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Presure Transducer
Model 214 is an ultrahigh-purity pressure transducer that is bakeable to 125?C without affecting calibration and is mass spectrometer helium leak tested to 1 ? 10-10 atm.cc/sec. It is virtually EMI/RFI immune, available with a full scale output of 4-20 mA and 0.2-5.2 Vdc, offers ?0.25% FS accuracy, and measures pressure ranges from 0-50 to 0-3000 psig, as well as -14.7-50 to -14.7 to 3000 psig. Setra Systems Inc., Boxborough, MA; ph 800/257-3872, fax 508/264-0292, e-mail sales@setra.com.
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gas detection ad monitoring
The GM-V series and GM-PL series use advanced sensor technology to offer real-time diagnostics and fully integrated alarm and control capabilities. The systems can detect combustible and toxic gases in concentrations as low as 10 ppb. Sensors are stable and have a high threshold to poisoning. Nine sensing technologies are integrated into the system to provide chemical monitoring at various concentrations, depending on the application. GM series diagnostics continuously monitor sensors, suction p
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Simultaneous Purge/isolation valve
EZ Valve 1400 is designed to allow continuous, uninterrupted closed-loop flow of fluid/gas from a source, while isolating and purging fluid/gas from the lines and components on the load side. The valve is installed between the source and load lines. The pneumatic control box is then used to switch between normal, bypass, and purge modes. This design reduces or eliminates downtime associated with the disconnection of the cooling/heating lines typically found in most etch, sputter, and CVD equipme
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Flow Switch
The 125-T all-Teflon flow switch, designed for gases and liquids, operates best where the normal flow to set point ratio is =10:1. When no flow is present, a free magnetic piston is suspended in the upper portion of the valve bore due to magnetic repulsion between the lower fixed magnet and the piston. As soon as flow is established, the piston is displaced downward and actuates the reed switch at set point. Set point is adjustable. Flow range is 30-16,000 cc/m air, or 1-500 cc/m water; repeatab
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Thermal Mass Flow Controller
The Sierra 800 series capillary tube-type thermal mass flow meter and controller, suitable for use with all clean gases, measures and controls in flow ranges from 10 sccm to 2000 slpm. The straight sensor is designed to resist clogging and contamination. Instrument advantages include accuracy from 1 to 1.5% of full scale; fast response of 1 sec to within 2% of final flow with no overshoot or undershoot; and repeatability of -0.15%. Sierra Instruments Inc., Monterey, CA; ph 800/866-0200, fax 408/
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Thin Film stres tool
Model 214 is an ultrahigh-purity pressure transducer that is bakeable to 125?C without affecting calibration and is mass spectrometer helium leak tested to 1 ? 10-10 atm.cc/sec. It is virtually EMI/RFI immune, available with a full scale output of 4-20 mA and 0.2-5.2 Vdc, offers ?0.25% FS accuracy, and measures pressure ranges from 0-50 to 0-3000 psig, as well as -14.7-50 to -14.7 to 3000 psig. Setra Systems Inc., Boxborough, MA; ph 800/257-3872, fax 508/264-0292, e-mail sales@setra.com.
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Scanning Electron microscopes
The S-4700 FE SEM and the S-3500N Variable Pressure SEM incorporate high-density frame memories with maximum pixel counts of 2560 ? 1920. Both instruments include Rapid Image Shift Movement capability for fast, accurate navigation around the specimen. The S-4700`s objective lens contributes to superior resolution (25? at 1 kV), which is maintained
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Optical Wafer and Die inspection System
Post probe/2nd optical inspection is currently performed manually at microscope-based review stations, where operators make a pass/fail decision that can be slow and inconsistent. The NSX-80 inspection tool performs automated post probe/2nd optical wafer and die inspection, giving fast, accurate results. Automated inspection can lead to higher yields through automated data collection and reporting, wafer mapping and identification, and complete integration with the automated manufacturing proces
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300-mm Wafer Edge Profile Comparator
Model 102C edge profile comparator allows nondestructive inspection of 300-mm wafer edge profiles. Control of edge contour can greatly reduce chipping and fracture, slip generation in furnace processes, particle generation, epitaxial edge crown, and photoresist edge bead. A correct edge profile improves gripping of the wafer in many handling processes, especially RTP and ion implantation. The 102C creates a shadow profile image, magnifies it 100 times, and displays it on a 12-in. monitor. Precis
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Plug-and-pump Turbopump
Model 102C edge profile comparator allows nondestructive inspection of 300-mm wafer edge profiles. Control of edge contour can greatly reduce chipping and fracture, slip generation in furnace processes, particle generation, epitaxial edge crown, and photoresist edge bead. A correct edge profile improves gripping of the wafer in many handling processes, especially RTP and ion implantation. The 102C creates a shadow profile image, magnifies it 100 times, and displays it on a 12-in. monitor. Precis
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In-line carrier lifetime Measurement
The Turbo-V141 Navigator is a fully integrated, turbomolecular vacuum pumping system that combines the pump, electronics, and cooling fan into a single unit. The result is a compact tool that is easily integrated into vacuum systems. Only one connection point is required, further easing integration and reducing installation costs. An enhanced version of the MacroTorr pump provides Navigator with high throughput capacity and high inlet pressure (>10-3 mbar); a high compression ratio for light gas
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CO2 Blasting
The JANUS 300 is a fully automatic carrier lifetime measuring system for processing 300-mm wafers, using the ?-PCD technique. Designed for Class 1 cleanroom environments with robotic cassette-to-cassette handling, the system is best suited to metal contamination control in thermal or plasma processes. JANUS features the use of the low injection level technique for lifetime measurements, giving accurate, high-resolution mapping of iron and other metal contaminants in a short space of time. Amecon
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Post-ash reducer
The BMC200 chemical vapor sensor provides real-time measurement of airborne chemical concentrations. It contains a silicon MEMS chip (approx. 0.5 cm2) that detects vapor-induced mass changes in an absorbent polymer film. The benchtop electronic unit powers the sensor chip and transmits sensor data to a PC running Windows. Berkeley MicroInstruments, Richmond, CA; ph 510/231-5710, fax 510/231-5711, e-mail info@BerkeleyMicro.com, www.BerkeleyMicro.com.
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Extended range of silicon wafers
ST-200 is an inorganic stripper that removes high-density, post-ash plasma etch residues. It removes residues containing oxides and fluorides of aluminum and/or titanium from sub-0.5-?m vias and metal lines at low processing temperatures, without corrosion of aluminum/copper, 100% copper, titanium, titanium/tungsten, titanium nitride, or silicon oxide films. ST-200 contains no SARA-reportable components and no hydroxylamine, catechol, phenol, or chlorinated hydrocarbons. It is formulated to oper
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BGA Die Bonder
These Cz-silicon wafers include prime polished, double-side polished, and epitaxial wafers with orientations of 1-0-0 and 1-1-1. Also, an optional polyback and/or LTO seal can be provided. Substrate dopants include boron, phosphorous, antimony, and arsenic (resistivity 0.001 to 100 Ohmcm). The epi layers are produced with single-wafer reactors with As, P, and B as dopants. Okmetic Ltd., Espoo, Finland; ph 358/9502-800, fax 358/9502-80300.
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UV Curing Systems
Model 2007 BGA`s clamp feeder system is driven by linear motor technology that ensures accurate leadframe transportation. Vision systems measure the real bond pad position and provide high bond accuracy. A fully programmable dispenser system, using a true volumetric piston pump, provides control of bond line thickness and die tilt. An integrated quality control system automatically controls bond quality, and the flexible wafer handler allows the use of wafer sizes up to 8 in., with a fast exchan
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Dry Process silicon dicing
Models UH101 and UH201 UV curing systems provide a highly controlled environment to ensure uniform exposure of wafers up to 200 mm in diameter. The UV adhesion reducing curing process offers several improvements over traditional irradiation methods; these include easier post-saw die removal
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RTP System
The eXtended Test Station (XTS) tests devices of up to 576 I/O pins at speeds up to 200 MHz. Testers in the XTS series support mix-and-match of parallel, scan, and memory test modules within a single system. The XTS also provides DC Parametric measurements and is expandable for mixed-signal and MCM testing. Additional features of the XTS FT include odd and fractional clocks up to 400 MHz. Flex Time architecture provides timing-on-the-fly control of the delay, period, and individual sub-cycles. I
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Instrumented wafers
Starfire is a 200-mm-wafer rapid thermal processing (RTP) system designed for 0.18-?m production applications. System features include: open architecture to allow future process integration; throughput approaching 80 wafers/hour; atmospheric wafer transfer; a Brooks Automation wafer-handling platform and robotics; MESC-compatible interface; uniform/repeatable processing, independent of wafer backside emissivity; purged wafer I/O loadlocks; and NO, N2O process capability. AG Associates, San Jose,
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Small-footprint Furnace
Process Probe 1840 instrumented silicon wafers, with up to 31 integrated resistance temperature detectors, measure wafer process temperatures from 0-230?C to <0.1?C absolute accuracy, and uniformities to <0.05?C point-to-point precision at the wafer, in situ, under process conditions. Developed for DUV chemically amplified resist processes, they also meet the needs of i-line lithography and high-temperature wafer processing. By measuring wafer temperature directly, in situ, the influences of exh
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Argon Ion Lasers
The PEO-603 is a small-batch production furnace that is suitable for all thermal processes up to 1100?C, including LPCVD. The ultraclean, hermetically sealed quartz tube (9 in. dia, 16 in. depth) accepts up to 50 eight-in. wafers and allows vacuum down to 10-6 torr, as well as programmable injection of up to six process gases, controlled by flowmeters or mass flow controllers. The furnace has fast response, due to its very low thermal mass and IR heating, with ramp up/down better than 100?C/min.
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Step-and-Repeat Scanning stepper
This line of CE certified Omnichrome argon ion lasers is suitable for semiconductor applications. The air-cooled lasers feature internal mirror construction for ultimate long-term beam and power stability, with long lifetime reliability. At 14 in. long, they are well-suited to space-limited OEM systems. A selection of beam delivery systems is available, with single- or multiline output from 455 to 514 nm. Melles Griot Laser Group, Carlsbad, CA; ph 760/438-2131, fax 760/438-5208, e-mail sales@car
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Pattern Generation tool
The NSR-S202A step-and-repeat scanning stepper is designed for the mass-production of 256-Mbit DRAMs. Based on a KrF excimer laser (248 nm) exposure light source, it provides a resolution of 0.25 ?m or better, uses a wide exposure area of 25 ? 33 mm, and incorporates an air-bearing stage for increased throughput and reduced lens distortion values. Nikon Precision Inc., Belmont, CA; ph 415/882-9494.
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Global Positioning robot
The MEBES 4500S 0.25-?m pattern generation tool creates four levels of gray by making four passes over the substrate with a writing address that is four times the size of the data address. This allows placement of edges at the original design address. In addition to higher throughput for small addresses, the Multipass Gray writing strategy improves print quality by reducing errors through multipass averaging, and delivers a higher (8 ?C/cm2) dose to support high-contrast processes. A robotic loa
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Spin Coater
This global positioning robot (GPR) system enables the transport robot to interact compliantly with misaligned cassettes and process modules, as well as deliver deflection compensation, even during transport. The system is a six degrees of freedom, servo-controlled robot that dynamically eliminates the alignment variance between the transported material and the workstations. The yaw-axis feature of the GPR enables the robot to replace track systems in the in-line equipment layout, reducing the c
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High-Purity ammonia
Model P6712 is a programmable desktop spin coating system for the application of photoresists, polyimides, metallo-organics, dopants, silica films, and most organic and aqueous solutions. The system executes one of three fully automated, user-determined coating sequences under the supervision of a programmable logic controller. Each recipe consists of multiple ramp up, hold, and ramp down steps in the range 500-8000 rpm. Acceleration and deceleration rates are computer-calculated, based on the d
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Dissolved ozone analyzer
The Model dFFOZ sensor module provides continuous, in-line measurement of ozone over the concentration range 0-100 milligrams/liter in a full-flow recirculating
