Departments
- World News
  - SEMI: Wafer shipments, sales slide in ‘08
    Worldwide silicon wafer area shipments and revenues fell in 2008 for the first time since 2001 as everything fell apart in the final months of the year, according to date from SEMI’s Silicon Manufacturers Group (SMG).
- Tech News
  - A reliability engineer’s dream comes along
    In a former life within the semiconductor standards and reliability engineering community, I advocated for the adoption of well-known reliability and maintainability engineering practices that have been used for decades in the aerospace and defense sectors.
  - SVTC, Entrepix expand CMP work to 300mm
    SVTC Technologies (née Cypress Semiconductor’s Silicon Valley Technology Center, spun out to VC/private equity owners in March 2007) and CMP outsourcing firm Entrepix are expanding their existing partnership to 300mm wafer processing.
- Industry Forum
  - Holistic efficiency optimization: how to help in a downturn
    The industry is in another cyclical downturn. No one knows the depth or length of this cycle, but one thing is certain — manufacturing efficiency will be important.
- Editorial
  - How Green is Your Valley?
    The global explosion in IT, combined with rapidly escalating energy costs, has chipmakers asking how much does it really cost to run today’s computers/servers, and what can be done to provide more energy-efficient solutions?
Features
- Cover Article
  - Ion implant: a new enabler for 32nm and 22nm devices
    Over the years, suppliers of ion implant tools have competed mostly on productivity and cost of ownership differentiation.
- Deposition
  - Combinatorial PVD and ALD workflows for cost-effective R&D
    Special workflows using combinatorial technology applied to physical vapor deposition (PVD), atomic layer deposition (ALD) and wet processes can be utilized for applications including development of alternative non-volatile memory and metal gate high-k dielectrics for high-performance logic.
- Wafer Thinning
  - Meeting current and future wafering challenges
    Currently, the multi—wire slurry sawing (MWSS) technique is the leading technology for high precision machining of large cross—sectional area wafers for both the semiconductor and photovoltaic industries.
- 3D Interconnect
  - 3D integration with TSV: temporary bonding and debonding
    Making reliable through-die interconnects for 3D wafer stacking usually requires a reduction in wafer thickness and therefore improved wafer handling.
- Sockets
  - Burn-in Test Socket Challenges
    This article provides a broad review of the issues affecting socket usage: lead-free challenges, finer pitch adjustments, cost control, standardization, practical customer concerns, and improvements needed for 3D packages and other innovations on the horizon.
- Test
  - Kelvin measurement using spring probes for packaged IC testing
    Test engineers often look to leverage a Kelvin-measurement configuration when testing high-power devices, particularly QFN packages — even as the finer-pitch terminal in latest-generation packages makes it difficult to accomplish.

EDITORS' PICKS

LIVE NEWS FEED

USPTO ISSUES TRADEMARK: HARDSILICON

FREESCALE SEMICONDUCTOR REPORTS MULTIPLE TRANSACTIONS BY SENIOR VP CAMPBELL (Bermuda)

ON SEMICONDUCTOR REPORTS DISPOSITION BY SENIOR VP RASHID (Arizona)

VITESSE SEMICONDUCTOR REPORTS ACQUISITION BY DIRECTOR TRAUB (California)

SEMICONDUCTOR ARTICLES

MRAM: Disruptive technology for storage applications

Digi-Key Corporation and MEMSIC announce global distribution agreement

STMicroelectronics proximity sensor solves smartphone hang-ups

Nanoelectronics Conference will focus on semiconductor industry’s future

MORE SEMICONDUCTORS

PACKAGING ARTICLES

MRAM: Disruptive technology for storage applications

STMicroelectronics proximity sensor solves smartphone hang-ups

Broadcom tops three ABI Research wireless connectivity IC competitive assessments

Strategic approach to R&D is goal at National Photonics Initiative Event

MORE PACKAGING

MEMS ARTICLES

Digi-Key Corporation and MEMSIC announce global distribution agreement

STMicroelectronics proximity sensor solves smartphone hang-ups

Nanoelectronics Conference will focus on semiconductor industry’s future

Short-range wireless technology IC market to reach almost 5 billion units shipped in 2013

MORE MEMS

LEDS ARTICLES

Student develops brighter, smarter and more efficient LEDs

AIXTRON sees signs of market stabilization in report of 2012 fiscal year

EPIC to develop industry database and interactive map

Fab Spending Forecast: Equipment spending is expected to remain flat in 2013

MORE LEDS

DISPLAY ARTICLES

EPIC to develop industry database and interactive map

ITO film market undergoing a sea of changes

Corning believes flexible displays with Willow glass are still three years out

Worldwide LED component market grows 9%

MORE DISPLAYS

Topics

LEDS

View Solid State Technology articles by topic, A-Z

VIDEOS

TECHNOLOGY PAPERS

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

Faster Time to Root Cause with Diagnosis-Driven Yield Analysis

This whitepaper describes the benefits of implementing a diagnosis-driven yield analysis flow using the Tessent® Diagnosis and Tessent YieldInsight® software...

More Technology Papers

WEBCASTS

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...

3D and 2.5D Integration: A Status Report Live Event

This webcast will explore the present status of 2.5 and 3D integration, including TSV formation.

More Webcasts

BUYERS GUIDE

Semiconductors

Packaging

MEMS

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Issue 3

Table of Contents

Solid State Technology

Departments

World News

Tech News

Industry Forum

Editorial

Features

Cover Article

Deposition

Wafer Thinning

3D Interconnect

Sockets

Test

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SEMICONDUCTOR ARTICLES

PACKAGING ARTICLES

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