Wafer inspection and defect review
This system allows an automated approach to patterned wafer inspection for process diagnostics of 300-mm processing tools. Defect review is possible at high magnifications and in various imaging modes, including confocal. The instrument includes two SEMI E 15.1 load ports, a robotic 300-mm wafer handler on a linear track, and a wafer pre-aligner. All components are software-controlled by a Windows-based operating system. Leica Microsystems Inc., Deerfield, IL; ph 847/405-7026, fax 847/405-0030, e-mail firstname.lastname@example.org, www.leica-microsystems.com.