Failure analysis/quality control
Plasmalab?Etch - a fully integrated, software-controlled, dual-mode platform for use with full wafers (up to 200 mm) or packaged chips - allows the choice of etching in PE mode or in RIE mode. This makes possible very low-damage isotropic passivation etching followed by an anisotropic intermetal dielectric or interlayer dielectric etching, without the need to break vacuum or use two separate process chambers. Switching is carried out via software control and requires no physical changes to the process chamber, so full de-processing can be carried out as part of a multistep automatic process recipe (e.g., Step 1, PE mode; Steps 2 and 3, RIE mode). Oxford Instruments Plasma Technology, Bristol, UK; ph 44/1934-833851, fax 44/1934-834918.