Departments
- Editorial
  - Sustaining the innovation agenda
    Despite the compelling agendas put forth in the current adminsitration’s American Competitiveness Initiative, as well as in the National Academies’ Rising Above the Gathering Storm report and the Council on Competitiveness’s Innovate America report, Congress adjourned last year without passing the widely acclaimed National Competitiveness Investment Act of 2006 (NCIA).
- World News
  - Spansion tops Intel in tough NOR flash market
    Market conditions for NOR flash memory weren’t as harsh in 2006 as they were in 2005, but it was still no picnic with ASP getting pummeled, especially in the mobile phone sector, according to data from iSuppli Corp.
- Tech News
  - Double, double, toil and trouble!
    Progress in water immersion exposure technology since last year’s SPIE Advanced Lithography Symposium has been so convincing that its insertion into manufacturing at the 55nm and 45nm generations (as reported by Toshiba, STMicroelectronics, and others) is not likely to be interrupted.
- Photovoltaics
  - Semiconductor processing technologies find a second life in photovoltaics
    More energy from sunlight hits the Earth in just one hour than the vast amount of energy consumed by all humans in an entire year.
- Emerging Technology
  - Re-enabling Moore’s Law with re-engineered gate stacks
    Advanced transistors: Last of three partsAfter years of struggling to delay the inevitable, it is clear that a replacement for the traditional oxide/polysilicon gate stack is needed, and sooner rather than later.
- Fab Management
  - Using wafer success rate metrics for analyzing cycle time
    One of the main contributors to cycle time is the impact of tool-measurement interrupts due to nonoptimal recipe creation.
- TAP
  - IC technologies for mixed-signal and RF SiP
    Today’s analog systems (PCS, Bluetooth, WLAN) have turned to a mixed-signal system-in-package (SiP) that requires specialty foundries providing advanced analog CMOS-based process technologies for better cost, performance, and time to market than a system-on-chip (SoC).
- Product News
  - Product News
- Industry Forum
  - Rethinking the chip industry business model: collaborate or else
    The tectonic plates beneath the semiconductor industry are shifting faster and more extensively than ever before.
Features
- Etch
  - Maximizing power device yield with in situ trench depth measurement
    Many power devices rely on a silicon trench technology for operation. This article discusses the importance of trench depth control, provides examples of various trench etch applications, and evaluates a technique for in situ depth monitoring.
- Lithography
  - Correcting across-chip linewidth variation by mask substrate tuning
    Engineered arrays of micron-sized scattering pixels, written inside the fused silica mask substrate by a femtosecond pulsed laser, can selectively alter the effective illumination locally, correcting for CD variations at the wafer to a fraction of a nanometer.
- DFM
  - Circuit analysis with process variation: a DFM performance metric
    The primary problem with committing to today’s nanometer DFM solutions is the lack of understanding of the net benefit provided by this new generation of EDA tools.
- Photomasks
  - Database inspection of 65nm logic gate CPL masks
    Chrome-less phase lithography (CPL) technology was introduced as a potential strong resolution enhancement technology (RET) for the application to 90 and 65nm node logic gate layers.

EDITORS' PICKS

LIVE NEWS FEED

USPTO ISSUES TRADEMARK: NAGARES

FORM 8-K: ON SEMICONDUCTOR FILES CURRENT REPORT

-ON Semiconductor Completes a Private Exchange for $ 60 Million of its 2.625 Percent Convertible Senior Subordinated Notes Due 2026

Vietnam: Semi- conductor association launched

THE FUTURE OF ORGANIC MATERIALS OANA JURCHESCU MENTORS STUDENTS IN RESEARCHING ORGANIC SEMICONDUCTORS, WHICH COULD LEAD TO HIGH-PERFORMANCE, PLASTIC BASED ELECTRONICS

SEMICONDUCTOR ARTICLES

Imec VP of Process Technology to present on CMOS scaling at The ConFab 2013

SPIE volunteers urge Congress to boost jobs, economy through photonics support

Sidense qualifies 1T-OTP non-volatile memory for MagnaChip 180nm mixed-signal and HV CMOS process

IME to address copper interconnects reliability issues at Copper Wire Consortium

MORE SEMICONDUCTORS

PACKAGING ARTICLES

IME to address copper interconnects reliability issues at Copper Wire Consortium

North American semiconductor equipment industry posts February 2013 book-to-bill ratio of 1.10

Blog: Dimensional scaling and the SRAM bit-cell

InnoLas Semiconductor on course for 450mm

MORE PACKAGING

MEMS ARTICLES

“State of the MEMS Industry” market study to be presented at Smart Systems Integration Conference

ASU scientists develop innovative twists to DNA nanotechnology

SPIE volunteers urge Congress to boost jobs, economy through photonics support

IME to address copper interconnects reliability issues at Copper Wire Consortium

MORE MEMS

LEDS ARTICLES

SPIE volunteers urge Congress to boost jobs, economy through photonics support

Sidense qualifies 1T-OTP non-volatile memory for MagnaChip 180nm mixed-signal and HV CMOS process

North American semiconductor equipment industry posts February 2013 book-to-bill ratio of 1.10

Crystal IS announces record performance from a single chip UVC LED

MORE LEDS

DISPLAY ARTICLES

AMOLED display shipments to grow to 447.7M units in 2017

SPIE volunteers urge Congress to boost jobs, economy through photonics support

North American semiconductor equipment industry posts February 2013 book-to-bill ratio of 1.10

Samsung tops optoelectronics ranking after absorbing LED venture

MORE DISPLAYS

Topics

LEDS

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VIDEOS

NEW PRODUCTS

	PI miCos releases 2-axis precision linear translation stage for surface metrology March 20, 2013 PI miCos announced the release of a new 2-axis precision linear translation stage. The new MCS XY precision linear stage was de...
	Brooks Instrument launches upgrades to thermal mass flow controllers March 18, 2013 Brooks Instrument, a provider of advanced flow, pressure, vacuum and level solutions, has expanded its GF 40/80 Series portfoli...
	Oxford Instruments’ newest tool streamlines batch production for HBLED March 18, 2013 Oxford Instruments Plasma Technology has just announced an evolution in batch etch technology with the launch of the PlasmaPro ...
Nanoplas introduces a new class of dry-etching technology March 14, 2013 Nanoplas, a global supplier of plasma processing equipment to the semiconductor industry, today announced a new dry-etch proces...

TECHNOLOGY PAPERS

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

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WEBCASTS

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...

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Issue 4

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Solid State Technology

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