Testing and failure analysis proceedings
This volume contains the proceedings from the 23rd International Symposium on Testing and Failure Analysis held October 27-31, 1997, in Santa Clara, CA. More than 50 papers by authors from around the world examine such topics as the tools and techniques that provide the basis for characterizing microelectronic devices; the latest advances in failure analysis; fault isolation techniques; and diagnostic and screening tests for discrete components, ICs, and microelectronic systems. ISBN 0-87170-619-9. Order number: 2023NR. Price: $99, $79.20 (ASM member). ASM Member Services Center, Materials Park, OH; ph 440/338-5151 ext 5900, fax 440/338-4634, e-mail memserv@po.asm-intl.org.
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