Departments
- Editorial
  - Wanted: Better ways to reward CEOs
    Rising productivity can create prosperity for corporations and individuals. The impact of new technology in boosting productivity was a major contributor to the lengthy economic upturn of the 1990s, according to Alan Greenspan when he was Fed Chairman.
- World News
  - BUSINESS TRENDS
- Technology news
- Emerging Technology
  - High interest in low-end printable electronics
    Discussions of Moore’s Law usually focus on the fastest microprocessors and the highest memory densities.
- TAP
  - Process monitoring methodology using in-line parametric test
    Some of the device defects that are coming to the fore at advanced technology nodes are due to shrinking linewidths that cause greater interaction between device lines.
- FPD
  - Cutting LCD costs with alternative inkjet printing
    An LCD is composed of a number of parts including backlights, polarizers, glass, liquid crystals, and color filters, each of which requires numerous unit processes to manufacture.
- Materials
  - A carbon-restoring silylation process for low-k dielectric repair
    Organo-silicate glass (OSG) based low-k dielectric materials are widely used to minimize resistance-times-capacitance (RC) delays in the BEOL interconnect for <90nm node logic devices.
- Product News
  - PRODUCT NEWS
- Industry Forum
  - It’s harder to refute the benefits of DFM
    As the semiconductor world moves toward 45nm geometries-with 32nm and 22nm processes on the horizon-relying on designers to follow recommended design rules in addition to the standard minimum rules is increasingly less effective for improving yield.
Features
- Gases/Gas Handling
  - Hydrogen bromide cylinder gas ppb-level water vapor measurement
    The measurement of trace water vapor in corrosive gases such as hydrogen bromide (HBr) used in semiconductor manufacturing is essential to maintain process consistency and maximize device yields.
- Etch
  - Extending process flexibility for single-wafer wet etch
    Despite the success of some dry-etching processes, wet etching remains a staple in semiconductor device fabrication, as well as in many other related technologies, such as MEMS and photovoltaics manufacturing.
- Cover Article
  - Precision requirements for advanced HP logic implantation
    Traditionally, an implant process is defined by the implant species’ atomic mass, energy, dose, and angular wafer positioning with respect to the projected beam direction (beamline axis).
- Contamination Control
  - Controlling contaminants with enhanced gas leak detection
    In semiconductor and optoelectronics manufacturing, many hazardous gases are used, such as pyrophoric silane (SiH4) for thin-film deposition, corrosive chlorine (Cl2) for dry-etching, and toxic arsine (AsH3) for ion implantation.
- Materials
  - Tackling power/performance trade-offs with silicon channel engineering
    Since its earliest days in the 1950s, the semiconductor industry has been dependent on silicon technology to meet the price, performance, power, and package demands that have enabled rapid advances in the electronics arena.
- Resists
  - Photoresist production using automated in-line viscosity control
    As the critical dimensions of semiconductor devices continue to get smaller, film thickness control in the photolithography process becomes increasingly important.

EDITORS' PICKS

LIVE NEWS FEED

FREESCALE SEMICONDUCTOR REPORTS ACQUISITION BY SENIOR VP BATES (Bermuda)

FREESCALE SEMICONDUCTOR REPORTS ACQUISITION BY DIRECTOR HENEGHAN (Bermuda)

MAGNACHIP SEMICONDUCTOR REPORTS ACQUISITION BY DIRECTOR NADER (Luxembourg)

MAGNACHIP SEMICONDUCTOR REPORTS ACQUISITION BY DIRECTOR LEE (Luxembourg)

Avago Technologies promotes semiconductor manager to chief operating officer

SEMICONDUCTOR ARTICLES

Implementation of next-generation device technology to be discussed at The ConFab 2013

Gigaphoton starts business operations in Singapore branch

University of Cambridge researchers seek to further reduce cost and improve efficiency with GaN LEDs

ARM and Cadence to partner to implement 64-bit processor on TSMC 16nm FinFET process

MORE SEMICONDUCTORS

PACKAGING ARTICLES

Implementation of next-generation device technology to be discussed at The ConFab 2013

ARM and Cadence to partner to implement 64-bit processor on TSMC 16nm FinFET process

Manchester leads the way in graphene membrane research

How Samsung is climbing the charts

MORE PACKAGING

MEMS ARTICLES

AIXTRON leads workpackage production in Graphene Flagship project

Manchester leads the way in graphene membrane research

How Samsung is climbing the charts

STMicroelectronics heads European research team in advanced MEMS devices development

MORE MEMS

LEDS ARTICLES

University of Cambridge researchers seek to further reduce cost and improve efficiency with GaN LEDs

How Samsung is climbing the charts

Samsung launches Zhaga-compliant LED linear modules with 145lm/W efficacy

Veeco MOCVD chosen for CEA-Leti and Aledia’s new nano-LED venture

MORE LEDS

DISPLAY ARTICLES

Polarizer market to grow to $14 billion by 2016

How Samsung is climbing the charts

Singapore researchers unveil glasses-free 3D display tech

Nanosys expands U.S. manufacturing as demand for displays with lifelike color heats up

MORE DISPLAYS

Topics

LEDS

View Solid State Technology articles by topic, A-Z

VIDEOS

NEW PRODUCTS

	Bruker introduces new AFM semiconductor characterization solution April 4, 2013 Bruker announced today the release of the Dimension Icon SSRM-HR, a new atomic force microscope (AFM) configuration including t...
	Ferrotec Temescal introduces electron beam metallization system April 3, 2013 The Temescal Division of Ferrotec Corporation today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam met...
	ProPlus Design Solutions launches SPICE simulator for giga-scale simulations April 3, 2013 ProPlus Design Solutions, Inc. yesterday launched NanoSpice, the next-generation high-capacity, high-performance parallel SPICE...
	Coherent launches highest power UV laser for microelectronics manufacturing April 1, 2013 The newest AVIA micromachining laser from Coherent, Inc. (Santa Clara, CA) delivers the highest power commercially available at...

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

More Technology Papers

WEBCASTS

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...

More Webcasts

BUYERS GUIDE

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Packaging

MEMS

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Issue 7

Table of Contents

Solid State Technology

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Editorial

World News

Emerging Technology

TAP

FPD

Materials

Product News

Industry Forum

Features

Gases/Gas Handling

Etch

Cover Article

Contamination Control

Materials

Resists

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