Signetics Corporation today introduced their new MapBGA package to the industry. This alternative to standard PBGA packaging has improved reliability and design flexibility due to its unique assembly process. A one shot side gate map molding process is used to cover the entire substrate area, protecting the active traces and vias. This process allows for more efficient use of the substrate panels and strips with as much as 55% more units per panel verses a typical PBGA package. The process is very robust as it uses proven transfer molding equipment and the mold clamps only touch the non-active area of each strip. Also, the assembled devices are saw singulated, eliminating mechanical stress on the package from traditional punch methods of singulation. Finally, the map molding process allows the package to have a larger mold cap and in turn, accommodate a larger die.
"Mature packages such as the PBGA must continue to evolve to meet the changing demands of applications", stated YS Kim, vice president of engineering at Signetics. "The MapBGA package is able to provide that extra amount of design flexibility and reliability using proven assembly technologies and equipment to make it a cost effective alternative to standard PBGA," continued Kim.
Signetics offers a broad range of ball grid array (BGA) packaging including flip chip, stacked die, multi-chip and thermally enhanced variations. Assembly partnerships with Tier 1 device manufacturers has helped drive Signetics to continue to develop these next generation BGA packages to create a dynamic portfolio of semiconductor assembly solutions.
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