Table of Contents
Solid State Technology
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Columns
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Editorial
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Heard at The ConFab
For the past five years, PennWell has sponsored an event called The ConFab, which is a conference focused on semiconductor manufacturing issues, combined with a variety of focused “networking” opportunities for sponsors and delegates.
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Heard at The ConFab
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Industry Forum
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The recession’s silver lining: a mandate for more efficiency
The recession has caused CEOs to revisit the fixed cost issue and call upon value chain producers to provide a variable and lower cost solution with aggregated expertise and scalable learning. Jack Harding, eSilicon Corporation
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The recession’s silver lining: a mandate for more efficiency
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Departments
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World News
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SEMI: Fab investments poised for a comeback
Fab spending has been sliding since early 2008 and is poised to sink to a 10-year low in 2009, according to recent data and projections from SEMI—but the good news is that 2010 could see a 90% surge in fab investments.
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SEMI: Fab investments poised for a comeback
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Tech News
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Intel Research Day: Update on EUV, other projects
Research at Intel Labs covered at the chipmaker’s annual event (June 18, Mountain View, CA) covered the major categories of eco-innovation, 3D graphics on the Internet, mobility, and enterprise.
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GA Tech: Graphene could replace Cu for IC interconnects
Researchers at Georgia Tech say they have experimentally demonstrated the potential for graphene to replace copper for on-chip interconnects and help extend performance scaling for silicon-based ICs.
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Oerlikon discusses path to $0.70/W thin-film PV panels
Oerlikon Solar announced during this spring’s Intersolar in Munich that it had achieved 11% initial power conversion efficiency on its full-size micromorph (a thin-film technology) modules (1.4m2), or 151Watts of initial power.
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Applied targets 22nm copper barrier/seed PVD
Applied Materials says its new Endura CuBS RFX PVD system, qualified for copper barrier/seed deposition technology at 32nm and 22nm for production of logic and flash memory, provides a lower cost/wafer than competing technologies, including CVD alternatives, by as much as 40%—calculating a normalized COO of the 130Å Ta + 450Å RFX Cu process (CuBS) at $1/wafer, according to Marek Radko, the firm’s BEOL GPM manager.
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Intel Research Day: Update on EUV, other projects
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Features
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Cover Article
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New regs on sub-atmospheric gas sources reduce risk, improve safety
Given the general concern about the safety of highly toxic materials in transport and use, it is likely that use of sub-atmospheric gas sources will grow for reasons of general public safety. Al Brown, RUSHBROOK and Karl Olander, ATMI
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New regs on sub-atmospheric gas sources reduce risk, improve safety
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Thermal Processing
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Thermal processing issues for 22nm node junction scaling
Whether flash lamp or sub-melt laser annealing is used for 22nm node ultra shallow junction, the annealing process and equipment must also be optimized to prevent strain relaxation, high-k/metal gate stack failure and wafer breakage. John Borland, J.O.B. technologies: Susan Felch; Zhinmin Wan, AIBT; Masayasu Tanjyo, Nissin Ion Equipment; Temel Buyuklimanli, EAG.
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Thermal processing issues for 22nm node junction scaling
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Wafer Bonding
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Pressure indicating film characterization of wafer-to-wafer bonding
Wafers are bonded by applying precise combinations of physical pressure, temperature, and/or voltage. Pressure is measured as an average, assuming perfectly flat pressure plates. In practice, the pressure plates are often non-ideal, or they may have degraded over time. Applied pressure characterization is important for high yielding eutectic/thermocompression bonds. Kwan-yu Lai, Micralyne Inc. and Jeffrey G. Stark, Sensor Products Inc.
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Pressure indicating film characterization of wafer-to-wafer bonding
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Defect Detection
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Non-visual defect inspection for comprehensive yield management
The arrival of new semiconductor device structures and processes are giving rise to non-visual defects, which require new ways of thinking about yield management. Ralph Spicer, Qcept Technologies.
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Non-visual defect inspection for comprehensive yield management
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EDITORS' PICKS
TOP BLOG POSTS
Intel Foundries MEMS for Fuel Cell Start-up Nectar
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IFTLE 128: RTI 3D ASIP Part 1; Lester the Lightbulb update
Questions and answers on FD-SOI
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LIVE NEWS FEED
RECENT ARTICLES
SEMICONDUCTOR ARTICLES
PACKAGING ARTICLES
MEMS ARTICLES
VIDEOS
NEW PRODUCTS
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COMSOL Multiphysics 4.3b offers new additions to simulation platform
May 16, 2013
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...
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Spectra-Physics introduces industrial picosecond laser
May 10, 2013
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...
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Multitest announces ecoAmp for high-power applications
May 8, 2013
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...
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EV Group rolls out EVG120 processing system
May 7, 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...
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TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...
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WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
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BUYERS GUIDE
BLOGS
IFTLE 147 IME Updates 2.5D; Qualcomm Updates 2.5 / 3DIC at ICEP
Mon May 13 10:16:00 CDT 2013
IFTLE 146 TSMC Apple Rumors; Gartner OSAT Mkt Numbers; Novati
Sat May 04 12:01:00 CDT 2013
IFTLE 145 GPU Roadmap, IEEE 3DIC back in SF; ConFab 2013 Pkging
Sun Apr 28 15:23:00 CDT 2013
IFTLE 144 Personnel Changes in Taiwan; Glass Usage in WLP
Sun Apr 21 10:29:00 CDT 2013
IFTLE 143 HMC status; Pkging Materials $$ now Exceed Wafer Fab Materials
Sat Apr 13 17:15:00 CDT 2013
Join The ConFab discussion
Tue Feb 26 11:27:00 CST 2013
Questions and answers on FD-SOI
Fri Jan 04 14:56:00 CST 2013
Present your ideas at The ConFab in 2013
Mon Nov 26 09:04:00 CST 2012
The ConFab 2013 countdown begins
Thu Aug 09 16:18:00 CDT 2012
The ConFab: Big data is here
Sun Jun 03 19:19:00 CDT 2012
Intel Foundries MEMS for Fuel Cell Start-up Nectar
Wed Jan 30 14:40:00 CST 2013
IBM surprises with 22nm details at IEDM
Wed Dec 12 04:00:00 CST 2012
Intel details 22nm trigate SoC process at IEDM
Tue Dec 11 12:23:00 CST 2012
GlobalFoundries takes on Intel with 14nm finFET “eXtreme Mobility” process
Tue Oct 02 16:22:00 CDT 2012
The Elephant Has Left the Room – 450 mm is a Go!
Tue Jul 10 09:35:00 CDT 2012
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LATEST ISSUE
05/01/2013
Volume 56, Issue 3
Article Archive for Solid State Technology.