Table of Contents
Solid State Technology
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Columns
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Editorial
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The end of innovation? Not possible.
Pete Singer, Editor-in-Chief
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The end of innovation? Not possible.
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Industry Forum
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The myth of infinite demand
The PV industry needs stable demand, grid parity with conventional sources of energy as an equilizer, along with new business models that allow consumers to choose between buying electricity or buying a system. Paula Mints, Navigant Consulting
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The myth of infinite demand
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Departments
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World News
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2Q spike reveals rainbow, cyclicality
Maybe the maturing semiconductor industry is through with cyclical highs and lows spanning several years, but those cycles are alive and well if you drill down to a narrower scope, notes IC Insights.
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2Q spike reveals rainbow, cyclicality
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Tech News
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ASML fulfills “holistic litho” plan with two tools, custom packages
Citing the embodiment of its concept of “holistic lithography,” ASML has unwrapped two hardware/software components to help chipmakers improve lithography process windows while avoiding costly and timely steps and maintenance downtime.
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Going green gives new life to reclaimed silicon
ATMI latest “green” product, RegenSi 74, released at SEMICON West, is an improved and more environmentally friendly extension of its advanced test wafer recycle and reclaim products.
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Norcimbus uncrates variable gas flow mixing system
Norcimbus FCIV Inc. introduced its NBlend variable flow gas mixing system at SEMICON West, which allows manufacturers to transition away from using specialty gas cylinders and achieve cost savings by blending their own specialty gases in-house, implementing a facility’s existing bulk gas supply infrastructure.
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SEMATECH’s 450mm progress, next steps
SEMATECH subsidiary ISMI provided SST with tidbits from its closed-door discussions on Wednesday centered on the 450mm transition: some supplier selections are complete and >60 are engaged for test wafers, which are slated to distribute in 3Q09.
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ASML fulfills “holistic litho” plan with two tools, custom packages
- Product News
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Features
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Cover Article
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High-power EUV lithography lightsources come of age
Laser-produced plasma (LPP) EUV source technology has advanced toward the specifications needed for actual chip production. David C. Brandt, Nigel R. Farrar, Cymer Inc.
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High-power EUV lithography lightsources come of age
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Wafer Cleaning
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Suppression of galvanic corrosion in advanced BEOL integration
A single-wafer closed chamber system has been developed to control oxygen levels in the processing fluid and chamber atmosphere to eliminate oxygen corrosion reaction. Jeffery M. Lauerhaas, FSI International
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Suppression of galvanic corrosion in advanced BEOL integration
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Die Attach
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Self-filleting technology using smart die-attach paste
Die stacking designs make it difficult to use traditional paste materials—but now, self-filleting materials may mark the re-emergence of die attach paste as the material of choice for cost-effective packaging. Debbie Forray and Ilya Furman, Henkel Corp.
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Self-filleting technology using smart die-attach paste
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Semiconductor Survivor Awards
These are difficult times for the semiconductor industry. Many would say the most difficult ever.
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EDITORS' PICKS
TOP BLOG POSTS
Intel Foundries MEMS for Fuel Cell Start-up Nectar
IFTLE 134 SEMI 3D European Summit – Is the Wide IO Driver Dead?
EUV source roadmaps: Physics vs Engineering
Intel details 22nm trigate SoC process at IEDM
IFTLE 128: RTI 3D ASIP Part 1; Lester the Lightbulb update
Questions and answers on FD-SOI
GlobalFoundries takes on Intel with 14nm finFET “eXtreme Mobility” process
LIVE NEWS FEED
RECENT ARTICLES
PACKAGING ARTICLES
VIDEOS
NEW PRODUCTS
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Spectra-Physics introduces industrial picosecond laser
May 10, 2013
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...
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Multitest announces ecoAmp for high-power applications
May 8, 2013
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...
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EV Group rolls out EVG120 processing system
May 7, 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...
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Quartz Imaging introduces automated measurement for semiconductor images
April 30, 2013
It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device. |
TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...
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WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
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BUYERS GUIDE
BLOGS
IFTLE 146 TSMC Apple Rumors; Gartner OSAT Mkt Numbers; Novati
Sat May 04 12:01:00 CDT 2013
IFTLE 145 GPU Roadmap, IEEE 3DIC back in SF; ConFab 2013 Pkging
Sun Apr 28 15:23:00 CDT 2013
IFTLE 144 Personnel Changes in Taiwan; Glass Usage in WLP
Sun Apr 21 10:29:00 CDT 2013
IFTLE 143 HMC status; Pkging Materials $$ now Exceed Wafer Fab Materials
Sat Apr 13 17:15:00 CDT 2013
IFTLE 142 GlobalFoundries 2.5 / 3D at 20nm; Intel Haswell GT3; UMC / SCP Prototype Details
Tue Apr 09 16:59:00 CDT 2013
Join The ConFab discussion
Tue Feb 26 11:27:00 CST 2013
Questions and answers on FD-SOI
Fri Jan 04 14:56:00 CST 2013
Present your ideas at The ConFab in 2013
Mon Nov 26 09:04:00 CST 2012
The ConFab 2013 countdown begins
Thu Aug 09 16:18:00 CDT 2012
The ConFab: Big data is here
Sun Jun 03 19:19:00 CDT 2012
Intel Foundries MEMS for Fuel Cell Start-up Nectar
Wed Jan 30 14:40:00 CST 2013
IBM surprises with 22nm details at IEDM
Wed Dec 12 04:00:00 CST 2012
Intel details 22nm trigate SoC process at IEDM
Tue Dec 11 12:23:00 CST 2012
GlobalFoundries takes on Intel with 14nm finFET “eXtreme Mobility” process
Tue Oct 02 16:22:00 CDT 2012
The Elephant Has Left the Room – 450 mm is a Go!
Tue Jul 10 09:35:00 CDT 2012
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LATEST ISSUE
05/01/2013
Volume 56, Issue 3
Article Archive for Solid State Technology.