Table of Contents
Solid State Technology
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Departments
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Editorial
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Nanotech: It’s not a bubble
After the recent dot-com fiasco, it’s no wonder the industry regards with skepticism any claims about a revolutionary technology with limitless growth potential.
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Nanotech: It’s not a bubble
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World News
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Tech News
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Chemicals/Chemical Handling
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Differentiating tools and techniques for liquid flow control
Semiconductor manufacturing has always used aqueous processes. Process control in an aqueous batch tool can often be achieved by controlling reaction temperature and time, assuming proper uniformity within the batch, typically without requiring control over “second- and third-order” parameters such as flow rate and response-time-to-setpoint.
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Differentiating tools and techniques for liquid flow control
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Product News
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Industry Forum
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New tools needed for improving cost-of-ownership
In its listing of the Top Technical Challenges facing the industry in 2006, Sematech recently included several aspects of metrology and fault detection.
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New tools needed for improving cost-of-ownership
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ITRS Special Report
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Emerging Devices
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CMOS future involves new materials and devices
The relentless scaling of CMOS, having paced the microelectronics industry at the speed of Moore’s Law for the past 30 years, is rapidly approaching fundamental limits imposed by discrete atomic dimensions of critical materials and the quantum effects in conventional MOSFET structures.
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CMOS future involves new materials and devices
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Emerging Materials
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Roadmap requirements for emerging materials
A significant section of the ITRS is written by the Starting Materials sub-Technology Working Group.
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Roadmap requirements for emerging materials
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Features
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Materials
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Building engineered substrates for GaN HEMT applications
Compound semiconductors such as gallium arsenide (GaAs) and indium phosphide (InP) are key materials in high-frequency and optoelectronic devices.
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Building engineered substrates for GaN HEMT applications
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Metrology
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Improving statistical validity with Macro CD-SEM imaging
A new image processing technology being added to current-generation CD-SEMs allows CD measurements to be made from multiple features from the same SEM image.
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Improving statistical validity with Macro CD-SEM imaging
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Asia Pacific
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Korea
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Using the same line for processing Cu and Al
Aluminum has served as an excellent interconnect metal for 40 years, but its limitations become evident at chip geometries in the sub-0.18μm range.
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Using the same line for processing Cu and Al
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China/Singapore
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How the road to Singapore accelerated manufacturing in China
With China offering the semiconductor industry new levels of manufacturing cost efficiencies and strong domestic market growth opportunities, many integrated device manufacturers (IDM), material suppliers, and chip-packaging equipment companies are moving operations to the Chinese mainland at unprecedented rates.
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How the road to Singapore accelerated manufacturing in China
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EDITORS' PICKS
TOP BLOG POSTS
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LIVE NEWS FEED
RECENT ARTICLES
SEMICONDUCTOR ARTICLES
MEMS ARTICLES
DISPLAY ARTICLES
VIDEOS
NEW PRODUCTS
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COMSOL Multiphysics 4.3b offers new additions to simulation platform
May 16, 2013
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...
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Spectra-Physics introduces industrial picosecond laser
May 10, 2013
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...
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Multitest announces ecoAmp for high-power applications
May 8, 2013
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...
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EV Group rolls out EVG120 processing system
May 7, 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...
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TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...
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WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
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BUYERS GUIDE
BLOGS
Join The ConFab discussion
02/26/2013
Questions and answers on FD-SOI
01/04/2013
Present your ideas at The ConFab in 2013
11/26/2012
The ConFab 2013 countdown begins
08/09/2012
The ConFab: Big data is here
06/03/2012
IBM surprises with 22nm details at IEDM
12/12/2012
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LATEST ISSUE
05/01/2013
Volume 56, Issue 3
Article Archive for Solid State Technology.