Engineers at University of Buffalo develop hyperbolic metamaterial waveguide

02/14/2013

University at Buffalo engineers have created a more efficient way to catch rainbows, an advancement in photonics that could lead to technological breakthroughs in solar energy, stealth technology and other areas of research.

University of Buffalo engineerQiaoqiang Gan, PhD, an assistant professor of electrical engineering at UB, and a team of graduate students described their work in a paper called “Rainbow Trapping in Hyperbolic Metamaterial Waveguide,” published Feb. 13 in the online journal Scientific Reports.

They developed a “hyperbolic metamaterial waveguide,” which is essentially an advanced microchip made of alternate ultra-thin films of metal and semiconductors and/or insulators. The waveguide halts and ultimately absorbs each frequency of light, at slightly different places in a vertical direction, to catch a “rainbow” of wavelengths.

Gan is a researcher within UB’s new Center of Excellence in Materials Informatics. 

“Electromagnetic absorbers have been studied for many years, especially for military radar systems,” Gan said. “Right now, researchers are developing compact light absorbers based on optically thick semiconductors or carbon nanotubes. However, it is still challenging to realize the perfect absorber in ultra-thin films with tunable absorption band.

“We are developing ultra-thin films that will slow the light and therefore allow much more efficient absorption, which will address the long existing challenge.”

In their initial attempts to slow light, researchers relied upon cryogenic gases. But because cryogenic gases are very cold – roughly 240 degrees below zero Fahrenheit – they are difficult to work with outside a laboratory.

Before joining UB, Gan helped pioneer a way to slow light without cryogenic gases. He and other researchers at Lehigh University made nano-scale-sized grooves in metallic surfaces at different depths, a process that altered the optical properties of the metal. While the grooves worked, they had limitations. For example, the energy of the incident light cannot be transferred onto the metal surface efficiently, which hampered its use for practical applications, Gan said.

The hyperbolic metamaterial waveguide solves that problem because it is a large area of patterned film that can collect the incident light efficiently. It is referred to as an artificial medium with subwavelength features whose frequency surface is hyperboloid, which allows it to capture a wide range of wavelengths in different frequencies including visible, near-infrared, mid-infrared, terahertz and microwaves.

It could lead to advancements in an array of fields.

For example, in electronics there is a phenomenon known as crosstalk, in which a signal transmitted on one circuit or channel creates an undesired effect in another circuit or channel. The on-chip absorber could potentially prevent this.

The on-chip absorber may also be applied to solar panels and other energy-harvesting devices. It could be especially useful in mid-infrared spectral regions as thermal absorber for devices that recycle heat after sundown, Gan said.

Technology such as the Stealth bomber involves materials that make planes, ships and other devices invisible to radar, infrared, sonar and other detection methods. Because the on-chip absorber has the potential to absorb different wavelengths at a multitude of frequencies, it could be useful as a stealth coating material.

Additional authors of the paper include Haifeng Hu, Dengxin Ji, Xie Zeng and Kai Liu, all PhD candidates in UB’s Department of Electrical Engineering. The work was sponsored by the National Science Foundation and UB’s electrical engineering department.

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.


VIDEOS

Electroiq 2 EIQ2

NEW PRODUCTS

Picosun’s 300mm ALD cluster tools selected for new memory applications

April 10, 2013 Picosun Oy, an Atomic Layer Deposition (ALD) equipment manufacturer, reports that its PICOPLATFORM 300 ALD cluster tool has bee...

Bruker introduces new AFM semiconductor characterization solution

April 4, 2013 Bruker announced today the release of the Dimension Icon SSRM-HR, a new atomic force microscope (AFM) configuration including t...

Ferrotec Temescal introduces electron beam metallization system

April 3, 2013 The Temescal Division of Ferrotec Corporation today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam met...

ProPlus Design Solutions launches SPICE simulator for giga-scale simulations

April 3, 2013 ProPlus Design Solutions, Inc. yesterday launched NanoSpice, the next-generation high-capacity, high-performance parallel SPICE...

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...

WEBCASTS

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...

Join The ConFab discussion

Tue Feb 26 11:27:00 CST 2013

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012

The ConFab: Big data is here

Sun Jun 03 19:19:00 CDT 2012

SUBSCRIBE

LATEST ISSUE

Volume 56, Issue 2

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS