RDL technology has been instrumental in the development of many advanced packaging technologies such as fan-in and fan-out WLP, and TSV applications. Philip Garrou, MCNC, Research Triangle Park, NC; Alan Huffman, RTI Int., Research Triangle Park, NC
Copper barrier solutions exist that ensure electrical and reliability performance even as device scaling continues. Harry Whitesell, Eric Hollar, Kang Sub Yim, Li-Qun Xia, Thamos Nowak, Applied Materials, Santa Clara, CA USA
Xradia has unveiled its latest micro computed tomography (CT) 3D X-ray imaging system, the VersaXRM, targeting gaps in the semiconductor, materials science, geomaterials, and life sciences market segments.
At the recent CeBIT Fair in Hanover, Germany, IBM CEO Sam Palmisano announced that IBM's 3D technology will likely appear in its Power8 processor, planned for 2013, using 28nm or 22nm process technology.
The recent IMAPS Global Business Council Meeting and Device Packaging Conference (mid-March in Ft. McDowell, AZ) was the source of some significant new developments in the areas of 3D IC and fan-out wafer-level packaging.
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