Table of Contents

Solid State Technology

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  • Departments

    • Editorial

      • MEMS moves to the mainstream
        The MEMS market has long been in a state of extreme fragmentation. Even now, according to a new report from France-based market research and consulting firm Yole Développement, MEMS devices are actively being produced by some 300 companies, 250 of which sell less than $20 million worth of products annually.
    • World News

      • World News
        Worldwide silicon area wafer shipments rose another 4% in 2Q06 vs. the prior quarter to nearly 2000 million sq. inches (MSI), more proof that wafer suppliers are enjoying robust sales and heavy demand.
    • Tech News

      • SEMATECH optimizes the gate stack with dual high-k and metal gate
        At the Symposium on VLSI Technology in June, SEMATECH reported on a new approach it has developed to meet ITRS requirements for low-standby power (LSTP) transistors for the 45nm technology generation.
      • Giving life to self-healing chips: preventing hard silicon failures
        In a bid to enhance the performance of microprocessors, the Semiconductor Research Corp. (SRC) recently said it has a plan to develop self-healing chips-i.e., chips that don’t fail, having been designed to diagnose when components wear out and heal themselves on the fly.
      • "Jumpy" chromophores could enable molecular electronics
        Researchers at the U. of Pennsylvania and St. Josephs U. are touting their work on chromophores, which when linked together enable transfer of electrical charges that exceed mobility in organic semiconductors by up to a factor of three, and hold promise for applications in displays and solar cells.
    • Vacuum Technology

      • Vacuum systems for ALD
        Atomic layer deposition (ALD) processes require vacuum conditions both for proper deposition and adequate purging of precursors from the chamber.
    • Product News

      • Product News
        The IX-250 excimer laser micromachining system is a Class 1 industrial-grade workstation that can accommodate a variety of excimer lasers, offering 12 axes of motion, with 250mm×200mm travel (for processing 150mm wafers).
    • Industry Forum

      • Manufacturing challenges for immersion below 45nm
        With the introduction of the immersion technique into deep-submicron patterning, the semiconductor industry will manage to keep up with the scaling roadmap using refraction-based lithography for another two, hopefully three generations before switching to the most likely successor, extreme ultraviolet (EUV) lithography.
  • Features

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