ISMI to partner with Araca

02/06/2013

SEMATECH announced today that Araca Inc., a leading provider of products and services for chemical mechanical planarization (CMP) research and development, and the International SEMATECH Manufacturing Initiative (ISMI) are partnering to deliver CMP processing and productivity solutions to help chip manufacturers increase yields, reduce equipment downtime and lower consumables costs.

“Leading-edge device designs and materials are introducing more complexity into planarization processing for manufacturers. This is increasing wafer costs and impacting die yields,” said Dr. Ara Philipossian, president and founder of Araca, Inc. "Partnering with ISMI allows us to validate our CMP Slurry Injector System (SIS-x) and other innovations in high-volume manufacturing facilities across the industry. This technical collaboration with the industry’s leading device manufacturers is vital to our success as we develop and commercialize high-performing and cost-effective CMP solutions.”

As a part of ISMI’s Manufacturing Technology program, Araca and ISMI will evaluate Araca’s CMP SIS-x system on varying consumable set-ups on select types of CMP equipment at ISMI members’ manufacturing locations to help increase removal rates while reducing polishing defects and slurry consumption for CMP processes.

“Cost and productivity are major obstacles in CMP, in addition to eliminating process variables that arise from equipment generated variation. While this applies equally to new and legacy processes, this is especially true for sub-20 nm high-volume manufacturing,” said Boyd Finlay, ISMI project manager.

ISMI is working cooperatively with the semiconductor industry to provide solutions to common high-volume productivity and cost detractors. ISMI’s Manufacturing Technology Program leads various equipment productivity improvement projects including CVD/PVD/etch particle elimination, CVD pump failures and chamber dusting prevention, electrostatic chuck cost-of -ownership, equipment variation and control, and defect source and root cause analysis.

ISMI also provides industry leadership through the ESH Technology Center, focusing on sustainability and green initiatives, addressing regulatory issues, and resource conservation in manufacturing operations.

ISMI membership is open to all semiconductor manufacturers and suppliers. ISMI and its members collaborate with a broad network of companies, consortia, universities, national laboratories, and associations from around the world to tackle manufacturing and ESH technology challenges.

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.


VIDEOS

Electroiq 2 EIQ2

NEW PRODUCTS

Picosun’s 300mm ALD cluster tools selected for new memory applications

April 10, 2013 Picosun Oy, an Atomic Layer Deposition (ALD) equipment manufacturer, reports that its PICOPLATFORM 300 ALD cluster tool has bee...

Bruker introduces new AFM semiconductor characterization solution

April 4, 2013 Bruker announced today the release of the Dimension Icon SSRM-HR, a new atomic force microscope (AFM) configuration including t...

Ferrotec Temescal introduces electron beam metallization system

April 3, 2013 The Temescal Division of Ferrotec Corporation today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam met...

ProPlus Design Solutions launches SPICE simulator for giga-scale simulations

April 3, 2013 ProPlus Design Solutions, Inc. yesterday launched NanoSpice, the next-generation high-capacity, high-performance parallel SPICE...

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...

WEBCASTS

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...

Join The ConFab discussion

Tue Feb 26 11:27:00 CST 2013

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012

The ConFab: Big data is here

Sun Jun 03 19:19:00 CDT 2012

SUBSCRIBE

LATEST ISSUE

Volume 56, Issue 2

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS