Surface imaging and analysis software
Pico Image is a modular atomic force microscope (AFM) imaging and analysis software package designed for AFM users working in a wide range of research applications, including life sciences and material sciences. Pico Image analyzes image data and generates dynamic, highly detailed surface analysis reports with power and ease. Each Pico Image analysis document consists of a set of frames containing: surfaces, profiles extracted from surfaces, the results of applying filters and other operators, analytical studies, and 2D and 3D parameters that conform to international standards. Real-time 3D imaging provides excellent visualization. Videos of flight paths over a surface can also be integrated into Pico Image presentations. The software’s intuitive desktop publishing interface, comprehensive online help, and multilanguage support enhance ease of use. Agilent Technologies Inc., Nanotechnology Measurements Division, Chandler, AZ USA; www.agilent.com.
The A3P high performance dry pumps for semiconductor medium applications cover a wide range of pumping speed from 100-1000 m3/hr. The A3P range responds to every 300mm medium process vacuum requirement at a low utilities cost. The company says it has up to 50% power consumption reduction compared to conventional pumping solutions, one of the lowest water cooling flows, and reduced N2 purge. Utilities costs are 1.5kW for a 1000m3/hr pump. Size is 310mm wide. It is SEMI S2-0706 compliant. Applications include etch (oxide, poly), RTP, strip/ashing, and implant source. Alcatel Vacuum Technology, ; www.adixen.com.
The K9 re-circulating chiller with a cooling capacity of 9kW provides reliable precision cooling control with a temperature stability of 0.1°C. The K9 comes in an ultra-compact package with a footprint of only 77cm × 51cm. The K series of chillers covers the range from 0.5kW to 9kW. Applied Thermal Control Ltd., Coalville, Leicestershire, UK, www.app-therm.com.
45nm-capable parametric probe cards
Two new Pyramid parametric probe cards allow single-pass high performance DC and RF measurements and reduce the cost of parametric production test for semiconductors with advanced process nodes at 65nm, 45nm, and beyond. The exclusive Pyramid Plus membrane manufacturing process enables multiple specification improvements such as state-of-the-art leakage performance, to 1fA with a 5-sec. settling time, improved parametric performance, and reliable contact on smaller test pads. The Pyramid probe card technology is unique in its ability to make low-level DC measurements while at the same time facilitating RF measurements in a single solution. Cascade Microtech Inc., Beaverton, OR USA; www.cascademicrotech.com.
Automated characterization suite software
The ACS (Automated Characterization Suite) V3.2 software is for semiconductor test and characterization at the device, wafer, and cassette level. Version 3.2 has multisite parallel test capabilities, results binning for die sort applications, new wafer level plotting capabilities, and support for this company’s new models 2635 and 2636 System SourceMeter instruments with 1fA current measurement resolution. ACS can handle as many as 100,000 die/wafer. Its wafer description utility supports graphical zoom functions to facilitate high die count wafer setups. To further accelerate die sort speeds, ACS supports programmable exit conditions so that when a test indicates a substandard device, the remainder of the tests can be skipped. Keithley Instruments Inc., Cleveland, OH USA; www.keithley.com.
The VHD series anti-backlash assembly is good for eliminating drag and wear associated with high pre-load forces and provides the maximum load-carrying capability and reportedly the highest axial and radial stiffness of any of this company’s nut assemblies. The standard VHD assembly is recommended for dynamic loads up to 350 lbs. Designed for smooth, quiet operation and long life, the VHD assembly provides low drag torque by making use of the patented Kerk axial take-up mechanism, creating a stiff spacer that will continually expand to accommodate the wear which occurs during use. The self-lubricating VHD Series is also instrumental in vibration and noise reduction challenges, as encountered in the semiconductor industry. Leads are available from 1.27mm to 92mm, and lengths are up to 4m. VHD series screws are made of 303 stainless steel. Kerk Motion Products, Hollis, NH USA; www.kerkmotion.com.
Physical design verification product
The Talus QDRC integrates design rule check (DRC) into implementation for 65 and 45/40nm designs and enables physical sign-off-quality DRC to improve productivity and time to market. Prevailing DRC methods require streaming data from an implementation database, resulting in missed errors that require design rework, lengthening the design cycle of today’s complex devices significantly. The Talus QDRC, however, decreases overall design costs by addressing DRC problems before they delay design tapeout. The product is reportedly easy to implement in virtually any existing flow. Magma Design Automation, San Jose, CA USA; www.magma-da.com.
NanoCD Suite for complete OCD
The NanoCD Suite is composed of four key optical critical dimension (OCD) metrology solutions: NanoGen; NanoMatch; NanoStation and NanoDiffract. When NanoCD Suite is combined with the company’s Atlas standalone and 9010 integrated metrology systems, this company can provide a complete OCD solution that can measure and model all 45nm and smaller devices, including scribe line process control targets and advanced die structures, as well as advanced R&D structures for 32nm and 22nm nodes, providing the necessary metrology for critical process control. Beyond traditional scatterometry, metrology, and film analysis, the NanoCD Suite leverages all the data from all process flows and lets the user input that knowledge into the models for accurate and precise structural metrology. The NanoCD Suite can be used to solve critical CD control problems in lithography and etch, as well as demanding next-generation film thickness, CD, erosion, and microstructure control in CVD, CMP, ALD, and epi process modules. Nanometrics, Milpitas, CA USA; www.nanometrics.com.
Copper thickness measurement with temperature compensation
The CMI165 gauge provides temperature-compensated copper thickness measurements in an ergonomic hand-held device. It measures hot or cold Cu on PCBs; reduces waste by eliminating the need for coupons; measures foil or laminated Cu thickness in µm, mils, or oz; sorts Cu by weight at incoming inspection, before drilling, shearing or plating; quantifies Cu thickness after etching or planarizing; and verifies Cu plating thickness on PCB surfaces. Measurements on copper are affected by the temperature of the sample. The CMI165 accounts for temperature in the measurement of thickness, ensuring accurate in-process inspection results regardless of copper temperature. This versatile, portable gauge is equipped with a protective case, and has a rugged and durable design that allows it to be taken into the harshest environments. Oxford Instruments, High Wycombe, UK; www.oxford-instruments.com.
Single-stage rotary vane pumps for low and medium vacuum
HenaLine is a complete line of oil-sealed rotary vane pumps that are suitable for both industrial applications as well as research & development environments. These pumps generate vacuums with pumping speeds of between 25 and 1000m3/hr. They can be employed as either a stand-alone pump or as a backing pump. Used as a backing pump in CombiLine Roots pumping stations, these pumps are ideal for applications in metallurgy, helium leak detection, or vacuum drying and degassing. Their low operating temperature increases the service life of the oil and eliminates the need for additional water cooling for the pump. Oil mist separator, oil return system and safety valves are integrated as standard equipment. They prevent contamination of the ambient air and safeguard both the pump as well as the process system. Moreover, the gas ballast valve assures pump-down of steam and other process vapors. Pfeiffer Vacuum GmbH, Asslar, Germany; www pfeiffer-vacuum.de.
The AXi 940 macro defect inspection module will perform wafer frontside inspection as part of the all-surface Explorer Inspection Cluster, a multisurface inspection system designed to deliver fast, accurate, and reliable macro inspection at a low cost-of-ownership. The AXi 940 is the culmination of over three years of software development and incorporates the technological advantages of both the AXi and Waferview product lines. The AXi 940’s intelligent software reduces the amount of time required for recipe creation by automating many of the tasks and decisions that normally are done by the tool operator. Rudolph Technology, , NJ USA; www.rudolphtech.com.
Single-wafer high current tool
The VIISta HCS is a sixth-generation, single-wafer high current tool for advanced device manufacturers. It builds upon this company’s patented “Dual Magnet Ribbon Beam” architecture. It is designed to deliver superior device performance and yield. The VIISta HCS extends device manufacturers’ capability for both yield and productivity. Varian Semiconductor Equipment Associates Inc., Gloucester, MA USA; www.vsea.com.
Silica contamination standards
The silica contamination standards (SCS) product line is built by depositing highly spherical silica spheres that have well-characterized optical properties and a very tight monodisperse size distribution. The SCS are used to calibrate the latest generation of high-intensity UV inspection tools. Standard particle sizes are 100nm, 126nm, 150nm, and 180nm. Particle sizes down to 50nm are available upon request. The SCS comes in both 200mm and 300mm wafer versions. Silica particles can also be deposited on custom substrates, such as reticles and patterned wafers. All standards come with a NIST-traceable certificate of calibration. VLSI Standards Inc., San Jose, CA USA; www.vlsistandards.com.