Table of Contents

Features
- Interconnect Structures
  - BEOL technology at 20nm half-pitch
    New approaches to patterning, low-k and metallization are reviewed for 20nm hp interconnects. Gerald Beyer, Zsolt Tokei, imec, Leuven, Belgium
- Redistribution Layers
  - RDL: an integral part of today's advanced packaging technologies
    RDL technology has been instrumental in the development of many advanced packaging technologies such as fan-in and fan-out WLP, and TSV applications. Philip Garrou, MCNC, Research Triangle Park, NC; Alan Huffman, RTI Int., Research Triangle Park, NC
- Next-Generation ICs
  - Pioneering new devices and materials for future ICs
    It is expected that from the 15nm node on, the industry will need to adopt new transister architectures; among the contenders: FinFETs and TunnelFETs. Thomas Hoffmann, imec, Leuven, Belguim
- Test Sockets
  - Configurable Kelvin contacting for today's advanced packages
    In the precision analog marketplace Kelvin testing is becoming increasingly important to adequately test today's advanced packages. Jeff Sherry, Johnstech International, Minneapolis, MN USA
- Cover Article
  - Nano-porous dielectrics and copper barriers for 28nm and below
    Copper barrier solutions exist that ensure electrical and reliability performance even as device scaling continues. Harry Whitesell, Eric Hollar, Kang Sub Yim, Li-Qun Xia, Thamos Nowak, Applied Materials, Santa Clara, CA USA
Columns
- Editorial
  - A Day at CAMP
    Peter Singer, Editor-in-Chief
- Industry Forum
  - Millisecond annealing: extendible to 20nm and beyond
    Jeff Hebb, Ultratech, Inc., San Jose, CA USA.
Departments
- World News
- Technology News
  - 3D CT X-ray imaging fills inspection gaps, says Xradia
    Xradia has unveiled its latest micro computed tomography (CT) 3D X-ray imaging system, the VersaXRM, targeting gaps in the semiconductor, materials science, geomaterials, and life sciences market segments.
  - LED test standards, packaging material challenges
    Emerging LED test standards and HB-LED packaging materials pros/cons were two of the topics covered at MEPTEC's The Heat is On event in late March.
  - IBM to use water cooling for future 3D IC processors
    At the recent CeBIT Fair in Hanover, Germany, IBM CEO Sam Palmisano announced that IBM's 3D technology will likely appear in its Power8 processor, planned for 2013, using 28nm or 22nm process technology.
  - 3D IC toolset readiness, Cu bonding, interposer failings
    The recent IMAPS Global Business Council Meeting and Device Packaging Conference (mid-March in Ft. McDowell, AZ) was the source of some significant new developments in the areas of 3D IC and fan-out wafer-level packaging.

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EDITORS' PICKS

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