Columns
- Editorial
  - The Impact of Japan's Triple Disaster
    Peter Singer, Editor-in-Chief
- Industry Forum
  - Packaging Roadmaps at MEPTEC
    Phil Garrou, Contributing Editor
Departments
- World News
- Technology News
  - Metal organic precursors for LED manufacturing
    At the Strategies in Light conference (Feb. 22-24, Santa Clara, CA), Ravi Kanjolia, CTO of SAFC Hitech, discussed metal organics (MO) supply issues and technologies being adopted by compound semiconductor manufacturers.
  - SPIE 2011: Where are we now with EUV?
    Given the mountainous expenditures in EUV lithography, what are its main accomplishments so far?
- New Products
Features
- Cover Article
  - Wet-process technologies for scalable through-silicon vias
    Electrografting nanotechnology has been optimized for highly conformal growth of TSV films, enabling a large reduction in cost-of-ownership per wafer compared to the dry process approach. Claudio Truzzi, Alchimer S.A., Massy, France
- Wafer Cleaning\Surface Prep
  - Surface preparation for 2011 and beyond
    Surface clean engineers must discover new methods to realize contamination and surface termination requirements at each step of the manufacturing process, while simultaneously considering the impact to health, cost and the environment. Joel Barnett, SEMATECH, Austin, TX, USA
  - Random yield loss during wafer cleaning
    The Cleaning studies of silicon wafers in DI water in both conventional wet-bath and a single-wafer cleaning tool clearly show that pumping methods have a strong influence on process performance. R. Prasanna Venkatesh, Jung-Soo Lim, Jin-Goo Part, Hanyany University, Ansan, Korea

EDITORS' PICKS

LIVE NEWS FEED

BPT PRODUCTS: Recalls 213 Pounds of Beef Jerky Products

Hemlock confirms 400 permanent job cuts

Car Infotainment Semiconductor Market Hits Speed Bump In 2013

NXP Semiconductors to introduce smartcard and embedded secure element chips

ON Semiconductor introduces DC-DC converter IC

SEMICONDUCTOR ARTICLES

Strategic approach to R&D is goal at National Photonics Initiative Event

AIXTRON sees signs of market stabilization in report of 2012 fiscal year

'Key' EUV milestone, DSA progress, more reported at SPIE Advanced Lithography

STMicroelectronics makes analog 130nm H9A CMOS process available through CMP

MORE SEMICONDUCTORS

PACKAGING ARTICLES

Strategic approach to R&D is goal at National Photonics Initiative Event

AIXTRON sees signs of market stabilization in report of 2012 fiscal year

Aptina and LFoundry to partner on CMOS image sensor manufacturing

January DRAM, NAND flash sales indicate a promising year

MORE PACKAGING

MEMS ARTICLES

Short-range wireless technology IC market to reach almost 5 billion units shipped in 2013

eMemory’s eNVM SIPs reach 5 million wafer production record

NIST quantum refrigerator offers extreme cooling and convenience

Fab Spending Forecast: Equipment spending is expected to remain flat in 2013

MORE MEMS

LEDS ARTICLES

AIXTRON sees signs of market stabilization in report of 2012 fiscal year

EPIC to develop industry database and interactive map

Fab Spending Forecast: Equipment spending is expected to remain flat in 2013

Cree introduces new LED bulb for under $10

MORE LEDS

DISPLAY ARTICLES

EPIC to develop industry database and interactive map

ITO film market undergoing a sea of changes

Corning believes flexible displays with Willow glass are still three years out

Worldwide LED component market grows 9%

MORE DISPLAYS

Topics

LEDS

View Solid State Technology articles by topic, A-Z

VIDEOS

TECHNOLOGY PAPERS

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

Faster Time to Root Cause with Diagnosis-Driven Yield Analysis

This whitepaper describes the benefits of implementing a diagnosis-driven yield analysis flow using the Tessent® Diagnosis and Tessent YieldInsight® software...

More Technology Papers

WEBCASTS

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...

3D and 2.5D Integration: A Status Report Live Event

This webcast will explore the present status of 2.5 and 3D integration, including TSV formation.

More Webcasts

BUYERS GUIDE

Semiconductors

Packaging

MEMS

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Issue 4

Table of Contents

Solid State Technology

Columns

Editorial

Industry Forum

Departments

Technology News

Features

Cover Article

Wafer Cleaning\Surface Prep

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EDITORS' PICKS

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LIVE NEWS FEED

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SEMICONDUCTOR ARTICLES

PACKAGING ARTICLES

MEMS ARTICLES

LEDS ARTICLES

DISPLAY ARTICLES

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TECHNOLOGY PAPERS

WEBCASTS

BUYERS GUIDE

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