Table of Contents
Solid State Technology
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Departments
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Editorial
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Golden Years or Golden Age?
A familiar refrain from market analysts these days is that the semiconductor industry has “matured.”
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Golden Years or Golden Age?
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World News
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Tech News
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Emerging Technology
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Patterning neurons-on-chip devices using microcontact printing
Growing neurons on a chip surface holds great promise for brain research. Recently, a printing technique was developed that allows alignment and combination of different chemical patterns on a chip surface, which can be used to control the position of the neuron on top of the transducers.
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Patterning neurons-on-chip devices using microcontact printing
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Compound Semiconductors
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Using AFM to enhance MOCVD-grown OE devices
Metal-organic chemical-vapor deposition (MOCVD) has steadily progressed from small-scale materials research to a mass production technology, enabling such complex optoelectronic (OE) devices as laser diodes and ultrahigh-brightness light-emitting diodes (UHB-LED).
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Using AFM to enhance MOCVD-grown OE devices
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DFM
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Semiconductor suppliers turn to DFM at nanometer nodes
Design decisions made early in IC development can either complicate or alleviate a growing number of manufacturing challenges in advanced process technologies as feature sizes shrink well below 130nm.
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Semiconductor suppliers turn to DFM at nanometer nodes
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Products
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Top Products of 2005
Following are the Top Products of 2005 in semiconductor/thin-film processing as selected by Solid State Technology’s editorial advisory board, chosen from those featured each month in Product News.
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Top Products of 2005
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Industry Forum
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Local collaboration required for global nanotech competitiveness
Developers of nanotechnology are facing a conundrum. On one hand, new nanotechnology-based products have been produced and commercialized, yet on the other hand, the understanding of the underlying properties of nanoscale structures and materials is still in many areas at a fundamental level.
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Local collaboration required for global nanotech competitiveness
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Features
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Photomasks
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An in-process strategy for defect-free CPL masks
The masks required for chromeless phase lithography can be successfully inspected for transparent defects and repaired by existing technology.
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An in-process strategy for defect-free CPL masks
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Software
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Using DFM hot-spot analysis for predicting resist patterns
As process tolerances decrease, significant yield losses are observed specifically due to differences between the design layout and how the resist actually prints on the wafer.
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Using DFM hot-spot analysis for predicting resist patterns
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Waste/Effluent Handling
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Preventive maintenance measures for contamination control
High concentrations of corrosive and toxic gases can be emitted from metal etch chambers and downstream pipelines during preventive maintenance.
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Preventive maintenance measures for contamination control
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Lithography
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Advanced prototyping using step-and-flash imprint
Developments in step-and-flash imprint lithography have enabled the support of advanced device and process prototyping with mix-and-match overlay capability compatible with photolithography tools.
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Advanced prototyping using step-and-flash imprint
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EDITORS' PICKS
TOP BLOG POSTS
Intel Foundries MEMS for Fuel Cell Start-up Nectar
IFTLE 134 SEMI 3D European Summit – Is the Wide IO Driver Dead?
EUV source roadmaps: Physics vs Engineering
Intel details 22nm trigate SoC process at IEDM
IFTLE 128: RTI 3D ASIP Part 1; Lester the Lightbulb update
Questions and answers on FD-SOI
GlobalFoundries takes on Intel with 14nm finFET “eXtreme Mobility” process
LIVE NEWS FEED
RECENT ARTICLES
SEMICONDUCTOR ARTICLES
PACKAGING ARTICLES
MEMS ARTICLES
LEDS ARTICLES
DISPLAY ARTICLES
VIDEOS
NEW PRODUCTS
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3M announces QDEF; to bring 50% more color to LCD devices
May 21, 2013
3M announced today it is in the final stages of scale-up for its new 3M Quantum Dot Enhancement Film (QDEF). The new film allow...
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COMSOL Multiphysics 4.3b offers new additions to simulation platform
May 16, 2013
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...
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Spectra-Physics introduces industrial picosecond laser
May 10, 2013
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...
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Multitest announces ecoAmp for high-power applications
May 8, 2013
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...
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TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...
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WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
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BUYERS GUIDE
BLOGS
Tackling Design for Yield Questions at DAC
05/22/2013
Join The ConFab discussion
02/26/2013
Questions and answers on FD-SOI
01/04/2013
Present your ideas at The ConFab in 2013
11/26/2012
The ConFab 2013 countdown begins
08/09/2012
IBM surprises with 22nm details at IEDM
12/12/2012
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LATEST ISSUE
05/01/2013
Volume 56, Issue 3
Article Archive for Solid State Technology.