Departments
- Editorial
  - Resistance at 450mm
    According to the 2005 International Technology Roadmap for Semiconductors (ITRS), the industry should plan on shifting from 300mm to 450mm wafer production by the year 2012.
- News
- DFM
  - Encrypting process information for litho-aware OPC models
    The practice of using design rules to communicate manufacturing capability to the design community failed with the advent of sub-wavelength imaging’s recommended and suggested design rules.
- Nanotechnology
  - Low-power electrical characterization of CNTs and nanoscale devices
    Manufacturers of carbon nanotubes (CNTs) or other low-power nanoscale devices continue to face challenges as potential uses for these devices grow.
- Metrology
  - Improving 300mm wafer yield using x-ray diffraction inspection
    Digital x-ray diffraction inspection of bare and patterned 300mm wafers is challenging conventional semiconductor wafer inspection systems.
- Industry Forum
  - The essentials of single-wafer wet processing: selectivity and partnering
    Chipmakers are migrating to single-wafer tools, driven by the need for highly reliable processes that can meet the stringent performance and throughput requirements of state-of-the-art fabs.
Features
- Cover Article
  - Optimizing SU-8 resist to fabricate micro-metallic structures
    Conventional precision engineering technologies are reaching their limits concerning minimum feature size and precision demands, so alternative technologies, such as LIGA (from the German acronym: lithographie, galvanik, abformung), gain importance [1].
- MEMS
  - MEMS applications using diamond thin films
    Diamond thin film offers advantages over silicon and other thin-film materials used in micro- and nanofabrication.
- Mask Cleaning
  - Removing sub-50nm particles during blank substrate cleaning
    The current International Technology Roadmap for Semiconductors (ITRS) requires that all defects ≥32nm on the EUV mask blank and ≥27nm on EUV substrates (i.e., mask blank before the multilayer [ML] coating) be removed by 2010.
- Next-Generation Processes
  - Implant process modifications for suppressing WPE
    The threshold voltages of CMOS transistors can vary significantly depending on their proximity to an implant well boundary.
- Nanotechnology
  - Creating metal and nonmetal nanosystems using conductive jettable inks
    There is a great deal of interest in the development of ink-jettable systems for RFID tags and other types of interconnection.

EDITORS' PICKS

LIVE NEWS FEED

Fairchild Semiconductor's enhanced Power Supply WebDesigner

US Contract Notice: Department of the Air Force Issues Solicitation for "Semiconductor Research"

NeoPhotonics Acquires the Semiconductor Optical Business Unit of LAPIS Semiconductor

Fairchild Semiconductor Upgrades Power Supply WebDesigner

Worldwide Semiconductor Revenue Declined 2.6 Percent in 2012, According to Final Results by Gartner; Intel Retained the No. 1 Position for the 21st Year in a Row

SEMICONDUCTOR ARTICLES

ARM and Cadence to partner to implement 64-bit processor on TSMC 16nm FinFET process

AIXTRON leads workpackage production in Graphene Flagship project

Manchester leads the way in graphene membrane research

How Samsung is climbing the charts

MORE SEMICONDUCTORS

PACKAGING ARTICLES

ARM and Cadence to partner to implement 64-bit processor on TSMC 16nm FinFET process

Manchester leads the way in graphene membrane research

How Samsung is climbing the charts

Cleanzone 2013 focuses on technology and life sciences

MORE PACKAGING

MEMS ARTICLES

AIXTRON leads workpackage production in Graphene Flagship project

Manchester leads the way in graphene membrane research

How Samsung is climbing the charts

STMicroelectronics heads European research team in advanced MEMS devices development

MORE MEMS

LEDS ARTICLES

How Samsung is climbing the charts

Samsung launches Zhaga-compliant LED linear modules with 145lm/W efficacy

Veeco MOCVD chosen for CEA-Leti and Aledia’s new nano-LED venture

OLEDs and the beginning of the end for LCDs

MORE LEDS

DISPLAY ARTICLES

Polarizer market to grow to $14 billion by 2016

How Samsung is climbing the charts

Singapore researchers unveil glasses-free 3D display tech

Nanosys expands U.S. manufacturing as demand for displays with lifelike color heats up

MORE DISPLAYS

Topics

LEDS

View Solid State Technology articles by topic, A-Z

VIDEOS

NEW PRODUCTS

	Bruker introduces new AFM semiconductor characterization solution April 4, 2013 Bruker announced today the release of the Dimension Icon SSRM-HR, a new atomic force microscope (AFM) configuration including t...
	Ferrotec Temescal introduces electron beam metallization system April 3, 2013 The Temescal Division of Ferrotec Corporation today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam met...
	ProPlus Design Solutions launches SPICE simulator for giga-scale simulations April 3, 2013 ProPlus Design Solutions, Inc. yesterday launched NanoSpice, the next-generation high-capacity, high-performance parallel SPICE...
	Coherent launches highest power UV laser for microelectronics manufacturing April 1, 2013 The newest AVIA micromachining laser from Coherent, Inc. (Santa Clara, CA) delivers the highest power commercially available at...

TECHNOLOGY PAPERS

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

Faster Time to Root Cause with Diagnosis-Driven Yield Analysis

This whitepaper describes the benefits of implementing a diagnosis-driven yield analysis flow using the Tessent® Diagnosis and Tessent YieldInsight® software...

More Technology Papers

WEBCASTS

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...

More Webcasts

BUYERS GUIDE

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Packaging

MEMS

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Issue 4

Table of Contents

Solid State Technology

Departments

Editorial

News

DFM

Nanotechnology

Metrology

Industry Forum

Features

Cover Article

MEMS

Mask Cleaning

Next-Generation Processes

Nanotechnology

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