We are launching new designs for Solid State Technology's magazine and website! Starting with this October issue, you'll see a whole new look to Solid State Technology's print and digital issues.

There has been a lot of talk about how China is ramping—and subsidizing—its entire energy sector—spanning coal, solar, wind, and nuclear—but also energy efficient products like electric cars and, yes, LEDs and LED lighting.

In my annual "Commercialization Report Card" market study, the MEMS industry infrastructure is one of 14 critical success factors.

As technology developers, we often realize innovations through a combination of multiple factors, including market research, internal idea generation, and even by chance.

Intel's Fab 24 in Leixlip, Ireland (the '1270' line) is being removed from the company's 22nm roadmap, according to Barclays' CJ Muse. Citi's Tim Arcuri added that the planned Fab 24 migration is being put "on hold" with a deeper strategic decision over Fab 24's fate coming at 14nm or 10nm.

During SEMICON West 2011, SEMATECH announced the world's first 450mm imprinted wafer, accomplished by EV Group (EVG).

SEMI has revised its World Fab Forecast to a 23% year-on-year increase, down from the 31% growth forecast in May.

Megatrends driving wafer bonding are heterogeneous and 3D integration.

As semiconductor devices push into the 20nm process node and beyond, new techniques are needed to extend the viability of 193nm immersion.

A new optical scheme for inspection of advanced SRAM patterns offers enhanced defect signal-to-noise ratio (SNR), enhanced defect capture rate, and higher throughput.

For many years, semiconductor manufacturers have been striving to control escalating R&D and manufacturing costs.