The SurfScan SP2^XP monitor-wafer defect inspection system incorporates upgrades from the original edge-handling version SurfScan SP2^XP, including improved sensitivity to defects on silicon/poly/metal films and enhanced ability to sort defects by type and size. Specific upgrades include: changes in optomechanics, electronics, and software for a 36% throughput boost; a multichannel architecture to automatically distinguish particles from microscratches, voids, watermarks and other residues; a differential interface contrast channel to capture shallow, flat, and faint defects-of-interest; an extended defect-sizing capability. An ultra-high sensitivity operating mode enhances sensitivity to defects on rough films. KLA-Tencor Corp., Milpitas, CA; ph 408/875.3000, kla-tencor.com.

Integrated solar handling, inspection line

The Solaris solar product line integrates solar wafer cell handling and inspection capabilities within a common application platform. It incorporates advanced vision sensing and inspection technology from LMI Technologies with two of Adept’s robots (Quattro s650 and Cobra s600 SCARA), as well as AdeptSight 2.0 PC-based software. The demo cell also incorporates an LMI high-resolution imaging sensor. Adept Technology Inc., Livermore, CA; ph 925/245.3400, www.adept.com.

Lighter, faster turbopumps

The HiPace turbopumps feature a new rotor design to reduce run-up time by 50% and provide high gas throughput for light (H2, He) and heavy gases (Ar, CF4). An aluminum housing and other materials make the pumps 40% lighter in weight, and doubles the service life to 5 years between bearings changes. Integrated drive electronics reduces the need for cabling. The pumps are available in pumping speeds ranging from 1000-2000 liters/sec. Pfeiffer Vacuum Inc., Nashua, NH; ph 603/578.6500, www.pfeiffer-vacuum.com.

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FPD litho tool

The Model 8700 PanelPrinter step-and-repeat photolithography printer for Gen. 3.5 flat-panel displays features two different lens configurations: a 18709i lens with 2.5µm resolution and 30µm depth-of-focus, and a 18715i lens with 1.5µm resolution ad 9µm DOF. Both feature a 187mm image field diameter and 1.25× magnification ratio. Real-time auto-focus measurement and compensation for focusing is utilized at each exposure site, ensuring CD control across the lens field. A six-degree-of-freedom reticle chuck enables real-time magnification adjustment for highest accuracy in layer-to-layer registration and image field stitching. Azores Corp., Wilmington, MA; ph 978/253.6200, www.azorescorp.com.

Metal-free seal for wet processing

The Turcon Variseal PS PEEK-energized seal offers extremely low leach-out in semiconductor wet processing applications. The construction is all-polymer with no metal components to corrode or contaminate the seal. Cation detection for the Variseal PS is <2000ppb, vs. >18,000ppb for highest-purity grades of FFKMs, the company claims. Operating temperatures range up to 176°F/80°C, with pressures up to 5800psi/400Bar and resistance to “virtually all chemicals.”Sizes available range from 0.020in/3mm to 90in/2.3m for fitting in custom or standard O-Ring grooves. Trelleborg Sealing Solutions, Fort Wayne, IN; ph 260/485.4050, tss.trelleborg.com.