Table of Contents
Solid State Technology
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Features
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Fab Management
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Strategies for energy reduction in semiconductor manufacturing
ISMI’s Environment Safety Health (ESH) Program has undertaken specific projects to demonstrate efficiency and conserve energy in semiconductor manufacturing operations.
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Realizing the 450mm transition
The International SEMATECH Manufacturing Initiative (ISMI) is actively involved in building the foundational infrastructure and coordination of activities to enable a 2012 pilot line target date at the direction of its members.
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A vision for a next-generation 300mm factory
To help meet next-generation factory (NGF) challenges, ISMI has been tasked by its member companies to explore ways in which improvement in cycle time and cost reductions can achieve targets of 50% and 30%, respectively, by 2012.
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Strategies for energy reduction in semiconductor manufacturing
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Software
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EDA interface value proposition
Cycle-time improvements and time-waste reduction are being accomplished by improving equipment setup times and operations.
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EDA interface value proposition
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Metrology
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Reference metrology and standards: staying ahead of the ITRS
The International SEMATECH Manufacturing Initiative’s (ISMI’s) Metrology Program, as a result of its charter to evaluate leading-edge metrology, spends a great deal of time building and evaluating testing structures and techniques.
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Reference metrology and standards: staying ahead of the ITRS
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Redefining semiconductor industry R&D
In 1987, Morris Chang, President of Taiwan’s Industrial Technology Research Institute (ITRI) and a 25-year veteran of Texas Instruments, recognized an opportunity to redefine semiconductor manufacturing.
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Automation
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ISMI targets non-product wafer reduction
The International SEMATECH Manufacturing Initiative (ISMI) has identified the use of non-product wafers (NPWs) as one of the significant costs to the fab.
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ISMI targets non-product wafer reduction
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Departments
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Product News
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Product News
These two tools for wafer edge (E30) and backside inspection (B30) provide improved sensitivity and high throughput for inspection and in-line monitoring of 32nm FEOL and BEOL manufacturing processes.
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Defect-inspection tool for monitor wafers
The SurfScan SP2XP monitor-wafer defect inspection system incorporates upgrades from the original edge-handling version SurfScan SP2XP, including improved sensitivity to defects on silicon/poly/metal films and enhanced ability to sort defects by type and size.
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Product News
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World News
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DRAM, NAND woes seen spilling into 2009
Despite a mild recovery in 2Q08, global DRAM makers are once again building inventories and pulling the rug out from prices, and the buildup will likely push out a full market recovery until the end of next year, according to a new warning by iSuppli.
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DRAM, NAND woes seen spilling into 2009
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Tech News
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MoSi-ing along to 32nm
The chrome material that has blocked the light on binary masks for a generation may finally have outlived its usefulness, according to Franklin Kalk, CTO of Toppan Photomasks, in an exclusive interview with SST.
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MoSi-ing along to 32nm
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Editorial
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Three years, two months to 2012
We’re pleased to be bringing you this special issue, the result of a collaborative effort between ISMI and Solid State Technology, initiated last year.
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Accelerating productivity: key to industry prosperity
ISMI – it’s all about productivity: increasing output and decreasing costs.
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Three years, two months to 2012
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EDITORS' PICKS
TOP BLOG POSTS
Intel Foundries MEMS for Fuel Cell Start-up Nectar
IFTLE 134 SEMI 3D European Summit – Is the Wide IO Driver Dead?
EUV source roadmaps: Physics vs Engineering
Intel details 22nm trigate SoC process at IEDM
IFTLE 128: RTI 3D ASIP Part 1; Lester the Lightbulb update
Questions and answers on FD-SOI
GlobalFoundries takes on Intel with 14nm finFET “eXtreme Mobility” process
LIVE NEWS FEED
RECENT ARTICLES
SEMICONDUCTOR ARTICLES
VIDEOS
NEW PRODUCTS
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Multitest announces ecoAmp for high-power applications
May 8, 2013
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...
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EV Group rolls out EVG120 processing system
May 7, 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...
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Quartz Imaging introduces automated measurement for semiconductor images
April 30, 2013
It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device. |
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Axcelis launches Purion XE high energy implanter
April 30, 2013
Axcelis Technologies, Inc. today announced the introduction of the Purion XE next generation single wafer high energy implanter...
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TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...
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WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
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BUYERS GUIDE
BLOGS
IFTLE 146 TSMC Apple Rumors; Gartner OSAT Mkt Numbers; Novati
Sat May 04 12:01:00 CDT 2013
IFTLE 145 GPU Roadmap, IEEE 3DIC back in SF; ConFab 2013 Pkging
Sun Apr 28 15:23:00 CDT 2013
IFTLE 144 Personnel Changes in Taiwan; Glass Usage in WLP
Sun Apr 21 10:29:00 CDT 2013
IFTLE 143 HMC status; Pkging Materials $$ now Exceed Wafer Fab Materials
Sat Apr 13 17:15:00 CDT 2013
IFTLE 142 GlobalFoundries 2.5 / 3D at 20nm; Intel Haswell GT3; UMC / SCP Prototype Details
Tue Apr 09 16:59:00 CDT 2013
Join The ConFab discussion
Tue Feb 26 11:27:00 CST 2013
Questions and answers on FD-SOI
Fri Jan 04 14:56:00 CST 2013
Present your ideas at The ConFab in 2013
Mon Nov 26 09:04:00 CST 2012
The ConFab 2013 countdown begins
Thu Aug 09 16:18:00 CDT 2012
The ConFab: Big data is here
Sun Jun 03 19:19:00 CDT 2012
Intel Foundries MEMS for Fuel Cell Start-up Nectar
Wed Jan 30 14:40:00 CST 2013
IBM surprises with 22nm details at IEDM
Wed Dec 12 04:00:00 CST 2012
Intel details 22nm trigate SoC process at IEDM
Tue Dec 11 12:23:00 CST 2012
GlobalFoundries takes on Intel with 14nm finFET “eXtreme Mobility” process
Tue Oct 02 16:22:00 CDT 2012
The Elephant Has Left the Room – 450 mm is a Go!
Tue Jul 10 09:35:00 CDT 2012
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05/01/2013
Volume 56, Issue 3
Article Archive for Solid State Technology.