Columns
- Editorial
  - Increasing Energy Efficiency
    Peter Singer, Editor-in-Chief
- Industry Forum
  - Analog foundry processing demands robust PDK
    To succeed as a player in the analog space, foundries must think like analog IDMs that have demonstrated time and again how to design, develop and manufacture best-in-class analog products. Lou N. Hutter, Dongbu HiTek Co., Ltd., Seoul, S. Korea
Departments
Features
- Cover Article
  - Subfab sync increases energy savings
    As energy costs and environmental concerns escalate, the subfab offers opportunities for significant economies without raising the carbon footprint of IC manufacturing. P. Chandler, A. Neuber, P. Fisher Applied
    Materials, Santa Clara, CA USAAs energy costs and environmental concerns escalate, the subfab offers opportunities for significant economies without raising the carbon footprint of IC manufacturing. P. Chandler, A. Neuber, P. Fisher Applied Materials, Santa Clara, CA USA
- Power Density Management
  - Power management: key analog IC growth driver
    Interest in power management is fueled by the explosion of portable power and consumer electronics, however, the technical requirements are quite rigorous across silicon, metallization, and packaging. Lou Hutter, Felicia James, Dongbu HiTek, Seoul, S. Korea
- Energy Efficiency
  - Enabling energy efficiency in semiconductor manufacturing
    To effectively reduce energy consumption for the longterm, companies must identify energy-intensive operations, develop a strategy to achieve appropriate reductions in the near- and long-term, and encourage a corporate culture committed to further improving energy effciency in all aspects of operation. Sunil Thekkepat, Texas Instr ume nts, Dallas, TX USA
- Advanced Packaging
  - Market and technology trends in advanced packaging
    Successful volume manufacturing for varied advanced packaging processes demands innovation and joint collaboration efforts within the entire manufacturing and equipment supply chain. Manish Ranjan, Ultratech, San Jose, CA USA
- Wafer Bumping
  - Electroless NiAu on thinned wafers enables cost efficient prototyping
    The electroless deposition of nickel and gold (ENIG) is a well established process for printed circuit board manufacturing; applied to electronic wafers, it offers a cost efficient under bump metallization for soldering, Ag sintering or gluing applications. Dirk Kähler, Fraunhofer Institute for Silicon Technology ISIT, Itzehoe, Germany

EDITORS' PICKS

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SEMICONDUCTOR ARTICLES

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PACKAGING ARTICLES

MRAM: Disruptive technology for storage applications

STMicroelectronics proximity sensor solves smartphone hang-ups

Broadcom tops three ABI Research wireless connectivity IC competitive assessments

Strategic approach to R&D is goal at National Photonics Initiative Event

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MEMS ARTICLES

Digi-Key Corporation and MEMSIC announce global distribution agreement

STMicroelectronics proximity sensor solves smartphone hang-ups

Nanoelectronics Conference will focus on semiconductor industry’s future

Short-range wireless technology IC market to reach almost 5 billion units shipped in 2013

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LEDS ARTICLES

Student develops brighter, smarter and more efficient LEDs

AIXTRON sees signs of market stabilization in report of 2012 fiscal year

EPIC to develop industry database and interactive map

Fab Spending Forecast: Equipment spending is expected to remain flat in 2013

MORE LEDS

DISPLAY ARTICLES

EPIC to develop industry database and interactive map

ITO film market undergoing a sea of changes

Corning believes flexible displays with Willow glass are still three years out

Worldwide LED component market grows 9%

MORE DISPLAYS

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LEDS

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Issue 4

Table of Contents

Solid State Technology

Columns

Editorial

Industry Forum

Departments

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Features

Cover Article

Power Density Management

Energy Efficiency

Advanced Packaging

Wafer Bumping

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