Departments
- Editorial
  - The future of energy
    Is the world running out of oil? Will there be enough fuel available as China and India rapidly industrialize?
- Tech News
  - Technology News
    Scientists have been trying to get an organic compound that emits a stable blue light with a lifetime that exceeds the previously thought 1000 hr lifetime barrier ever since Shuji Nakamura’s invention of the first inorganic blue LED in the mid-90s.
- Flat Panel Displays
  - Consumer economics drive FPD manufacturing strategies
    The challenge in discussing flat-panel displays (FPD) is that they are both a technology and an application.
- Product News
  - Product News
- Industry Forum
  - Reaching 45nm requires an accelerated flow of innovation
    If the industry is to reach the 45nm node by decade’s end, it will be due, in large part, to a continuing acceleration of the flow of innovation, mostly from the bottom up.
Low-κ Special Report
- Interconnect
  - 45nm node integration of low-k and ULK porous dielectrics
    As the semiconductor industry approaches the 45nm process-technology node, the capacitance of the copper interconnect must be reduced to lower the RC delay and increase chip performance.
- Copper / Low-κ
  - Analyzing damage from ultralow-k CMP
    Introduction of porous ultralow-k (ULK) materials poses challenges, such as poor mechanical properties due to porosity, that affect all unit processes, including CMP.
- Etch
  - Controlling porous low-k damage with decoupled plasma etching
    One of the key challenges in backend integration is damage to the low-k dielectric during etch/ash processes.
Features
- Gases/Gas Handling
  - Fluorine plasma chemistry for high-AR dielectric etching
    As device sizes continue to shrink, anisotropic dielectric etching faces a daunting list of challenges that include etch selectivity, etch uniformity, aspect-ratio dependent etching, and etch stop.
- Contamination Control
  - Using ‘statistical dashboards’ to automate particle and yield analysis
    In semiconductor fabrication, optimized control over hundreds of process steps and multiple equipment sets is essential to achieving high yields in volume manufacturing.
Special Section: Asia Pacific - Japan
- Features
  - Japan ramps up for high-volume SOI-based manufacturing
    The silicon-on-insulator (SOI) revolution that was first launched in Japan more than 25 years ago is returning home.
  - What’s driving outsourced assembly and test in Japan
    Successful suppliers to the semiconductor industry must acknowledge the importance of Japan in semiconductor manufacturing.

EDITORS' PICKS

LIVE NEWS FEED

NANOMETRICS REPORTS DISPOSITION BY CHIEF FINANCIAL OFFICER KISLING (California)

FREESCALE SEMICONDUCTOR REPORTS MULTIPLE TRANSACTIONS BY SENIOR VP CAMPBELL (Bermuda)

ON Semiconductor introduces new family of tunable RF components

VITESSE SEMICONDUCTOR: Incurs $5.03-Mil. Net Loss in Q1 2013

Digital Television Semiconductor Market Dips In 2012 As TV Sales Stall

SEMICONDUCTOR ARTICLES

President of IC Insights, Inc. to discuss the “new” IC industry cycle at The ConFab 2013

Mentor Graphics User Conference 2013 to feature former TSMC CTO

$14 trillion opportunity in Internet of Things, predicts Cisco

OneChip announces partnerships and plans to expand into the DCI and PON markets

MORE SEMICONDUCTORS

PACKAGING ARTICLES

President of IC Insights, Inc. to discuss the “new” IC industry cycle at The ConFab 2013

PCB growth rate to slow to 2.7% in 2013

$14 trillion opportunity in Internet of Things, predicts Cisco

OneChip announces partnerships and plans to expand into the DCI and PON markets

MORE PACKAGING

MEMS ARTICLES

KIT researchers develop smallest vibration sensor in the quantum world

$14 trillion opportunity in Internet of Things, predicts Cisco

Imec to offer fully integrated silicon photonics platform in a multi-project wafer service

Seven opto-sensor-discrete products achieved record sales in 2012

MORE MEMS

LEDS ARTICLES

Seven opto-sensor-discrete products achieved record sales in 2012

Yoon-Woo Lee of Samsung Electronics to give keynote address at The ConFab 2013

Cree announces volume production of second generation SiC MOSFET

The UV LED market is booming

MORE LEDS

DISPLAY ARTICLES

4Kx2K LCD TV panel shipments expected to reach 2.5M in 2013

Yoon-Woo Lee of Samsung Electronics to give keynote address at The ConFab 2013

Arizona State and PARC produce world’s largest flexible X-ray detector

Printed electronics sector takes hard look at the flexible future

MORE DISPLAYS

Topics

LEDS

View Solid State Technology articles by topic, A-Z

VIDEOS

NEW PRODUCTS

Nanoplas introduces a new class of dry-etching technology March 14, 2013 Nanoplas, a global supplier of plasma processing equipment to the semiconductor industry, today announced a new dry-etch proces...
New Product: Hiden launches integration of on-board timers March 12, 2013 Hiden announced this week the integration of on-board timers for real-time pulsed plasma measurement, the fast gating fully con...
	Signetics introduces an alternative to standard plastic ball grid array packages March 12, 2013 Signetics Corporation today introduced their new MapBGA package to the industry. This alternative to standard PBGA packaging ha...
New products to be presented at Semicon China 2013 March 11, 2013 Heraeus will present numerous product highlights with regard to bonding wires, assembly materials and sputtering targets...

TECHNOLOGY PAPERS

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

Faster Time to Root Cause with Diagnosis-Driven Yield Analysis

This whitepaper describes the benefits of implementing a diagnosis-driven yield analysis flow using the Tessent® Diagnosis and Tessent YieldInsight® software...

More Technology Papers

WEBCASTS

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...

3D and 2.5D Integration: A Status Report Live Event

This webcast will explore the present status of 2.5 and 3D integration, including TSV formation.

More Webcasts

BUYERS GUIDE

Semiconductors

Packaging

MEMS

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Issue 11

Table of Contents

Solid State Technology

Departments

Editorial

Tech News

Flat Panel Displays

Product News

Industry Forum

Low-κ Special Report

Interconnect

Copper / Low-κ

Etch

Features

Gases/Gas Handling

Contamination Control

Special Section: Asia Pacific - Japan

Features

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EDITORS' PICKS

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LIVE NEWS FEED

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SEMICONDUCTOR ARTICLES

PACKAGING ARTICLES

MEMS ARTICLES

LEDS ARTICLES

DISPLAY ARTICLES

Topics

VIDEOS

NEW PRODUCTS

TECHNOLOGY PAPERS

WEBCASTS

BUYERS GUIDE

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Packaging

MEMS

BLOGS

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