Table of Contents
Solid State Technology
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Departments
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Editorial
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Recessions: a potent time for R&D
Writing anything about the economy these days is like trying to hit a moving target (a quickly dropping target I might add) so let me first say “thank you” to the many forecasters, analysts, and company executives who had the gumption to provide their perspectives for this forecast issue.
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Recessions: a potent time for R&D
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Tech News
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Latest 32nm CMOS, memory beyond flash, plus novel devices detailed at 2008 IEDM
New memory concepts and the latest 32nm CMOS with metal gates and high-k dielectrics were highlights of the 2008 International Electron Devices Meeting (IEDM) in San Francisco, Dec. 15-17.
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ASML “double-dips” with updated litho tool
Double patterning immersion lithography will be the dominant manufacturing paradigm at 32nm, and ASML announced at SEMICON Japan (Dec. 3) a new exposure tool designed for the most litho-intensive version of it: LELE, or “double-dip.”
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Applied accelerating TSV implementation, launches Silvia etch tool
Sizing up a TSV market beyond the early adopters—e.g., image sensors, server DRAM, and communication/mobile Internet devices—Applied Materials is collaborating with material and equipment suppliers (and others) to ensure the full readiness of TSV implementation with a target cost <$150/wafer.
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Latest 32nm CMOS, memory beyond flash, plus novel devices detailed at 2008 IEDM
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Featured Products
The V6000 product line enables testing of both flash and DRAM memory on the same automated test equipment platform by changing to a new test program and probe card.
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Product News
Dyneon’s Adona emulsifier eliminates the use of ammonium perfluorooctanoate (APFO)—a salt derived from perfluorooctanoic acid (PFOA)—from production of fluoropolymers, which the EPA has mandated to be eliminated in 2015.
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Industry Forum
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A collaborative course for HDD manufacturing
The hard disk drive (HDD) industry has been evaluating lithographically patterned media as a vehicle to maintain the ∼40% per year growth in areal density, to well beyond 1Tb/in2.
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A collaborative course for HDD manufacturing
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Features
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Cover Article
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The year ahead: a time for innovation
Technology-driven growth is still possible in the current downturn, according to SST’s poll of executives from across the semiconductor manufacturing supply chain.
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The year ahead: a time for innovation
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Special Report
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2009 Economic forecast Look for rebound by 2010
During the first half of 2008, the chip market held up well, better in fact than many predicted, but come the second half, the repercussions of the US sub-prime disaster had spread to the bigger global financial system, tipping the US and Europe into recession.
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2009 Economic forecast Look for rebound by 2010
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300MM Fabs
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Status and trends in 300mm manufacturing
In the second quarter of 2008, 300mm wafers passed 200mm wafers as the highest production volume wafer size on a sq. in. basis [1]. Announcements of 200mm fab closings by memory producers in favor of lower cost 300mm production seem to come almost daily.
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Status and trends in 300mm manufacturing
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EDITORS' PICKS
TOP BLOG POSTS
Intel Foundries MEMS for Fuel Cell Start-up Nectar
IFTLE 134 SEMI 3D European Summit – Is the Wide IO Driver Dead?
EUV source roadmaps: Physics vs Engineering
Intel details 22nm trigate SoC process at IEDM
IFTLE 128: RTI 3D ASIP Part 1; Lester the Lightbulb update
Questions and answers on FD-SOI
GlobalFoundries takes on Intel with 14nm finFET “eXtreme Mobility” process
LIVE NEWS FEED
RECENT ARTICLES
SEMICONDUCTOR ARTICLES
VIDEOS
NEW PRODUCTS
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Multitest announces ecoAmp for high-power applications
May 8, 2013
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...
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EV Group rolls out EVG120 processing system
May 7, 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...
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Quartz Imaging introduces automated measurement for semiconductor images
April 30, 2013
It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device. |
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Axcelis launches Purion XE high energy implanter
April 30, 2013
Axcelis Technologies, Inc. today announced the introduction of the Purion XE next generation single wafer high energy implanter...
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TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...
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WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
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BUYERS GUIDE
BLOGS
IFTLE 146 TSMC Apple Rumors; Gartner OSAT Mkt Numbers; Novati
Sat May 04 12:01:00 CDT 2013
IFTLE 145 GPU Roadmap, IEEE 3DIC back in SF; ConFab 2013 Pkging
Sun Apr 28 15:23:00 CDT 2013
IFTLE 144 Personnel Changes in Taiwan; Glass Usage in WLP
Sun Apr 21 10:29:00 CDT 2013
IFTLE 143 HMC status; Pkging Materials $$ now Exceed Wafer Fab Materials
Sat Apr 13 17:15:00 CDT 2013
IFTLE 142 GlobalFoundries 2.5 / 3D at 20nm; Intel Haswell GT3; UMC / SCP Prototype Details
Tue Apr 09 16:59:00 CDT 2013
Join The ConFab discussion
Tue Feb 26 11:27:00 CST 2013
Questions and answers on FD-SOI
Fri Jan 04 14:56:00 CST 2013
Present your ideas at The ConFab in 2013
Mon Nov 26 09:04:00 CST 2012
The ConFab 2013 countdown begins
Thu Aug 09 16:18:00 CDT 2012
The ConFab: Big data is here
Sun Jun 03 19:19:00 CDT 2012
Intel Foundries MEMS for Fuel Cell Start-up Nectar
Wed Jan 30 14:40:00 CST 2013
IBM surprises with 22nm details at IEDM
Wed Dec 12 04:00:00 CST 2012
Intel details 22nm trigate SoC process at IEDM
Tue Dec 11 12:23:00 CST 2012
GlobalFoundries takes on Intel with 14nm finFET “eXtreme Mobility” process
Tue Oct 02 16:22:00 CDT 2012
The Elephant Has Left the Room – 450 mm is a Go!
Tue Jul 10 09:35:00 CDT 2012
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LATEST ISSUE
05/01/2013
Volume 56, Issue 3
Article Archive for Solid State Technology.