Departments
- Editorial
  - Kudos to Tech Award Laureates
    This month, a group of individuals will receive some well deserved recognition for their work in developing technical solutions that benefit humanity and address the most critical issues facing our planet and its people.
- World News
  - Betting on a 2009 recovery? Not so fast
    Gartner now expects capex to slide even further this year (-25% to $47.1B) and will drop another 13% in 2009 to $41.1B, thanks to a full-on collapse in memory investments and economic pressures on consumer spending habits. Look for a pickup in 2010 (16.7% to $47.9B) and a bigger surge in 2011 (23.1% to $59.0B), and then another downturn in 2012 (-10.5% to $52.8B).
- Tech News
  - Diskcon: HDD litho crossover happening now
    A full-day symposium at this year’s Diskcon USA (Sept. 14-18) explored the lithography implications of sub-ITRS roadmap feature sizes on disk drives, with the challenge that HDD lithography must cost 10× less than NAND flash lithography, the lowest-cost semiconductor process.
  - Slurry reduction is “groovy” at Rohm and Haas
    Rohm and Haas Electronic Materials recently announced CMP pad groove designs that enable defect and slurry reduction.
- Products
  - Featured Products
  - Product News
- Industry Forum
  - To 32nm and beyond: a design-manufacturing symbiosis
    At the 32nm node, technology enablers such as double-patterning, strain enhancement, advanced OPC, etc., require design for manufacturing (DFM) to support a design through manufacturing (D2M) methodology that is correct-by-construction.
Features
- Cover Article
  - Raising the bar on wafer edge yield—an etch perspective
    A variety of plasma techniques have been introduced to manage the unique dielectric and conductor etch challenges encountered at the wafer’s edge, as well as address bevel-clean challenges that impact yield.
- Compound Semiconductors
  - Optical in situ monitoring in LED device production
    The most significant issue in LED MOCVD growth today is precise control of the wafer temperature throughout the whole growth process.
- Parylenes for flexible electronics and display applications
  A chemical vapor deposition (CVD) polymer technology has been developed to use low cost monomers and provide highly crystalline and thermally stable polymer films for the sub-65μm ICs and OLED display applications.

EDITORS' PICKS

LIVE NEWS FEED

USPTO ISSUES TRADEMARK: HARDSILICON

FREESCALE SEMICONDUCTOR REPORTS MULTIPLE TRANSACTIONS BY SENIOR VP CAMPBELL (Bermuda)

ON SEMICONDUCTOR REPORTS DISPOSITION BY SENIOR VP RASHID (Arizona)

VITESSE SEMICONDUCTOR REPORTS ACQUISITION BY DIRECTOR TRAUB (California)

SEMICONDUCTOR ARTICLES

MRAM: Disruptive technology for storage applications

Digi-Key Corporation and MEMSIC announce global distribution agreement

STMicroelectronics proximity sensor solves smartphone hang-ups

Nanoelectronics Conference will focus on semiconductor industry’s future

MORE SEMICONDUCTORS

PACKAGING ARTICLES

MRAM: Disruptive technology for storage applications

STMicroelectronics proximity sensor solves smartphone hang-ups

Broadcom tops three ABI Research wireless connectivity IC competitive assessments

Strategic approach to R&D is goal at National Photonics Initiative Event

MORE PACKAGING

MEMS ARTICLES

Digi-Key Corporation and MEMSIC announce global distribution agreement

STMicroelectronics proximity sensor solves smartphone hang-ups

Nanoelectronics Conference will focus on semiconductor industry’s future

Short-range wireless technology IC market to reach almost 5 billion units shipped in 2013

MORE MEMS

LEDS ARTICLES

Student develops brighter, smarter and more efficient LEDs

AIXTRON sees signs of market stabilization in report of 2012 fiscal year

EPIC to develop industry database and interactive map

Fab Spending Forecast: Equipment spending is expected to remain flat in 2013

MORE LEDS

DISPLAY ARTICLES

EPIC to develop industry database and interactive map

ITO film market undergoing a sea of changes

Corning believes flexible displays with Willow glass are still three years out

Worldwide LED component market grows 9%

MORE DISPLAYS

Topics

LEDS

View Solid State Technology articles by topic, A-Z

VIDEOS

TECHNOLOGY PAPERS

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

Faster Time to Root Cause with Diagnosis-Driven Yield Analysis

This whitepaper describes the benefits of implementing a diagnosis-driven yield analysis flow using the Tessent® Diagnosis and Tessent YieldInsight® software...

More Technology Papers

WEBCASTS

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...

3D and 2.5D Integration: A Status Report Live Event

This webcast will explore the present status of 2.5 and 3D integration, including TSV formation.

More Webcasts

BUYERS GUIDE

Semiconductors

Packaging

MEMS

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Issue 11

Table of Contents

Solid State Technology

Departments

Editorial

World News

Tech News

Products

Industry Forum

Features

Cover Article

Compound Semiconductors

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PACKAGING ARTICLES

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