Departments
- Editorial
  - Chasing rainbows in the Nanoworld?
    Nanotechnology is seen by many as “the next big thing.” It promises many new types of devices and effects that could be used in sensors, displays, light sources, and a host of other applications, in electronics as well as in a wide range of other fields.
- World News
  - World News
    After hitting a low point at the end of 2005, capital equipment investments by semiconductor firms are expected to pick up again in 2006 with 14% growth, nearly twice that of earlier predictions, according to new forecasts from Gartner Inc.
- Tech News
  - IBM constructs IC along single-walled CNT
    IBM researchers have fabricated a CMOS-type ring oscillator circuit entirely on one 18µm-long, single-walled carbon nanotube (SWCNT) using standard semiconductor processes [1], and taking advantage of the CNT¿s long, thin structure.
- Packaging
  - Mapping progress in 3D IC integration
    As the limits to continued CMOS scaling loom larger, system designers are increasingly turning to multichip packages as a means to enhance performance without fitting ever more devices on a single chip.
- Lithography
  - A new ballgame for lithography beyond higher NA
    While the leading lithography equipment suppliers race to achieve systems with higher numerical apertures, they are employing radically different means to achieve their ends.
- Compound Semiconductors
  - Semiconductor applications using >short-pulsed UV lasers
    Excimer and UV diode-pumped solid-state (DPSS) lasers can be used by the semiconductor industry, and others, in applications that cannot be performed by mechanical, chemical, or other laser fabrication methods.
- Flat Panel Displays
  - Handset functionality drives mobile display processes
    Manufacturers of mobile displays are responding to demands from the market for improved features and performance by turning to innovative product design, selection of more suitable materials, and upgrades to process capabilities.
- SEMICON Preview
  - Semicon West 2006
    The 36th annual SEMICON West conference and exhibition will be held in San Francisco again this year with new special areas devoted to solving challenging problems.
- Product News
  - SEMICON West 2006 Product News
    The VB-300 e-beam lithography tool, successor to the VB6-UHR EWF, incorporates a 100kV high-brightness gun and 50MHz/20bit intelligent pattern generator, with field size capability of 1.
- Industry Forum
  - Are “finishing fabs” the answer to 450mm wafers?
    The 2005 International Technology Roadmap for Semiconductors (ITRS, p. 75) has generated a lot of press by designating the 450mm wafer size for production in 2012.
Features
- Cover Article
  - Automated mass spectrometry to detect impurities in harsh acid chemistries
    An automated, in-line mass-spectrometry (ILMS) system using basic time-of-flight principles has been developed that can detect part-per-trillion contamination levels of metals in harsh acid chemistries.
- Interconnects
  - Late-porogen removal integration for ultra-low-keff IMDs
    The value keff has become a valuable metric for evaluating the quality of the final integrated intermetal dielectric (IMD) film stack.
- Metrology
  - Analyzing Si-based structures in 3D with a laser-pulsed local electrode atom probe
    The addition of high-speed laser pulsing and local electrode geometry has transformed the 3D atom probe into a metrology tool that is capable of analyzing Si-based nanostructures on an atom-by-atom basis.
- Lithography
  - Optimizing process window robustness with reconfigurable OPC
    In this work, a reconfigurable optical proximity correction (OPC) approach is taken to enhance process window robustness for sub-100nm designs.
- Wafer Cleaning
  - A high-temperature batch-spray process for implanted resist stripping
    Photoresist stripping in IC manufacturing has become more challenging as the number of photoresist levels has increased, while at the same time allowable material loss and surface damage has decreased.

EDITORS' PICKS

LIVE NEWS FEED

MEMC sees USD 990m in 2013 sales, may rename to SunEdison

-David M. Uze appointed president and representative director of Freescale Semiconductor Korea, Inc.

Philippines: NEDA sees growth of semiconductors exports despite decline

SMIC CEO TY Chiu Re-Elected to GSA Board

-Intersil's ISL6446A Dual PWM/Linear Controller Provides Industry's Most Efficient, Flexible Single-Chip Solution

SEMICONDUCTOR ARTICLES

Yoon-Woo Lee of Samsung Electronics to give keynote address at The ConFab 2013

Intel leads unexpectedly large decline in semiconductor market inventory

EV Group ships 300mm wafer bonding system to leading Chinese semiconductor foundry

Avago MEMS Filter: The highest volume production MEMS using TSV

MORE SEMICONDUCTORS

PACKAGING ARTICLES

Yoon-Woo Lee of Samsung Electronics to give keynote address at The ConFab 2013

Intel leads unexpectedly large decline in semiconductor market inventory

EV Group ships 300mm wafer bonding system to leading Chinese semiconductor foundry

Is the power electronics industry a world apart?

MORE PACKAGING

MEMS ARTICLES

Yoon-Woo Lee of Samsung Electronics to give keynote address at The ConFab 2013

Avago MEMS Filter: The highest volume production MEMS using TSV

ATLIS Semiconductor selected as IBM Microelectronics’ long-term foundry partner for 180nm SOI technology

STMicroelectronics requests ITC investigation of InvenSense

MORE MEMS

LEDS ARTICLES

Yoon-Woo Lee of Samsung Electronics to give keynote address at The ConFab 2013

Cree announces volume production of second generation SiC MOSFET

The UV LED market is booming

Student develops brighter, smarter and more efficient LEDs

MORE LEDS

DISPLAY ARTICLES

Yoon-Woo Lee of Samsung Electronics to give keynote address at The ConFab 2013

Arizona State and PARC produce world’s largest flexible X-ray detector

Printed electronics sector takes hard look at the flexible future

EPIC to develop industry database and interactive map

MORE DISPLAYS

Topics

LEDS

View Solid State Technology articles by topic, A-Z

VIDEOS

NEW PRODUCTS

New Product: Hiden launches integration of on-board timers March 12, 2013 Hiden announced this week the integration of on-board timers for real-time pulsed plasma measurement, the fast gating fully con...
	Signetics introduces an alternative to standard plastic ball grid array packages March 12, 2013 Signetics Corporation today introduced their new MapBGA package to the industry. This alternative to standard PBGA packaging ha...
New products to be presented at Semicon China 2013 March 11, 2013 Heraeus will present numerous product highlights with regard to bonding wires, assembly materials and sputtering targets...
Smart new sensor fusion chip enables mobile devices to operate multiple sensors March 5, 2013 PNI Sensor Corporation and EM Microelectronic -Marin SA announce the introduction of the Sentral sensor fusion hub: a new, high...

TECHNOLOGY PAPERS

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

Faster Time to Root Cause with Diagnosis-Driven Yield Analysis

This whitepaper describes the benefits of implementing a diagnosis-driven yield analysis flow using the Tessent® Diagnosis and Tessent YieldInsight® software...

More Technology Papers

WEBCASTS

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...

3D and 2.5D Integration: A Status Report Live Event

This webcast will explore the present status of 2.5 and 3D integration, including TSV formation.

More Webcasts

BUYERS GUIDE

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Packaging

MEMS

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Issue 6

Table of Contents

Solid State Technology

Departments

Editorial

World News

Tech News

Packaging

Lithography

Compound Semiconductors

Flat Panel Displays

SEMICON Preview

Product News

Industry Forum

Features

Cover Article

Interconnects

Metrology

Lithography

Wafer Cleaning

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MEMS ARTICLES

LEDS ARTICLES

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WEBCASTS

BUYERS GUIDE

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Packaging

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