2006 -- SMI announces sale of oxide MOCVD system to China
    Structured Materials Industries Inc. (SMI) announced that it has sold an oxide MOCVD system to China. The company did not name the customer.
  • 11/03/2006 -- PI announces new positioning stage
    PI (Physik Instrumente) L.P., a manufacturer of nanopositioning and precision motion-control equipment for bio/nanotechnology, photonics, semiconductor and life science applications, announced the V-106 series of PCI-card-driven, high-speed voice coil positioning stages, providing up to 20 mm (0.8 in.) of travel and resolution to 100 nanometers.
  • 10/31/2006 -- BOC Edwards, Aviza Technology working together on ALD
    BOC Edwards, a supplier of technology, equipment and support services to the electronics and microelectronics industries, and Aviza Technology Inc., a supplier of semiconductor equipment and process technologies, announced that they have entered into a joint development agreement to develop Atomic Layer Deposition (ALD) technology for advanced semiconductor manufacturing.
  • 10/27/2006 -- Intelligent Micro Patterning offers new rotational stage assembly
    Intelligent Micro Patterning LLC of St. Petersburg, Florida, announced its SF-100 Rotational Stage Assembly, a new enhancement to the SF-100 maskless micropatterning system.
  • 10/26/2006 -- BudgetSensors selling through NanoWin in Korea
    BudgetSensors, a Sofia, Bulgari, manufacturer of probes and accessories for atomic force microscopes, named NanoWin Corp. as its sole distributor in Korea.
  • 10/25/2006 -- NanoForum poised to highlight next-gen electronics
    The SEMI trade association will highlight non-traditional approaches to electronics manufacturing at its NanoForum trade show.
  • 10/23/2006 -- EV Group and Datacon extend cooperation on advanced-chip-to-wafer technology
    EV Group, a St. Florian, Austria, supplier of wafer-bonding and lithography equipment for the advanced packaging, MEMS and semiconductor markets and Datacon Technology GmbH, a leading supplier of flip-chip and die bonding equipment, announced the installation of an EVG540C2W System at Datacon.
  • 10/11/2006 -- Consortium to focus on cost-effective 3D thru-silicon-via interconnects
    A new consortium, EMC-3D, has been created to address the technical and cost issues of creating 3D interconnects using Thru-Silicon-Via technology for chip stacking and MEMS/sensors packaging.

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05/01/2013
Volume 56, Issue 3

Article Archive for Small Times Magazine.

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