Dual-purpose 300mm dicing frame prober
The WDF 12DP is designed to address increased demand for probing ultrathin and diced wafers, and wafer-level testing of chip-scale and wafer-level packaging, stacked, and 3D technologies, as well as KGD testing of ultrathin wafers, singulated wafers, and strips on a dicing frame. It employs on-axis alignment and N-shot alignment, offering “superior” accuracy and the ability to test in parallel. The system can also be used as a standard wafer prober. Tokyo Electron America, Austin, TX; ph 512/424.1000, www.ph.com.
Photomask pattern generator
The FPS5300 is based on Micronic’s pattern generators for display photomasks, adapted for a wide range of sizes and feature resolutions. A new submicron writing level addresses more photomask applications with high resolution and image control. Switching between writing levels is fully automated. In standard configuration, the FPS5300 writes substrates up to 813mm × 813mm; an extended size option increases to 1100mm2. Throughput ranges from 260mm2/min (0.µm minimum lines/spaces, 60nm linewidth uniformity, 200nm overlay) to 12,000mm2/min (6µm lines/spaces, 250nm uniformity, 500nm overlay). Micronic Laser Systems, Täby, Sweden; ph +46/8.638.5200, www.micronic.se.
300mm ALD system
The S300 atomic layer deposition system extends the company’s line of ALD tools to handling substrates up to 300mm in size. Like its predecessors (S100/S200), it offers configurations of up to six precursor lines and a compact ozone generator, with an optional “ALD Booster” for low vapor pressure precursors, higher-temperature ALD valves (>200°C), and up to three gas MFCs. An ALD Shield allows excess reactive vapors to form a film before they make it to the pumping system, thus preventing build-up of deposits on the plumbing and in the pump; the shield’s high-conductance, hot-foil design causes gases to deposit until depleted. Cambridge NanoTech, Cambridge, MA; ph 617/674.8800, www.cambridgenanotech.com.
Thermal control for in-Si analysis
The Allegheny is a moveable diamond heat spreader for delivering precise thermal control. Temperature characterization range is -65°C to +125°C, with the ability to handle devices dissipating >300W without liquid or water cooling. It is compatible with most commercial failure analysis equipment, including emission and laser microscopes, laser voltage probers, and mechanical probers; it can be installed in most state-of-the-art backside in-silicon analysis systems and enables imaging with air-gap and immersion lenses. Presto Engineering, San Jose, CA; ph 408/434.1808, www.presto-eng.com.
Silicon drift detector
The X-Max silicon drift detector provides a large area detector over 10x the solid angle of conventional EDS detectors, translating into 10× faster data gathering and at 10× lower beam currents. Sizes range from 20mm2 up to 80mm2; resolution is down to 123eV with throughput “far in excess” of 100,000 counts/sec. Oxford Instruments, Concord, MA; ph 978/369.9933, www.oxinst.com.
Better adhesion for solar, laser apps
The Sharkskin aims to improve process residue adhesion through highly controlled texturing of ceramic component surfaces, replacing traditional methods of roughening via grit blasting or twin-wire arc sprays. Two-fold adhesion improvement is achieved over arc-plasma -spray ceramic films, at roughnesses up to 1200µ" Ra. Morgan Technical Ceramics, Fairfield, NJ; ph 800/433.0638, www.morganplc.com.