Table of Contents
Solid State Technology
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Departments
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Online Staff Report
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The ConFab
Speakers discuss how to manage the new economics of chipmaking
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The ConFab
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Editorial
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Seven habits of effective collaborators
Success will be determined by those companies that can collaborate most effectively.
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Seven habits of effective collaborators
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World News
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World News
Citing stronger than expected growth in several key end-markets, notably cell phones, the Semiconductor Industry Association (SIA) has brightened its semiannual forecast for the semiconductor industry.
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World News
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Tech News
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Intel describes CMOS tri-gate integration
Intel Corp. recently presented results of its work with CMOS tri-gate transistors, citing its successful integration of high-k gate dielectrics, metal gate electrodes, and strained silicon to offer considerably lower leakage and consume much less power than today’s planar transistors.
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Intel describes CMOS tri-gate integration
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Solid-state Lighting
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Advances in white LEDs signal a switch to solid-state lighting
Advances in thin-film stacks of inorganic materials, along with improvements in chip-level integration, deposition techniques, and optimized plastic packages, have enabled light-emitting diode (LED) makers to greatly increase luminous efficacy.
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Advances in white LEDs signal a switch to solid-state lighting
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Product News
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Product News
The Sentry Harsh Chemistry Metrology system offers automated real-time, “proactive” analysis to detect metallic and ultimately organic contaminants in harsh chemistries used in semiconductor manufacturing processes.
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Product News
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Industry Forum
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There really is a litho wall
Optical lithography has transcended so many limits set by the promoters of next-generation lithographies that much of the industry acts as if it will live forever.
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There really is a litho wall
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Features
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Cover Article
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Foundry implementation of advanced automated decision-making
AMD has shown in its own fabs that very tight and automated control is essential to manufacture leading-edge products.
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Foundry implementation of advanced automated decision-making
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Etch
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Integrating dual workfunction metal gates in CMOS
As MOSFET scales below 45nm, conventional SiO2 cannot sustain equivalent oxide thickness (EOT) and leakage current requirements set in the International Technology Roadmap for Semiconductors (ITRS), due to the limitation of physical-thickness scaling, and high tunneling current [1].
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Integrating dual workfunction metal gates in CMOS
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Deposition
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Alternatives to low-k nanoporous materials: dielectric air-gap integration
Long considered theoretically possible, air gaps formed within multilevel on-chip interconnect structures are now under serious consideration as a means to lower the k value of intermetal dielectrics (IMD) for future manufacturing nodes.
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Alternatives to low-k nanoporous materials: dielectric air-gap integration
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Materials
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A remote carbon method for fabricating strained SiGeC:B layers
Advanced RF BiCMOS technologies that use NPN heterojunction bipolar transistors (HBT) require the lowest possible base resistance, which is achieved with boron doping.
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A remote carbon method for fabricating strained SiGeC:B layers
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Asia Pacific
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Taiwan
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‘Collaborate and thrive’ model enables fast path to high-volume production
Anticipating high customer demand for its new finer linewidth chips, the Taiwan-based fabless Flash manufacturer, Eon Silicon Solution Inc., asked Dongbu Electronics to be ready to not only drive the shift of its Flash memory designs from the 0.22µm to 0.18µm linewidth, but also achieve a fast ramp to high-volume production.
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‘Collaborate and thrive’ model enables fast path to high-volume production
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General Asia
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Semiconductor industry growth tied to the AP region’s evolution
The Asia-Pacific region has played an integral part in the success of the semiconductor industry for over 35 years, and in turn has been transformed by it.
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Semiconductor industry growth tied to the AP region’s evolution
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TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...
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WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
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BUYERS GUIDE
BLOGS
IFTLE 147 IME Updates 2.5D; Qualcomm Updates 2.5 / 3DIC at ICEP
Mon May 13 10:16:00 CDT 2013
IFTLE 146 TSMC Apple Rumors; Gartner OSAT Mkt Numbers; Novati
Sat May 04 12:01:00 CDT 2013
IFTLE 145 GPU Roadmap, IEEE 3DIC back in SF; ConFab 2013 Pkging
Sun Apr 28 15:23:00 CDT 2013
IFTLE 144 Personnel Changes in Taiwan; Glass Usage in WLP
Sun Apr 21 10:29:00 CDT 2013
IFTLE 143 HMC status; Pkging Materials $$ now Exceed Wafer Fab Materials
Sat Apr 13 17:15:00 CDT 2013
Join The ConFab discussion
Tue Feb 26 11:27:00 CST 2013
Questions and answers on FD-SOI
Fri Jan 04 14:56:00 CST 2013
Present your ideas at The ConFab in 2013
Mon Nov 26 09:04:00 CST 2012
The ConFab 2013 countdown begins
Thu Aug 09 16:18:00 CDT 2012
The ConFab: Big data is here
Sun Jun 03 19:19:00 CDT 2012
Intel Foundries MEMS for Fuel Cell Start-up Nectar
Wed Jan 30 14:40:00 CST 2013
IBM surprises with 22nm details at IEDM
Wed Dec 12 04:00:00 CST 2012
Intel details 22nm trigate SoC process at IEDM
Tue Dec 11 12:23:00 CST 2012
GlobalFoundries takes on Intel with 14nm finFET “eXtreme Mobility” process
Tue Oct 02 16:22:00 CDT 2012
The Elephant Has Left the Room – 450 mm is a Go!
Tue Jul 10 09:35:00 CDT 2012
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LATEST ISSUE
05/01/2013
Volume 56, Issue 3
Article Archive for Solid State Technology.