Packaging technology book
This book titled Roadmaps of Packaging Technology covers basic to state-of-the-art packaging technologies, including BGAs, chip-scale packages, flip chip, MCMs, chip on board, fine-line substrates, build-up multilayer boards, thin-film substrates, heat pipes, switching noise, transmission lines, interconnect density, solder joint reliability, 3-D packaging, cryogenic processors, and quantum computing. The source also provides a complete explanation of terms and technologies, maps out future technology and related applications, and gives an overview of the industry and its drivers. ISBN 1-877750-61-1. Price: Book or CD-ROM, $850. Integrated Circuit Engineering (ICE), Scottsdale, AZ; ph 602/368-8260, fax 602/948-1925, e-mail email@example.com, www.ice-corp.com/ice.