STMicroelectronics proximity sensor solves smartphone hang-ups

03/08/2013

Smartphones are set to become even more flexible and more satisfying to use, thanks to a unique sensor system developed by STMicroelectronics. Combining three optical elements in a single compact package, the VL6180 is the first member of ST’s FlightSense family and uses a new optical-sensing technology that reduces the incidence of dropped calls and enables innovative new user interactions with smartphones.

The VL6180 uses a ground-breaking proximity measuring technology to offer unprecedented accuracy and reliability in calculating the distance between the smartphone and the user. Instead of estimating distance by measuring the amount of light reflected back from the object, which is significantly influenced by color and surface, the sensor precisely measures the time the light takes to travel to the nearest object and reflect back to the sensor. This “Time-of-Flight” approach ignores the amount of light reflected back and only considers the time for the light to make the return journey.

"This marks the first time that Time-of-Flight technology has been made available in a form factor small enough to integrate into the most space-constrained smartphones,” said Arnaud Laflaquière, General Manager of ST’s Imaging Division. “This technology breakthrough brings a major performance enhancement over existing proximity sensors, solving the face hang-up issues of current smartphone and also enabling new innovative ways for users to interact with their devices."

The key to ST’s patented new solution is an infra-red emitter that sends out light pulses, an ultra-fast light detector that picks up the reflected  pulses, and electronic circuitry that accurately measures the time difference between the emission of a pulse and the detection of its reflection.

Combining electronic, optical and packaging unique expertise from across the company, the VL6180 embeds both a robust ranging time-of-flight sensor and a wide dynamic ambient light sensor die, along with an infra-red emitter. Thanks to its all-in-one, ready- to-use architecture, the VL6180 is easy to integrate and saves the phone-makers long and costly optical and mechanical design optimizations.

Addressing dropped calls is not the only benefit that ST’s new technology brings to the smartphone market.  The ability to measure a reliable absolute distance from the phone to a hand or other object opens up new user interaction scenarios that phone manufacturers and app developers can rapidly exploit.

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. 


VIDEOS

Electroiq 2 EIQ2

NEW PRODUCTS

Picosun’s 300mm ALD cluster tools selected for new memory applications

April 10, 2013 Picosun Oy, an Atomic Layer Deposition (ALD) equipment manufacturer, reports that its PICOPLATFORM 300 ALD cluster tool has bee...

Bruker introduces new AFM semiconductor characterization solution

April 4, 2013 Bruker announced today the release of the Dimension Icon SSRM-HR, a new atomic force microscope (AFM) configuration including t...

Ferrotec Temescal introduces electron beam metallization system

April 3, 2013 The Temescal Division of Ferrotec Corporation today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam met...

ProPlus Design Solutions launches SPICE simulator for giga-scale simulations

April 3, 2013 ProPlus Design Solutions, Inc. yesterday launched NanoSpice, the next-generation high-capacity, high-performance parallel SPICE...

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...

WEBCASTS

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...

Join The ConFab discussion

Tue Feb 26 11:27:00 CST 2013

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012

The ConFab: Big data is here

Sun Jun 03 19:19:00 CDT 2012

SUBSCRIBE

LATEST ISSUE

Volume 56, Issue 2

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS