Departments
- Editorial
  - The Case for Integration
    The limits of traditional CMOS scaling are at hand, combined with an unprecedented financial crisis in the electronics industry.
- World News
  - Analyst: 2H09 recovery for DRAM…maybe
    2008 was a big game of “chicken” in the DRAM sector, as firms floored their investment and output pedals in 2008 hoping competitors would give up first.
- Tech News
  - Steady progress reported on HK+MG for 32nm and beyond
    Chipmakers are trying many paths toward high–k metal gate dielectric (HK+MG) CMOS for 32nm and beyond.
  - NIST creates toughness test for low–k films
    Researchers at the National Institute of Standards and Technology (NIST) have updated a well–known technique for measuring material properties to gauge the mechanical strength of low–k films, to help devicemakers better identify interconnect dielectric film candidates.
  - Wafer–based solar cells aren’t done yet
    The solar industry’s recent growth spurt has shown that success brings new challenges.
- Products
  - Product News
    The Discover Solar software package is a reengineered version of the company’s inline defect analysis and data management system to target high–volume photovoltaic production, offering automated process control and the ability to perform root cause analysis closer to real time.
- Industry Forum
  - The technomics of 22nm
    What is the most viable path to enabling the design shrink to 22nm? Will a solution emerge that overcomes the technical and economic hurdles currently being anticipated in both manufacturing and design?
Features
- Cover Article
  - Next–Generation Lithography: EUVL readiness for pilot line insertion
    The most aggressive IC manufacturers target EUVL pilot line introduction in 2011.
- Etch performance of Ar/N₂/F₂ for CVD/ALD chamber clean
  A new F₂ gas mixture was evaluated as a substitute for conventional cleaning gases such as, NF₃, C₂F₆, and CF₄, in a CVD chamber. The new mixture was compatible with the equipment used and improvement was seen in the etch rate as well as a reduction in the amount of gas needed to complete the clean.
- Strain characterization: techniques and applications
  The extensive utilization of strain engineering in the semiconductor industry led to the subsequent development and refinement of a variety of analytical techniques that helped to improve manufacturing control of stress level in thin film, as well as to measure strain on individual devices.

EDITORS' PICKS

LIVE NEWS FEED

Back to black for Pure Wafer after restructure; SEMICONDUCTOR BUSINESS RETURNS PROFIT AFTER LOSS

MAGNACHIP SEMICONDUCTOR: Moody's Maintains 'B2' Rating

Govt in talks to set up chip fabrication units

Washington: Dual ohmic contact to N- and P-type silicon carbide

TSMC, Hon Hai to add 5,000 employees: report

SEMICONDUCTOR ARTICLES

China’s RFID card market to nearly double to $807 million in 2017

AGC and nMode launch subsidiary to develop advanced packaging technology

STMicroelectronics announces resignation of COO and Interim President, Didier Lamouche

OE automotive semiconductor market grew 12% in 2012

MORE SEMICONDUCTORS

PACKAGING ARTICLES

AGC and nMode launch subsidiary to develop advanced packaging technology

New products to be presented at Semicon China 2013

MRAM: Disruptive technology for storage applications

STMicroelectronics proximity sensor solves smartphone hang-ups

MORE PACKAGING

MEMS ARTICLES

China’s RFID card market to nearly double to $807 million in 2017

STMicroelectronics announces resignation of COO and Interim President, Didier Lamouche

OE automotive semiconductor market grew 12% in 2012

Long-predicted atomic collapse state observed in graphene

MORE MEMS

LEDS ARTICLES

The UV LED market is booming

Student develops brighter, smarter and more efficient LEDs

AIXTRON sees signs of market stabilization in report of 2012 fiscal year

EPIC to develop industry database and interactive map

MORE LEDS

DISPLAY ARTICLES

EPIC to develop industry database and interactive map

ITO film market undergoing a sea of changes

Corning believes flexible displays with Willow glass are still three years out

Worldwide LED component market grows 9%

MORE DISPLAYS

Topics

LEDS

View Solid State Technology articles by topic, A-Z

VIDEOS

TECHNOLOGY PAPERS

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

Faster Time to Root Cause with Diagnosis-Driven Yield Analysis

This whitepaper describes the benefits of implementing a diagnosis-driven yield analysis flow using the Tessent® Diagnosis and Tessent YieldInsight® software...

More Technology Papers

WEBCASTS

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...

3D and 2.5D Integration: A Status Report Live Event

This webcast will explore the present status of 2.5 and 3D integration, including TSV formation.

More Webcasts

BUYERS GUIDE

Semiconductors

Packaging

MEMS

Article Archive for Solid State Technology.

FREE eNewsletters

I would like to receive eNewsletters on the following topics:

First Name

Last Name

Email Address

Country

* Required

Electronics Manufacturing News & Products

Advanced Packaging

Displays Manufacturing

LED Manufacturing

MEMS Manufacturing

Semiconductor Manufacturing

Please fill in the required fields above.

Please fill out the remaining fields to complete your registration.

First Name Last Name

Job Title

Company

Country

By clicking 'Register' you are indicating that you have read and agree with our Terms & Conditions and Privacy Policy.

Or, login with your PennWell account:

Or, register with us using the form below:

First Name Last Name

Password

Job Title

Company

Country

By clicking 'Register' you are indicating that you have read and agree with our Terms & Conditions and Privacy Policy.

Enter your email address below and click Submit to receive password reset instructions via email.

An email has been sent to .

Please follow the instructions in the email to change your password.

Your account has been created and you are now logged in.

It looks like you've already registered with . Please login below to link your accounts.

Thank you for registering. An email has been sent to with instructions on how to verify your account.

The specified email address, , needs to be verified in order to login.

An email has been sent to with instructions on how to verify your account.

/content/eiq-2/en/articles/sst/print/volume-52/issue-2.resendverification.html

Issue 2

Table of Contents

Solid State Technology

Departments

Editorial

World News

Tech News

Products

Industry Forum

Features

Cover Article

POST A COMMENT

EDITORS' PICKS

TOP BLOG POSTS

LIVE NEWS FEED

RECENT ARTICLES

SEMICONDUCTOR ARTICLES

PACKAGING ARTICLES

MEMS ARTICLES

LEDS ARTICLES

DISPLAY ARTICLES

Topics

VIDEOS

TECHNOLOGY PAPERS

WEBCASTS

BUYERS GUIDE

Semiconductors

Packaging

MEMS

BLOGS

SUBSCRIBE

LATEST ISSUE