Table of Contents
Solid State Technology
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Departments
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Features
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Cover Article
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Technology and cost considerations for high-volume HBLED lithography
Lithography is one of the critical processes affecting overall LED device yield and performance, but the use of 1X steppers provides significantly better technology and economic advantages for high-volume manufacturing environments. Manish Ranjan, Doug Anberg, Warren Flack, Ultratech Inc., San Jose. CA USA
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Technology and cost considerations for high-volume HBLED lithography
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SiPs
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The road ahead for SiPs
With the proper up-front evaluation of SiP designs, a tool box of enabling technologies, and strong team interactions between all involved parties, SiP solutions can enable novel electronic products with faster time to market than would be possible with traditional scaling. Darvin Edwards, Masood Murtuza, Texas Instruments, Dallas, TX USA
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The road ahead for SiPs
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Lithography
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The future of lithography
Semiconductor manufacturers are now relying on immersion lithography for the 32 nm node, sometimes with double- and triple-patterning approached. Work progresses on EUV as the heir apparent, but e-beam lithography could emerge as a viable alternative. We invited experts from SEMATECH, imec, Cymer , D2S and Molecular Imprints to give their perspective on next generation lithography challenges and solutions.
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Predictive, short-interval scheduling improves litho utilization and cycle time
An advanced scheduling approach is providing semiconductor manufacturers with improved results in critical photolithography areas. Steve Marteney, Applied Materials Inc., Salt Lake City, UT USA
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The future of lithography
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Columns
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Editorial
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HBLED Manufacturing: Gearing Up
Peter Singer, Editor-in-Chief
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HBLED Manufacturing: Gearing Up
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EDITORS' PICKS
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WEBCASTS
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450mm Status Report
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BUYERS GUIDE
BLOGS
IFTLE 146 TSMC Apple Rumors; Gartner OSAT Mkt Numbers; Novati
Sat May 04 12:01:00 CDT 2013
IFTLE 145 GPU Roadmap, IEEE 3DIC back in SF; ConFab 2013 Pkging
Sun Apr 28 15:23:00 CDT 2013
IFTLE 144 Personnel Changes in Taiwan; Glass Usage in WLP
Sun Apr 21 10:29:00 CDT 2013
IFTLE 143 HMC status; Pkging Materials $$ now Exceed Wafer Fab Materials
Sat Apr 13 17:15:00 CDT 2013
IFTLE 142 GlobalFoundries 2.5 / 3D at 20nm; Intel Haswell GT3; UMC / SCP Prototype Details
Tue Apr 09 16:59:00 CDT 2013
Join The ConFab discussion
Tue Feb 26 11:27:00 CST 2013
Questions and answers on FD-SOI
Fri Jan 04 14:56:00 CST 2013
Present your ideas at The ConFab in 2013
Mon Nov 26 09:04:00 CST 2012
The ConFab 2013 countdown begins
Thu Aug 09 16:18:00 CDT 2012
The ConFab: Big data is here
Sun Jun 03 19:19:00 CDT 2012
Intel Foundries MEMS for Fuel Cell Start-up Nectar
Wed Jan 30 14:40:00 CST 2013
IBM surprises with 22nm details at IEDM
Wed Dec 12 04:00:00 CST 2012
Intel details 22nm trigate SoC process at IEDM
Tue Dec 11 12:23:00 CST 2012
GlobalFoundries takes on Intel with 14nm finFET “eXtreme Mobility” process
Tue Oct 02 16:22:00 CDT 2012
The Elephant Has Left the Room – 450 mm is a Go!
Tue Jul 10 09:35:00 CDT 2012
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LATEST ISSUE
05/01/2013
Volume 56, Issue 3
Article Archive for Solid State Technology.